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At IMAPS 2020 MRSI Systems will introduce a new 5 micrometer die bonder product, MRSI-705 high-volume configuration. The MRSI-705 was first introduced in 2012 and has enjoyed a dominant position

MRSI Systems (Mycronic Group) will offer live product demonstrations at Laser World of Photonics held at the Shanghai New International Expo Center (Booth #W2.2587) in Shanghai, China March

Boston, MA – December 10, 2020 – MRSI Systems, LLC and Palomar Technologies, Inc. jointly announce they have reached a confidential agreement that settles all litigation currently pending between

Chief Judge of federal court in Boston knocks out Palomar’s claim of infringement for its “double pick” patent allegedly covering a manufacturing process; court rules that claimed method is “so

Taking action against what it asserts is pervasive and repeated infringement of four separate U.S. patents it owns, leading precision manufacturer MRSI Systems LLC has filed a patent infringement

At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5 micrometer die bonder for silicon photonics, co-packaging.

MRSI Systems(Mycronic Group)赞助由ICCSZ举办的第18届光纤通讯市场暨技术专题研讨会，研讨会将于9月2日至3日在中国深圳举行。同期，中国国际光电博览会(CIOE)于2019年9月4日至7日在中国深圳隆重召开。

MRSI Systems（Mycronic Group）很高兴宣布公司MRSI-H / HVM系列产品线的最新进展。MRSI使用行业标准玻璃芯片参考样品测试放置精度，测试结果显示，产品精度从3Sigma的±3微米增强至±1.5微米。该产品从2019年10月1日发货开始，产品名称改为MRSI-H和MRSI-HVM（之前称为MRSI-H3和MRSI-HVM3）。

MRSI Systems and CYCAD Century Science and Technology will partner together at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86.

ICCSZ讯 近期，全自动，高精度，高速贴贴片与点胶系统的领先制造商MRSI Systems（Mycronic Group）被授予2019年Laser Focus World 创新者奖的光电子器件制造设备类银奖。

MRSI Systems (Mycronic Group) will be exhibiting with Mycronic at Productronica. Product demos will be offered at the Mycronic Booth #341 in Hall A3 (SMT Cluster). The exhibition will be held at

In the realm of Contract Manufacturing (CM), selecting the right equipment is a nuanced decision shaped by a myriad of variables. These factors are essential for enabling CMs to bid competitively

March will be a busy month for device packaging exhibitions. Please join MRSI Mycronic at these upcoming events. We hope to see you there to discuss our latest new product innovations. Learn more

Advanced heterogeneous integration for 3-D IC packaging, e.g., chiplet, and optoelectronics packaging requires high-precision die bonders that can perform many different processes, such as

MRSI, a global leader in precision assembly solutions for the photonics industry, is excited to announce its participation in the upcoming Asia Photonics Expo (APE), scheduled to take place in

In the November/December 2023 issue of Chip Scale Review, MRSI delves into the fascinating world of automotive light detection and ranging (LiDAR) technology. This article explores the parallels

In the world of chip packaging and advanced die bonding, the pursuit of efficiency, accuracy, and productivity is a continuous endeavor. MRSI’s die bonding systems offer a cutting-edge patented

If you are looking to pick from tape and do not have a tape and real feature on your machine, then we have a solution for you. The two inch metal tape holder can accommodate four two-inch strips

The MRSI-H1 family of 1-micron flip-chip die bonders stands out as an advanced ultra-precision solution.

MRSI Systems, Mycronic Group will be exhibiting at the 56th International Symposium on Microelectronics from October 3-4th, 2023 in San Diego, CA. This year's Symposium will feature 5

MRSI Systems is exhibiting at IMS (Booth #448)—the world’s largest Microwave and RF industry event in Philadelphia, PA at the Pennsylvania Convention Center June 10-15, 2018.

Gallium Nitride (GaN) materials have long been regarded as great alternatives and enhancements to GaAs and silicon-based counterparts for applications...

The 51st International Symposium on Microelectronics was held at the Pasadena Convention Center in Pasadena, California this month. This symposium is the premier event for microelectronic

All major optical communication component manufacturers, data center transceiver suppliers, optical network technology groups and, in general, the world of photonics packaging have been facing an

These Die Bonding process pages explain the central role that die bonding continues to play in the photonics, sensors and semiconductor industries.

MRSI Systems exhibited at the Automotive LIDAR 2018 Expo and Conference in Detroit, Michigan last month. The conference focused not only on hardware solutions but software as well. The use of AI

MRSI exhibited at the Inaugural WPI/QCC Integrated Photonics Symposium, at WPI October 3, 2018, and Dr. Yi Qian, VP of Marketing, MRSI Systems participated in an industry panel including

MRSI’s latest article in Laser Focus World’s August Issue Challenges for photonics manufacturing in the new data center era, discusses the high volume and high mix nature of photonics

die-bonding MRSI Systems Supports “Advancing Innovation in Photonics” Background MRSI Systems is a community member of AIM (American Institute of Manufacturing) Photonics and the local Photonics

MRSI is exhibiting at the Optical Fiber Communication Conference and Exhibition (OFC) March 21-23, at the Los Angeles Convention Center (Booth 1728). We invite you to explore MRSI’s product