The Japanese version of MRSI’s article “Die-bonder innovations target HPLD manufacturing challenges” is now available
MRSI’s article in Laser Focus World’s February 2020 Issue “Die-bonder innovations target HPLD manufacturing challenges” discusses the die bonding challenges of High-power laser diodes (HPLDs) packaging manufacturing and presents an innovative flexible solution for both chip and bar on submount without changeover.
The paper presents all of the key challenges of packaging technology in HPLD manufacturing, and puts forward specific innovative automation solutions to these challenges. The feasibility of these innovative solutions is verified by experiments on MRSI-H-LD equipment. These results demonstrate how the unique MRSI flexible solution addresses all of the HPLD die bonding process challenges. The unique combination of features of MRSI-H-LD provides a complete die bonding solution for the high-volume and high-mix HPLD packaging production.
Read the Japanese version of the article. HPLD製造の課題を解決する、革新的なダイボンダ
Contact MRSI to learn more about our die bonding innovations for HPLD manufacturing.
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