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18 JUN 2024, 14:00
NEWS
DIE BONDING SOLUTIONS

In the bustling world of technology, May was a month marked by significant events, and MRSI was at the forefront. With appearances at IMAPS New England in Boxborough, MA, and the 2024 Semiconductor Advanced Technology Innovation Development and Opportunities Conference in Suzhou, China, we showcased our advanced technology.

At the International Microelectronics Assembly and Packaging Society (IMAPS) New England Symposium and Expo, Peter Cronin, Sales Director North America, took the stage to present “Packaging Tools for Heterogeneous Integration” as part of the Photonics Packaging session. Participating in discussions with our customers, we not only imparted our expertise but also gained insight into cutting-edge applications such as chiplet packaging.

Across the Pacific in Suzhou, China, Dr. Limin Zhou, General Manager of MRSI Automation (Shenzhen) Co., Ltd., and Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group), captured the audience’s attention with his presentation on “Empowering the Photonics Industry with Generative AI” at the 2024 SAT Con Suzhou Conference. With over a thousand participants and featuring over 60 significant presentations, the conference was a testament to the dynamism of the semiconductor industry. At the heart of it all, MRSI stood out, showcasing its innovative solutions and tangible outcomes for AI transceivers.

These events not only provided a platform for MRSI to exhibit its cutting-edge technology but also served as forums for collaboration, learning, and networking. We look forward to future opportunities to serve our customers and continue driving innovation forward.

Stay tuned as we continue to push boundaries, redefine possibilities, and bring tomorrow’s electronics to life.