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MRSI Systems received the 2021 CIOE Silver Award for the MRSI-HVM Die Bonder

MRSI Systems won the China Optoelectronics Expo Award (CIOE Award) for the latest MRSI-HVM 1.5 micron series of products.

12 OCT 2021
21:00
NEWS
DIE BONDING SOLUTIONS

The MRSI-HVM with conveyor is an outstanding innovation, widely used in optoelectronic production, specifically the production of high-density and high-speed data center optical interconnection and backbone network transmission using 400G+ photoelectric devices, as well as 5G wireless applications using complex TO-based TOSA/ROSA devices containing DFB/WDM/EMLs. The new and innovative MRSI-HVM 1.5 micron series provides the best automated manufacturing solution for high-mix and high-volume optoelectronic production, in the era of data center / 5G, and brings the best return on investment for optoelectronic and high-power laser device manufacturing customers.

CIOE Award

“China Optoelectronic Expo Award” is proposed by the organizing committee of China International Optoelectronic Expo (CIOE), approved by the presidium of CIOE, and chosen at the special meeting of the Evaluation Expert Committee, with new optoelectronic products and new technologies as the theme of product technology achievement award. After three rounds of expert panel reviews and another round of review by the presidium, 37 of the 97 candidate projects were selected. Finally, 34 projects participated in the on-site review of “China Optoelectronic Expo Award” held in Bao’An New Exhibition Hall on 15th September 2021.

After this extensive evaluation by the committee, MRSI was awarded the prestigious silver medal and certificate.


CIOE Award Presentation

On- site judging

CIOE Award

On-site awards

CIOE Award