MRSI-H1 FAMILY
MRSI-H1 FAMILY
- High speed
- Advanced ultra precision solution for flexibility and speed
- Ultra precision 1-micron flip-chip die bonders for high volume manufacturing
Benefits of MRSI-H1 Family
The MRSI-H1 family provides proven superior flexibility for true multi-die, multi-process, multi-product, high-volume, high-mix production. These high-speed products deliver the industry-leading speed without sacrificing flexibility, precision or reliability. The MRSI-H1 family targets the manufacturing challenges driven by AI cluster expansion, wireless network rollout and LIDAR market for autonomous driving.
MRSI-H1
- This standard system is widely used in advanced photonics such as lasers, receivers, transceivers, lighting, and sensors, etc.
- Carries key technological building blocks from our field-proven, flexible and high-speed MRSI-HVM platform
- Heated head option designed for the higher density eutectic packaging
- “On-the-fly” auto tool changer has twelve vacuum tips/collets integrated on the bonding head for zero time tool change
Value to our Customers
- Industry leading throughput, superior flexibility, and ultra-high-accuracy in high-volume, high-mix manufacturing
- Easy to use icon-based interface running on a Windows™ platform for ease of programming, and low-cost machine maintenance.
- Industry leading local technical support teams and application expertise
- 40+ years of experiences in the industry with reliable 24/7 field operation
Images
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MRSI-H1 with conveyor
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MRSI-H1 Configuration
Brochures
MRSI-H1
For detailed Data Sheets please contact Sales.
MRSI-H1
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