Benefits of MRSI-HVM Family 

The MRSI-HVM product family has proved to be the best-in-class die bonder with the leading speed, zero-time tool change between dies, and <1.5 micron accuracy. The superior performance is enabled by dual head, dual stage, integrated “on-the-fly” patented tool changer, ultrafast eutectic stage, and multi-levels of parallel processing optimizations.

The MRSI-HVM is designed for specific applications including Chip-on-Carrier (CoC), Chip-on-Submount (CoS), and Chip-on-Baseplate (CoB) assembly using eutectic and/or epoxy stamping die bonding.

The MRSI-HVM with conveyor is equipped with inline conveyor for single fixture or multiple cassette inputs that can automatically transport large forms of carriers of the dies for Active Optical Cables (AOC) or similar chip-on-printed circuit board (PCB) applications, gold-box packaging, and CoC in fixture. The process choices include eutectic, epoxy stamping, UV epoxy dispensing, and in-situ UV curing.

The heated head version includes a heated head on the right side while the left side still has the same head as a typical MRSI-HVM. The localized top heating at a fixed temperature or with pulsed heating is specially designed for eutectic bonding of multiple dies onto a common carrier without reflowing the neighboring solder pads.