MRSI to present at Automotive LIDAR 2021

MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23rd, 2021. MRSI is presenting on Wednesday, September 22nd and Thursday, September 23rd. See the conference agenda for more details. Visit MRSI’s virtual booth to discuss your production requirements.

Dr. Limin Zhou will be presenting “Die Bonding Process Solutions in Automotive LIDAR Volume Manufacturing.” His presentation will highlight the emergence of the autonomous driving investment boom, and why the industry pays more and more attention to vehicle safety and connectivity. The demand for automotive lidar in ADAS applications is growing at a CAGR in excess of 100%, and will increase even further as the price drops significantly. New technology will cause automotive Lidar packages to become smaller and thinner and their precision and quality will become the focus of all lidar suppliers and OEM. Highly-flexible, high-precision and highly-reliable automated production equipment will be the essential requirements of a manufacturing solution for automotive lidar in the future. The Mycronic Group recognizes these needs and is providing comprehensive and automatic active and passive coupling package assembling solutions, to enable the automatic assembly of laser chips, lens, fiber arrays, etc. for automotive lidars.

Irving Wang will be presenting “Assembly Challenges and Solutions for Photonics Devices in Automotive LIDAR.” He will introduce various MRSI Mycronic’s solutions for the Lidar market.

Mycronic’s Global Technologies Division is the leading manufacturer of assembly automation systems servicing the electronics and photonics industry within niche markets. These systems deliver ultra-high precision, high flexibility, and have the capacity to meet the needs of our customers across the complete spectrum of production volume. 

MRSI Systems (Mycronic Group), is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, optical transceivers, LIDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging.

This year’s Conference will include LIDAR focused workshops, and presentations on the following topics:

• Fabrication, packaging, and system assembly techniques
• Impacts of enabling technologies such as artificial intelligence
• LIDAR data fusion with other types of sensors such as radar and camera
• Notable academic research related to LIDAR for automotive applications
• Supply chain trends and challenges
• State-of-the-art LIDAR technologies

MRSI’s Solutions for LIDAR Applications

MRSI packages the core laser engine parts for LIDAR. Whether the laser engine is based upon large VCSEL array or high-power edge emitting lasers, MRSI provides the best-in-class solutions. Techniques include high placement precision, co-planarity assembly, bonder line thickness control, and delicate force control for fragile III-V laser materials (for R&D and volume production). The lasers can be bonded to all types of carrier materials such as ceramic, metal, and printed circuit board. They use eutectic reflow bonding, thermal epoxy stamping or dispensing, and in-situ UV curing. Our engineering and field applications teams are highly experienced with advanced packaging processes. They will ensure the systems are properly supported for your specific application requirements.

Contact us with your requirements today or to schedule a meeting at the conference.