MRSI introduces 705HF High Force Die Bonder for power devices and advanced chip packaging
MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high force die bonder, a new variant of the proven MRSI-705 platform.
The MRSI-705HF is equipped with a heated bond head that can apply up to 500N of force during the bonding process, while providing heating up to 400°C from the top. It is the ideal tool for advanced applications such as sintering for power semiconductors and thermocompression bonding for IC packaging. Sintering is a heat-treatment process that gives greater strength, integrity, and conductivity to the bond and is considered the most reliable technology for connecting components in power electronics. Thermocompression bonding is a technique that uses high temperature and pressure to create strong and reliable interconnections between dies and substrates.
The MRSI-705HF inherits the flexibility and robustness of the MRSI-705 platform, which can handle multiple die and process applications with auto-tool changing and laser soldering, eutectic with top and bottom heating, epoxy stamping, and dispensing in one machine.
“We are proud to announce the new MRSI-705HF high force die bonder as part of our efforts to continuously innovate and help our customers meet the changing needs of the market. It will allow us to better serve customers in power devices and advanced packaging applications” said Dr. Irving Wang, Director of Marketing, MRSI Systems.
For more information about MRSI Systems and the MRSI-705HF high force die bonder, please visit www.mrsisystems.com or contact sales.mrsi@mycronic.com.
For additional information, please contact:
Dr. Irving Wang
Director of Marketing, MRSI Systems, Mycronic Group
Tel: +1 (978) 667 9449
E-mail: irving.wang@mycronic.com
About MRSI Systems
MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, 3-D hybrid packaging, and optical imaging products. With 35+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com