MRSI launches new die bonders with improved accuracy
MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems is proud to announce the introduction of the MRSI-HVM1 and MRSI-H1 die bonders with 1µm machine accuracy.
The new products, MRSI-H1 and MRSI-HVM1, have been developed from our popular MRSI-H/MRSI-HVM platforms, further improving accuracy to 1 micron level and providing ideal solutions for the increasingly demanding applications such as mass manufacturing of silicon photonics and LIDAR. The MRSI-H1 and MRSI-HVM1 will be available in the Q4, 2022. MRSI’s die bonding solutions help our customers to enable just-in-time supply and fast-pace innovations of critical components for high-growth market segments.
These products inherit the MRSI tradition of combining accuracy, speed and flexibility to reduce NPI cost, improve production agility and hence increase return-of-investment for customers. They also come with MRSI’s long proven product reliability and global customer support.
“We are proud to announce the 1µm new die bonders MRSI-H1 and MRSI-HVM1 as part of our efforts to continuously innovate and improve our products to help our customers meet the markets’ demands,” said Dr. Irving Wang, Director of Product Marketing, MRSI Systems.
Contact
For additional information, please contact:
Irving Wang
Director of Product Marketing, MRSI Systems, Mycronic Group
Tel: +1 (978) 667 9449
E-mail: irving.wang@mycronic.com
Jennifer Russo
Marketing Manager, MRSI Systems, Mycronic Group
Tel: +1 (978) 495 9731
E-mail: jennifer.russo@mycronic.com
About MRSI Systems
MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com