SEMICON West 2018 – MRSI Systems’ Advanced Packaging Solutions
All major optical communication component manufacturers, data center transceiver suppliers, optical network technology groups and, in general, the world of photonics packaging have been facing an enormous generational challenge.
Driven by the huge growth of internet traffic and bandwidth demand, the photonics packaging world has seen a dramatic upswing in their customer’s needs for photonic devices. But if was just a volume problem that might be manageable; but, it’s not. These customers are often building hyper-scale data centers at short notice and because of the demands on data communications, storage and processing, the photonic devices such as optical transceivers must adhere to demanding performance requirements around high speed, high precision and high flexibility.
MRSI Systems offers a variety of die bonding and dispensing solutions that can meet the demands of building photonic components. Visit MRSI Systems at SEMICON West and we will discuss how our die bonding and epoxy dispense solutions may fulfill your manufacturing needs. For example, transceiver applications need a scalable solution such as the MRSI-M3 die bonder. The MRSI-M3, 3-micron epoxy and eutectic die bonder, is ideally suited for dedicated high volume production requirements, yet flexible enough for small lot production. The die bonder’s key features include a large configurable work area, delicate force control, advanced machine vision, programmable multi-color lighting and automatic tool changing. Our skilled Customer Support Team with optical manufacturing experience will ensure the die bonders are properly supported for your specific application requirements.
Learn more about scaling with MRSI Systems. Photonics high volume manufacturing needs high speed equipment to be flexible and accurate. MRSI-HVM3’s speed is the fastest in class for photonic CoC HVM, without sacrificing precision or flexibility, realized by optimizing assembly steps with “On-the-fly” tool change, parallel material handling and final bonding steps using dual heads gantries and stages, and ultrafast temperature ramping and cooling of eutectic hot stages.
MRSI Systems will be exhibiting at SEMICON West (Booth #6364) at the Moscone Center in San Francisco, CA from July 10-12, 2018. SEMICON West features over 600 exhibitors, 25,000 attendees from 36 countries, including the entire extended electronics supply chain from flexible hybrid electronics to MEMS and sensors. Key sessions include: Innovations in MEMS & Sensor-based Products, Big Data & the Internet of Things, and Data and AI, and more. Visit the MRSI booth to discuss your application needs and how MRSI’s eutectic and epoxy die bonders are ideally suited for high volume advanced packaging.