![Eutectic die bonding](/contentassets/60b636d43d5b4768ac705a68a3b89a34/mycronic-diebonding-substartpage-16by9.jpg?w=1920)
Die bonding solutions
MRSI Systems – part of Mycronic Group
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29 JUL 2024NEWSDIE BONDING SOLUTIONS
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18 JUN 2024NEWSDIE BONDING SOLUTIONS
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11 JUN 2024NEWSDIE BONDING SOLUTIONS
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4 JUN 2024NEWSDIE BONDING SOLUTIONS
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23 MAY 2024NEWSDIE BONDING SOLUTIONS
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9 SEP 2024EventDIE BONDING SOLUTIONS
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11 SEP 2024EventDIE BONDING SOLUTIONS
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11 SEP 2024EventDIE BONDING SOLUTIONS
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12 SEP 2024EventDIE BONDING SOLUTIONS
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23 SEP 2024EventDIE BONDING SOLUTIONS
MRSI Die Bonding, Epoxy Dispensing, and Active Alignment Solutions
![Die Bonding](/globalassets/images/product-areas/bare-board-testing/substartpage/1-micron-370x370.png?w=1920)
Our Family of Products
High Precision Flip-chip Die Bonders
Our solutions help our customers to enable high throughput production, just-in-time supply, and fast-pace innovations of critical photonic components for high growth market segments such as hyper-scale data centers, 5G wireless, LiDAR, VR/AR. Product configurations address specific application needs such as high-power laser diodes and multi-die TO products such as WDM & EML-TOs, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, 3-D hybrid packaging, and optical imaging products.
![](/globalassets/images/product-areas/die-bonding-mrsi/products/thumbnails/mrsi-a-l-machine-shot-resized.png?w=1920)
MRSI-A-L active aligner
Active alignment solutions
MRSI A-L is a modular–design machine, with integrated pick and place, dispense, vision, alignment functions, as well as intelligent software that offers users flexible processes. It is a powerful tool for optical components assembly, such as transceivers, silicon photonics, AWGs, LiDAR, integrated optics etc.
![High Precision Epoxy Dispensers](/globalassets/images/product-areas/bare-board-testing/substartpage/175ag-370x370.png?w=1920)
MRSI-175Ag
High Precision Epoxy Dispensers
The MRSI-175Ag Epoxy Dispenser handles the most demanding dispensing applications such as microwave modules, optical modules, hybrid circuits, multi-chip modules, and semiconductor packaging. With the ability to operate two heads in tandem, the MRSI-175Ag provides unparalleled process control and comprehensive dispensing capability. Die attach, underfill, encapsulation and multi-pin stamping are all supported on this flexible dispensing platform.
![Prototyping & Training Services](/globalassets/images/product-areas/die-bonding-mrsi/products/mycronic_diebonding_training_prototyping.jpg?w=1920)
Prototyping & Training Services
MRSI offers a comprehensive set of prototyping and training services. Led by experienced engineers, the programs are tailored to suit each customer’s needs, including concepts of robot orientation, teaching alignments, the die bonding process and production set up.
![Automated processes help clients grow, VPT Components and MRSI Systems jointly address manufacturing challenges.](/globalassets/images/product-areas/die-bonding-mrsi/substartpage/vpt-case-mrsi-h-to-370x370.png?w=1920)
Case
Automated processes help clients grow
VPT Components is one of the largest providers of JAN certified semiconductors along with a full-service facility for the independent, unbiased testing and custom assembly of electronic components. Do you want to know how VPT Components and MRSI Systems jointly address manufacturing challenges?