Newsletters archive

2019 

Volume LIII

• MRSI Is Moving to Our New State-of-the-Art Facility
• Customer Support and Training Programs
• Trade Show News
• Blog Insights

Volume LII

• Visit MRSI at Productronica
• Trade Show News
• Blog Insights

Volume LI

• Automotive LIDAR Conference and Exhibition 2019
• MRSI to Sponsor and Exhibit at the 2019 International Symposium on Microelectronics
• CIOE and Infostone Conference – Announcement of the Latest Advancement in the 1.5 Micron MRSI-H/HVM-series Product Line
• Blog Insights

Volume L

• MRSI to Present at 18th ICCSZ OC Market and Technology Seminar and Offer Die Bonder Demonstrations at CIOE
• Visit MRSI at CIOE
• MRSI Systems Welcomes Hendry He as China Country Sales Director
• Blog Insights

Volume XLIX

• Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility
• Trade Show News
• Blog Insights

Volume XLVIII

• Flexible Automation Solutions to Accelerate LiDAR Automotive Applications
• Trade Show News
• Blog Insights

Volume XLVII

• Visit MRSI at IMS in Boston
• Trade Show News
• Blog Insights

Volume XLVI

• IMAPS New England 
• Trade Show News
• Blog Insights

Volume XLV

• Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors
• Trade Show News
• Blog Insights

Volume XLIV

• Visit MRSI Systems at OFC in San Diego
• Trade Show News
• Blog Insights

Volume XLIII

• MRSI-H3LD for High Power Laser Diodes
• Trade Show News
• Blog Insights

2018 

Volume XLII

• Holiday Greetings from MRSI Systems
• Trade Show News
• Blog Insights

Volume XLI

• MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China
• Customer Support
• Trade Show News
• Blog Insights

Volume XL

• MRSI-HVM3 Family Expansion
• MRSI-H3 High Speed Die Bonder Video
• Trade Show News
• Blog Insights

Volume XXXIX

• Manufacturing Automation Case Study-Flexible High-Speed Die Bonding Automation Platform 
• Trade Show News
• Blog Insights

Volume XXXVIII

• MRSI Systems – “One Stop Shop” Product Demo at CIOE
• Laser Focus World: Challenges for photonics manufacturing in the new data center era
• Trade Show News

Volume XXXVII

• MRSI Systems is Acquired by Mycronic AB
• Trade Show News
• Blog Insights

Volume XXXVI

• Challenges in Die Bonding of Gallium Nitride High Power Devices
• Customer Support and Training Programs
• Scale with Us
• Trade Show News
• Blog Insights

Volume XXXV

• Building Complex Hybrid Circuits-Advanced Packaging
• Trade Show News
• Blog Insights

Volume XXXIV

• MRSI Systems Launches New Software Video Training Programs
• Trade Show News – Visit MRSI at OFC in San Diego March 11-15
• MRSI-M3 Epoxy Stamping Video
• Blog Highlights

Volume XXXIII

• New Product Spotlight MRSI-HVM3
• New Website Process Pages
• Trade Show News – Visit MRSI at OFC in San Diego March 11-15
• Webinar New Insights – Watch the MRSI Webinar: The Challenges in High Volume Manufacturing of
  Photonic Devices for Data Center Applications

Volume XXXII

• MRSI Systems – IEEE Tech Insider Webinar January 25th: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications
• High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions – Chinese Version
• MRSI Systems’ Story
• Visit MRSI in San Francisco – SPIE Photonics West
• MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry

2017

Volume XXXI

• Best Holiday Wishes from MRSI Systems
• Watch the MRSI-705, 5 Micron Die Bonder Video
• MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry

Volume XXX

• MRSI Systems Receives Funding from State of Massachusetts for Advanced Manufacturing Initiative 
• High Volume Manufacturing of Photonic Devices: Assembly Starts with Design
• MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry

Volume XXIX

• Assembly Solutions
• Visit MRSI Systems at Productronica in Munich, Germany
• MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry

Volume XXVIII

• MRSI is Sponsoring IMAPS 2017 — Raleigh, IMAPS 50th Anniversary Symposium
• Visit MRSI at Productronica
• CIOE – Big Success with Introduction of MRSI-HVM3

Volume XXVII

• MRSI to Exhibit at CIOE
• Upcoming Events: ECOC, Sweden, September 18-20 and Electronics Packaging Symposium, NY, September 19-20

Volume XXVI

• Read our Latest Article in Chip Scale Review: High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges
  and solutions
• Upcoming Events: China International Optoelectronic Expo September 6-9 and ECOC September 18-20

Volume XXV

• MRSI Systems is Exhibiting at Semicon West
• Customer Visits
• MRSI Blog – Weekly Insights into the Advanced Electronic Packaging Industry

Volume XXIV

• MRSI-M3 Die Bonder Video
• MRSI Sponsors FIRST Robotics Team
• Customer Visits

Volume XXIII

• Case Study – MRSI Systems Automated Microwave Hybrid Manufacturing at TESAT-Spacecom (TESAT) 
• TESAT’s challenge was to develop an “Automated Microwave Factory” to manufacture complex highly integrated LTCC microwave modules within the frequency range 2 to 77GHz, 24 hours per day including a manless overnight ghost shift
• Our Chinese Website Launch

Volume XXII

• Our latest blog post: Challenges in Die Bonding of Gallium Nitride High Power Devices
• Gallium Nitride (GaN) materials have long been regarded as great alternatives and enhancements to GaAs and silicon-based counterparts for applications demanding high power and high frequency performance
• Upcoming Conferences

Volume XXI

• Our latest blog post: High Volume Manufacturing of Photonic Components and Modules.
• In this post we discuss: Increasing demand for data and bandwidth requires high volume manufacturing (HVM) of photonics devices.

2016 

Volume XX

• Best Holiday Wishes from MRSI Systems
• We wish you a very Happy Holiday season and a peaceful and prosperous New Year.
• High Volume Manufacturing (HVM) of Chip on Submount (CoS)

Volume XIX

• New Website Launch
• This month we launched our new website to celebrate our product family, share some great new technical content, and introduce you to our team.

Volume XVIII

• Advance Eutectic Packaging for Volume Manufacturing of Photonic, Microwave and RF Electronics
• Eutectic bonding is an area of particular interest in photonics, microwave and RF electronics, due to the need for a clean, highly thermally efficient process and for long-term reliability.

Volume XVII

• MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet
• MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet in Silicon Valley for Fast Prototyping and New Product Introduction.

Volume XVI

• Die Bonding with Integrated In Situ UV Curing
• One challenge in building photonic devices such as Active Optical Cables (AOC) is to ensure extremely accurate post die bond positioning of lenses or other critical devices.

Volume XV

• Automated Material Traceability
• Material traceability information is important for automotive components, medical devices, government contracts, aerospace & defense electronics and advanced manufacturing systems.

2015 

Volume XIV

• Best Holiday Wishes
• We wish you a happy holiday season and a peaceful and prosperous New Year.

Volume XIII

• Device Flipping Mechanisms & Eutectic Stages & TO Can Package
• Certain devices, especially optical parts, require a 90 degree change in orientation after pick up.

Volume XII

• Achieving Accurate Global and Local Alignments
• Having a proven ultra-accurate machine platform that is mechanically and thermally stable, with no cantilevered parts, is a baseline to achieve accurate device placement.

Volume XI

• Automatic In-line Eutectic Die Bonding
• Applications, such as RF Power devices, require high speed solutions which include automated in-line material handling with integrated eutectic die attach capability.

Volume X

• Handling Large Aspect Ratio, Thin, Delicate Die
• Many applications including RF Power, Optical and MEMS require large, thin, high aspect ratio devices. Aspect ratios can exceed 45 to 1.

Volume IX

• AOC Die Bonder Integrated with In Situ Light Measurement
• One challenge in building photonic devices, such as Active Optical Cables (AOC), is to ensure proper light coupling as early in the manufacturing process as possible.

Volume VIII

• MRSI Sponsors First Robotics Team
• FIRST® is an international not-for-profit organization founded by inventor Dean Kamen to inspire young people’s interest and participation in science, technology, engineering, and math).

Volume VII

• MRSI Expands Customer Support Organization
• To meet the demand of our rapidly expanding business, MRSI has been building up our customer support organization that is managed by Peter Cronin.

2014 

December 2014

• Die Bonding of Silicon Photonic Devices
• Silicon photonics is an evolving technology in which data is transferred via light. Photons can carry far more data in less time than electrons providing scalable solutions for expanding data communication needs worldwide.

October 2014

• Precision Dispensing of Conductive Epoxy
• MRSI Systems, a leading manufacturer of dispense and assembly equipment for semiconductor and photonic packaging, is now offering its industry leading MRSI-175Ag with a Rotary Style Positive Displacement Pump with a new higher resolution motor….

July 2014

• MRSI Systems now offers its flagship MRSI-M3 Assembly Work Cell configured to 1-micron placement accuracy!
• MRSI Systems, a leading manufacturer of semiconductor and optical assembly systems, is now offering its well-established M3 work cell with 1 micron placement accuracy…

May 2014

• MRSI Systems Announces 2.5D/3D Thermo Compression Bonder
• MRSI Systems has been in development of an automated system and processes for thermo compression bonding that enables new methods of assembling semiconductor devices…

April 2014

• Active Optical Cables (AOC) Assembly
• Active Optical Cables (AOC) technology is a cabling methodology that accepts the same electrical input as traditional copper cables, but utilizes optical fiber between the connectors…

January 27th 2014

• MRSI Systems Acquisition is Completed
• Today, we announce some exciting news as we enter the next chapter of our successful thirty year long history. The acquisition from Newport Corporation of MRSI Systems, a company established by the existing management team, is completed as of January 24, 2014…

January 10th 2014

• Fast Ramp Eutectic Die Attach
• Our systems are considered the industry standard for eutectic bonding. This capability includes the addition of a eutectic reflow station with fast temperature ramping capability…

2013

November 2013

• Newport to Sell All Shares of MRSI to a Team of Current Management
• MRSI was founded in 1984 and has remained focused on providing our customers with the highest quality services and solutions. On January 23, 2002 MRSI announced an agreement to be acquired by Newport Corporation…

October 2013

• Servo Drive of Needle Mechanism Synchronized with Pick Up Collet
• Thin die handling has become a common need among customers building high performance packages. MRSI is known as a leader in the industry for handling thin die…

August 2013

• Real Time Video Provides Process Monitoring for Dispense and Assembly:
• Real time video is available to monitor the dispense and assembly process on the Newport MRSI family of Dispense and Die Bonders…

July 2013

• Applications Corner
• The MRSI-705 Assembly Workcell continues to set new industry standards for ultra-precise, high-speed component assembly…

June 2013

• The Importance of Proper Lighting
• Lighting is an important component of any vision recognition system. When it comes to lighting it is not a case of “one size fits all”…

May 2013

• Dispensing Solutions Update
• MRSI Systems has been busy adding new dispense features to the MRSI-175Ag Precision Dispense System and the dispensing options on our family of die bonders…