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MRSI’s latest article in Chip Scale Review discusses the similarities and differences between automotive light detection and ranging (LiDAR) and optical transceivers are compared.

Plan now to visit our booth #5407 at SPIE Photonics West, January 28–30, 2025 in San Francisco, CA. Discover our latest technologies, including newly released active alignment solutions and the

die-bonding Improve pick and place machine utilization by keeping dies in their places A lot of dies are presented to die bonders in waffle packs and there is a common issue of component out of

During the summer, China Fiber Optics Online (CFOL), interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Mycronic to discuss MRSI’s latest product development and some of the

On August 8, 2021, MRSI Systems(Mycronic Group) held the grand opening of its Product Demonstration Center in Shenzhen, China. The opening ceremony was accompanied with a speech by local

The Global deployment of 5G and the exponential growth of data centers is driving the demand for high-performance optical devices.

5G continues to drive the needs of the Datacom supply chain which presents challenges to photonic device manufacturers. In this article featured in Laser Focus World, MRSI highlights the

MRSI Systems won the China Optoelectronics Expo Award (CIOE Award) for the latest MRSI-HVM 1.5 micron series of products. The MRSI-HVM with conveyor is an outstanding innovation, widely used in

2021 was a great year for our best-selling product, the MRSI-HVM 1.5 micron high-speed die bonder. This system meets the needs of many industries from telecom, datacom and medical devices

Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems presented “Integrated Photonics Devices Volume Manufacturing Challenges & Innovative Solutions” at the 20th Infostone

MRSI Systems welcomes you to the European Microwave Exhibition! This event is the largest trade show that is dedicated to Microwave and RF in Europe. It will be held from September 27th-29th in

MRSI is attending and sponsoring the 18th Annual IMAPS Device Packaging Conference and Exhibition.

die-bonding MRSI Systems – IEEE Tech Insider Webinar: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications Internet traffic has been growing at an

MRSI Systems is exhibiting at the 51st International Symposium on Microelectronics from October 8-11, 2018 in Pasadena, California at the Pasadena Convention Center.

The exhibition is from March 13th-March 15th. Visit the MRSI Systems’ Booth #4444 at OFC 2018. Enjoy a free “Exhibits Plus Pass” Compliments of MRSI Systems.

Increasing demand for data and bandwidth requires high volume manufacturing (HVM) of photonics devices. This expansion with double-digit growth rates...

die-bonding Visit MRSI Systems at Productronica 2017 in Munich, Germany Productronica is the world’s leading international trade fair for innovative electronics production. The

die-bonding MRSI Systems’ Exceptional Customer Support After the sale, the real test of a quality business is what happens next. What happens if I have a problem? Can you reach a human being

Jon is a strong proponent of relationship selling and believes in the importance of customer advocacy within MRSI by providing the customer a voice.

The International Microelectronics Assembly and Packaging Society New England Chapter’s Symposium will be held in Boxborough, MA on May 2nd, 2017.

“MRSI Systems was glad to exhibit at the Technology Corner, attend the technical conference, and meet customers at ECTC this year again."

MRSI’s latest article in the July 2020 issue of Laser Focus World highlights a flexible die bonding solution for modern photonics manufacturing.

Complex Hybrid Circuits are used in a variety of high reliability applications including military, aerospace, medical, and photonics. MRSI offers dispense and die bonding solutions specifically

MRSI Systems is exhibiting at the 67th ECTC focused on the global microelectronics packaging industry.

Mycronic Sweden HQ Mycronic headquarter in the winter Mycronic AB Nytorpsvägen 9 Box 3141 183 03 Täby Sweden +46 8 638 52 00 +46 8 638 52 90 Google maps search Mycronic Taby Yes, please

Sustainability Our commitment and goals Our sustainability impact Key area: Innovation for sustainability Key area: Engineers through diversity Key area: Climate impact Responsible business

Our commitment to a sustainable electronics industry Our sustainability commitment and goals Mycronic strives to accelerate the transition to a sustainable electronics industry. Electronics have

Mycronic strives to achieve the goals of the Paris Climate Agreement. Key area: Climate impact We have set science-based targets to reduce our greenhouse gas emissions in alignment with the Paris

Mycronic’s four decentralized divisions allow it to stay close to customers in Asia, Europe, and North America. Divisions include Pattern Generators; PCB Assembly Solutions; Assembly Solutions

Expertise and innovation, the ability to create new products. Expertise and innovation Mycronic Group has a long history of innovation in many areas such as pattern generation, jet printing, die