Search

Find customer support information from MRSI Systems, how we can help you and how we go the extra mile to support our customers.

Learn more about Mycronic’s corporate governance. Find out how we divide responsibilities and read our corporate governance reports and articles of association.

Mycronic AB (publ) has received an order for an SLX mask writer from an existing customer in Asia. The order value is in the range of USD 9-11 million. Delivery of the system is planned for the

Mycronic has acquired Modus High-Tech Electronics GmbH, a Dusseldorf-based provider of automated optical inspection systems for electronics volume production.

Mycronic appoints Nomination Committee The Nomination Committee for Mycronic’s 2025 Annual General Meeting has been appointed in accordance with the instructions for the Nomination Committee as

Mycronic AB (publ) today publishes its Annual and Sustainability Report 2024, which can be downloaded as a PDF from the report archive on the company’s website.

Subscribe to IR News Sign up to subscribe to IR (Investor Relations) news and receive company data such as press releases and reports continuously to your inbox. Fill out the form below, and you

pcb-assembly The MYPro A40 in brief Two ambitious goals. One powerful mounthead technology. 48% faster throughput Six times larger components All-new graphical user interface A united force of

Mycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect

As an innovative European contract manufacturer, DF Elettronica is determined to continually push the limits of automation. Whether it’s inspection, traceability, material transport or process

pcb-assembly With the new MYPro I™ series 3D AOI Programming just got simpler Faster programming. Smarter guidance. Zero false calls. When it comes to advanced 3D AOI, demands are high and

pcb-assembly How smarter human–machine collaboration is making your people more valuable than ever Empowering people through automation Even with all your resources running at full capacity,

pcb-assembly And this time, it’s vertical The connectivity continues Over the past year, Hermes compatibility has been added to a number of Mycronic’s SMT solutions. The next step is to extend

For a savvy production manager, it’s always possible to get the right troubleshooting data from your pick-and-place machine – if you have plenty of time and effort to spare. Thanks to MYCenter

The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications. Watch the Webinar Recording.

Die bonding is as old as the semiconductor industry itself. From the onset, integrated circuits or ICs were developed using four levels of interconnections.

Eutectic die bonding, sometimes referred to as eutectic die attach, is a die bonding technique used for devices that require enhanced heat dissipation.

Epoxy die bonding, sometimes referred to as epoxy die attach, is the most widely used die bonding technique in semiconductor assembly.

MRSI Systems很高兴地宣布与Lumentum达成新合作("Lumentum"，纳斯达克代码:LITE)，Lumentum是汽车行业光子芯片和光模块的全球领导者。此次合作有望为该行业带来创新的激光雷达解决方案。

摘要：MRSI Systems, Mycronic Group的MRSI-S-HVM亚微米贴片机荣获“2020年度光通信最具竞争力产品”奖，代表了MRSI-S-HVM亚微米贴片机?获得行业专家评审团的一致认可与高度评价。

Ultra-high-speed die bonding technology is pivotal in modern manufacturing, particularly for optical modules production. The MRSI-LEAP Ultra-High-Speed Die Bonders exemplify this advancement,

MRSI Systems(Mycronic Group)目前已经在中国深圳正式创建了新的产品演示中心，该产品演示中心落成于深圳市南山区朗山路华瀚创新园。

Join MRSI at the upcoming Compound Semiconductor Advanced Technology and Application Conference (CSC) taking place on May 22-23, 2024, in Suzhou, China.

The emergence of two-and-a-half-dimensional (“2.5D”) and three-dimensional (“3D”) (collectively, “2.5D/3D”) integrated circuit packaging technology is creating another compelling opportunity for

MRSI’s latest article in Chip Scale Review discusses the similarities and differences between automotive light detection and ranging (LiDAR) and optical transceivers are compared.

Plan now to visit our booth #5407 at SPIE Photonics West, January 28–30, 2025 in San Francisco, CA. Discover our latest technologies, including newly released active alignment solutions and the

The Global deployment of 5G and the exponential growth of data centers is driving the demand for high-performance optical devices.

MRSI has produced immersive software training videos to optimize your company’s experience with our cutting-edge die bonding and epoxy dispensing systems. MRSI wants the acquisition of our

MRSI Systems won the China Optoelectronics Expo Award (CIOE Award) for the latest MRSI-HVM 1.5 micron series of products. The MRSI-HVM with conveyor is an outstanding innovation, widely used in

2021 was a great year for our best-selling product, the MRSI-HVM 1.5 micron high-speed die bonder. This system meets the needs of many industries from telecom, datacom and medical devices