The MRSI-M3’s large configurable work area holds up to 72 waffle packs; Gel-Paks®, tape feeders, and wafers may also be used. Waffle packs may be loaded from the front and back on easily removable and reloadable sector plates. Waffle pack feeders are easily integrated. Also, waffle pack adapters may be used with the automatic wafer changer. Epoxy stamping, in-situ eutectic, and other custom options can all be accommodated simultaneously in the work space.

The MRSI-M3 die bonder is designed for high-speed movements AND ultra-precise 3 micron placements. The composite base, low weight gantry, and powerful linear motors are engineered for fast acceleration at submicron resolution. Overall, the system is characterized by an unprecedented level of capability and technology that translates into high value and investment protection. The net result is unrivaled accuracy at high production rates.

The MRSI-M3’s advanced vision system enables rapid detection and orientation of die over a full 360°. Boundary trace or pattern recognition is used to locate the die center or application-critical features. Fast and accurate orientation detection enables die such as MMICs and laser diodes to be used directly from the supplier, eliminating the need for pre-orientation. Global and local vision alignment schemes are used for nested substrates and features, enabling fast and error-free processing of complex assemblies. The machine is configured with an upward looking camera that can be used for processing flip chips and other components with bottom features

Lighting intensity is programmable for both ring and collimated light functions, for each camera. Optimal light conditions may be set for die recognition and for alignment. Multi-color lighting may be used to enable optimum imaging of a low-contrast components. Red, green and blue programmable lighting is a powerful tool when processing challenging alignment surfaces such as gold on alumina. Such an advanced vision toolbox ensures optimum performance, which directly translates into less machine interruptions due to vision errors.

The MRSI-M3’s intuitive graphical user interface runs on Windows™ and simplifies the set-up and production process. The software includes a pre-programmed library of waffle pack and die. Additional components are easily taught and are available for all substrate programs. Calibration routines, offline programming, and CAD download mean programming is quick and easy. The MRSI-M3 is the perfect companion to MRSI Systems dispense equipment since it shares the same software user interface.

Benefits: 

• Easily integrated into automated production lines, both the in-line and cassette-to-cassette tooling options allow for greater machine autonomy, translating into a workload reduction and less setup downtime.
• Standalone tooling allows for greater flexibility required for R&D and small lot production, translating into faster changeover and therefore higher machine efficiency.
• Existing customer tooling, used upstream and or downstream from the assembly step, can be adapted; allowing streamlined product handling strategies to be implemented. Less product transfer means less operations, lower handling defect rates and improved cycle time.

Benefits:

• Ability to assemble complex products with a multitude of component types. Overall reduction in production cycle time translates into higher throughputs.
• Fast Product Change-Over means increased machine efficiency. Increased Efficiency translates into higher output and lower manufacturing costs.

Benefits:

• By using servo controlled synchronized systems, yield is increased by avoiding damaged and cracked die, especially for thin, fragile III-V material die, with internal or surface features.
• Production volumes are increased by eliminating pick error caused by wafer theta to the ejector pins alignment, especially for high aspect ratio devices.
• Wafer result mapping and ink dot recognition assures only know-good-die are used, thus ensuring a high yield. Fast change ejector needles and domes maximize system uptime.

The in-line material handling system loads a carrier of substrates (boat) onto the conveyor. The conveyor transfers the boat to the bonding area.

• Substrates are incrementally heated to the process temperature by processing through preheat zones.
• At the bond station parts come into contact with the pulse heated bonding stage and the eutectic bonding process is performed.
• The boat is then indexed to the next substrate position and the above process is repeated until all the boat positions have been assembled. As the indexer transfers the boat, the packages are incrementally cooled by passing over a cool down zone position. When completed, the indexing conveyor transfers the boat to the output magazine loader.

Various bonding processes are supported:

For Gold Silicon direct eutectic, the system aligns the package and then picks and places the die, and scrubs (variable amplitude and frequency) to accomplish the eutectic bond. A heated cover gas of Hydrogen and Nitrogen is present over the bonding area.

For solder reflow eutectic bonding, such as Gold Tin (Au/Sn) eutectic attach of Gallium Arsenide (GaAs) and Gallium Nitride (GaN) die, the system aligns the package and picks and places a preform onto the package (if required, the preform can be pre-deposited). The die is then picked and placed, while the temperature at the bonding position is ramped using a pulse-heated eutectic stage and scrubbed (variable amplitude and frequency) to accomplish the eutectic reflow. A heated cover gas of Hydrogen and Nitrogen is also present over the bonding area.

Benefits:

• Improved productivity through automation. Scalable to high volumes.
• Expanded portfolio, as capability is extended to high-power semiconductor packages requiring high heat dissipation rates.
• Investment protection if re-configuration becomes necessary. Machine retains its base modular nature.

The UV option includes specialized UV epoxy dispense hardware, as well as curing accessories. This includes easy-clean, accurate time/pressure dispense pumps for short pot-life materials.

Auto-shutter light guards on the dispense needles ensure that the dispense needle tips do not clog due to inadvertent UV exposure.

Benefits:

• Provides advanced assembly capability on a flexible platform base.
• Fully automated process ensures high yields and reduced labor costs

The addition of dispensing pumps on the MRSI-M3 provides precise control of epoxy volume when dispensing small dots or area fills. Main features include:

• Closed loop servo motors
• A three-point laser height sensor provides the ability to determines the tilt of each surface on which material will be dispensed.
• Automatic needle cleaning
• Automatic needle alignment enables fast setup and switching between pattern types.
• Automatic software calibration routine using through beam sensors
• Automatic priming
• Line drawing capability
• Superior bond line thickness control

Benefits

• Avoid the purchase of a separate dispensing machine. Ideal for R&D environments, prototyping and low volume production.
• Minimize floor space
• Reduced setup time
• Scale up with an MRSI-175Ag when volumes ramp. No need to re-qualify.
• Investment protection through the ability to reconfigure the base platform.

Stamping (or daubing) tools are interchangeable with standard pickup tools and are used to create very small epoxy dots by touching down in the stamping well and then onto the substrate. Single dots as small as 0.004″ (100 microns) are possible. They may also be ganged for higher throughput.

Benefits:

• Portfolio expansion – Added capability of small die processing, multi-chip modules.
• Solution for die attach of small die
• Solution for die attach of complex module assembly with die of varying sizes and varying epoxy materials.
• Minimize floor space
• Reduced setup time
• Investment protection through ability to reconfigure the base platform

MRSI Systems’ production-ready and time-proven technology compensates for these conditions and enables optimal device attachment, be it electrical interconnects or optical paths. Innovative in design, Die Bonding with Co-planarity Adjustment supports a wide variety of applications satisfying Optical Communications, Industrial Lasers, LiDAR, Aerospace, Medical, and more.