MY700JP - jet printer
- High quality and yield Operator-independent production and excellent volume repeatability.
- Unrivalled flexibility 100% software-driven, enabling quick changeovers.
- Enables lean production Reduce costs and manual work.
Millions of high-precision dots.
Now with twice the versatility.
The MY700 Jet Printer makes it possible to handle the most challenging boards and components with micrometer accuracy, maximum speed and perfect quality solder joints. The smallest and largest dots are now possible to combine with higher throughput than ever before, thanks to dual heads for continuous jetting of nanoliter and large deposits.
Perfect precision with ultimate design freedom
As boards and components become smaller, smarter and more complex, jet printing stands out as the most efficient solution for the modern electronics industry. Fully software-driven and with complete solder paste volume control, the MY700JP is the optimal way to ensure perfect quality solder joints at high speed – even in the industry’s most challenging applications. From pin-in-paste to package-on-package, flexible substrates and board cavities, even stepped stencils have begun to reach their limits.
With the MY700JP you can handle all these jobs and more with total control of solder paste deposit size, volume, shape and position.
Double up on speed, versatility and precision
The MY700 Jet Printer ensures excellent volume repeatability and solder joint quality to reduce rework. The dual head option also make it possible to combine fi ne-pitch jet printing for the smallest BGAs and 01005 components on the same board as larger-volume deposits for QFNs and connectors. The result is a substantial increase in productivity in a wide range of applications.