MRSI Mycronic announces advanced high-speed 1µm die bonder MRSI-LEAP for ultra-high-volume manufacturing of AI optical module applications
MRSI Mycronic is proud to announce the launch of the MRSI-LEAP high-speed 1µm die bonder. This innovative equipment is designed for ultra-high-volume manufacturing of optical modules, including Chip-on-Carrier (CoC), Chip-on-Submount (CoS), and Chip-on-Board (CoB) assemblies utilizing epoxy processes.
The MRSI-LEAP high-speed 1µm die bonder boasts a range of innovative features that make it an essential tool for ultra-high-volume manufacturing. It offers unparalleled efficiency with exceptional precision <±1µm @ 3σ ensuring long-term stability and high precision in true 24/7 die bonding applications to support ultra-high volume driven by AI.
The machine supports multiple forms of inputs, including wafer, waffle pack, and Gel-Pak®, as well as customized fixtures. And it also has an automatic tool changing function to handle different die sizes. Additionally, it features a high throughput capacity with a conveyor designed for a single fixture or multiple cassette inputs, capable of automatically transporting large carriers of dies for Active Optical Cable (AOC), CoB, gold-box packaging, and CoC assemblies in fixtures.
Advanced process options such as flip-chip bonding, UV epoxy dispensing, in-situ UV curing, and wafer-level packaging are also available, making the MRSI-LEAP a versatile and powerful solution for various manufacturing needs.
”To meet the increasing demand of unprecedented high volume manufacturing for high-speed optical modules in AI, we are pleased to introduce the MRSI-LEAP high-speed 1µm die bonding machine. This new product significantly improves production efficiency while maintaining ultra-high precision, greatly enhancing the return on investment for customers. MRSI takes pride in its commitment to continuous innovation to bring value to customers," said Dr. Yi Qian, Mycronic Group VP & MRSI Systems General Manager.
For additional information, please contact:
Dr. Limin Zhou
General Manager, MRSI Automation (Shenzhen) Co., Ltd., Senior Director of Strategic Marketing, MRSI Systems
Tel: +86 135 0289 9401
E-mail: limin.zhou@mycronic.com
About MRSI Systems
MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, 3-D hybrid packaging, and optical imaging products. With 40+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mycronic.com
About Mycronic
Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Mexico, the Netherlands, Singapore, South Korea, United Kingdom, the United States and Vietnam. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com