MRSI to exhibit with live demonstrations and present at LASER World of PHOTONICS CHINA
We are pleased to announce that MRSI, Mycronic Group will be exhibiting at LASER World of PHOTONICS CHINA and will present at the LaserFocusCon laser technology and application seminar.
MRSI will exhibit at LASER World of PHOTONICS CHINA from July 11-13, 2023, in Hall 7, Booth #7.1B141 of the National Exhibition and Convention Center (Shanghai), in Shanghai, China. We will showcase our family of die bonders and the latest product releases, targeting fast-growing markets such as aerospace & defense, medical, datacom, and emerging technologies, e.g. high performance laser diodes and LiDAR. Using case studies across many markets, we will discuss how our decades-long commitment of delivering innovative solutions precisely addresses our customers’ requirements for reliability, speed, flexibility, and precision.
MRSI will provide product demos of the MRSI-H-HPLD+ 1.5 micron die bonder, which is the latest advancement in the MRSI-H/HVM series product line. This new variant of the successful MRSI-H-HPLD, tailored for high-power laser die attachment applications, significantly improves the throughput by using parallel processing while maintaining high accuracy and flexibility.
Dr. Limin Zhou, General Manager, MRSI Automation (Shenzhen) Co., Ltd., Senior Director of Strategic Marketing, MRSI Systems, will present “Laser Chip Assembly Technologies and Trends in the AI Era” at the LaserFocusCon laser technology and application seminar during LASER World of PHOTONICS CHINA.
For additional information, please contact:
Dr. Limin Zhou
General Manager, MRSI Automation (Shenzhen) Co., Ltd., Senior Director of Strategic Marketing, MRSI Systems
Tel: +86 135 0289 9401
E-mail: limin.zhou@mycronic.com
About MRSI Systems
MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, 3-D hybrid packaging, and optical imaging products. With 35+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com