The Versatile MRSI-HVM
2021 was a great year for our best-selling product, the MRSI-HVM 1.5 micron high-speed die bonder. This system meets the needs of many industries from telecom, datacom and medical devices manufacturers to most commercial sectors. We have built up a considerable case file on customers achieving attractive ROIs from the MRSI-HVM when building high-volume products.
Key Benefits of the MRSI-HVM 1.5 Micron Die Bonder
- Dual gantry/head design for industry leading high speed for high volume manufacturing
- High accuracy to optimize yield and achieve high density packaging
- Industry leading high flexibility for true multi-die multi-process production
Learn more about the MRSI-HVM die bonder and download the brochure.
MRSI-HVM with Conveyor for Epoxy Die Bonding Application
The MRSI-HVM variant catering primarily to the high-precision epoxy die bonding application, configured with a conveyor, has experienced increasing demand from the datacom and advanced sensor markets. We continue to outperform the competition by consistently being among the quickest in order delivery in the industry.
MRSI Systems
MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging.
Contact us to learn more about our industry leading die bonders.