MRSI-LEAP 1 µm High-Speed Die Bonders

Applications & Features 

• The MRSI-LEAP is designed for high-volume manufacturing applications of optical modules, including Chip-on-Carrier (CoC), Chip-on-Submount (CoS), and Chip-on-Baseplate (CoB) assemblies utilizing epoxy stamping die bonding.
• Placement accuracy is ±1 µm @ 3σ with pick & place throughput exceeding 1,000 UPH.
• Material input methods include wafer, Waffle pack, Gel-Pak®, and customized fixtures.
• Built-in conveyor designed for single fixture or multiple cassette inputs to automatically transport large carriers of substrates for Active Optical Cables (AOC) or similar chip-on-printed circuit board (PCB) applications, gold-box packaging, and CoC assemblies in fixtures.
• Flip-chip bonding, UV epoxy dispensing, in-situ UV curing, wafer-level packaging, and other processes are available.

Value to our Customers 

• Industry-leading throughput and ultra-high accuracy in high-volume manufacturing, with a pick-and-place process capable of achieving over 1,000 units per hour (UPH).
• The machine achieves an accuracy of ±1µm at 3σ, ensuring long-term stability and high precision.
• Easy to use icon-based interface running on a Windows™ platform for ease of programming, and low-cost machine maintenance.
• Industry-leading local technical support teams and application expertise
• 40+ years of experience in the industry with reliable 24/7 field operation

Configuration Highlights

• Advanced machine vision and tool design
• Modular design and field upgradeable
• Supports two 8-inch wafers and two 6-inch wafers
• Built-in conveyor and magazine design for high efficiency and throughput
• Automated dispensing and UV cure options available