MRSI-LEAP High-Speed  Die Bonder

Applications & Features 

• The MRSI-LEAP is designed for high-volume manufacturing applications of optical modules, including Chip-on-Carrier (CoC), Chip-on-Submount (CoS), and Chip-on-Baseplate (CoB) assemblies utilizing epoxy stamping die bonding.
• Machine accuracy is ±1 µm @ 3σ with Pick & Place throughput exceeding 1,000 UPH.
• Material input methods include wafer, Waffle pack, Gel-Pak®, and customized fixtures.
• The system is equipped with an conveyor designed for single fixture or multiple cassette inputs. It can automatically transport large carriers of dies for Active Optical Cables (AOC) or similar chip-on-printed circuit board (PCB) applications, gold-box packaging, and CoC assemblies in fixtures.
• Flip-chip bonding, UV epoxy dispensing, in-situ UV curing, wafer-level packaging, and other processes are available options.

Value to our Customers 

• Industry-leading throughput and ultra-high accuracy in high-volume manufacturing, with a pick-and-place process capable of achieving over 1,000 units per hour (UPH).
• The machine achieves an accuracy of ±1µm at 3σ, ensuring long-term stability and high precision.
• Easy to use icon-based interface running on a Windows™ platform for ease of programming, and low-cost machine maintenance.
• Industry-leading local technical support teams and application expertise
• 40+ years of experience in the industry with reliable 24/7 field operation

Configuration Highlights

• Powerful machine vision and tool design
• Module design, easy configuration, and system upgrade
• Supports 2 x 8 inches and 2 x 6 inches wafers with tool changes
• Built-in conveyor and magazine design for super-high efficiency and throughput
• Auto-dispenser and UV cure options available