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Mycronic receives order for a Prexision 80 Evo

Mycronic AB (publ) has received a replacement order for a Prexision 80 Evo from an existing customer in Asia. The order value is in the range of USD 27-30 million. Delivery of the system is

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MRSI Systems Supports “Advancing Innovation in Photonics”

die-bonding MRSI Systems Supports “Advancing Innovation in Photonics” Background MRSI Systems is a community member of AIM (American Institute of Manufacturing) Photonics and the local Photonics

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Invitation to the presentation of Mycronic’s Q4 2024

Analysts, investors and media are invited to the presentation of Mycronic’s Q4 2024. The presentation will be held on February 6, 2025, at 10:00 a.m. CET. The report is published on February 6,

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Join MRSI Systems at OFC!

MRSI is exhibiting at the Optical Fiber Communication Conference and Exhibition (OFC) March 21-23, at the Los Angeles Convention Center (Booth 1728). We invite you to explore MRSI’s product

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Technology Students Experience Local Advanced Technology Manufacturer Up Close

Middlesex Community College technology students recently visited our factory in Billerica, MA.

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International Microwave Symposium 2017

MRSI Systems is exhibiting at IMS (Booth #1847)—the world’s largest Microwave and RF industry trade show in Honolulu, Hawaii June 4-9, 2017.

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High Volume Manufacturing of Photonic Devices: Assembly Starts with Design

The explosive growth of internet traffic demands higher bandwidth in data communications. High volume manufacturing of photonic devices is crucial.

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International Microwave Symposium 2018

MRSI Systems is exhibiting at IMS (Booth #448)—the world’s largest Microwave and RF industry event in Philadelphia, PA at the Pennsylvania Convention Center June 10-15, 2018.

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Fully Automated Die Bonding Systems — The Importance of Proper Lighting

Lighting is an important component of any vision recognition system. When it comes to lighting, it is not a case of “one size fits all.”

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Automated Die Bonding for High Volume Optoelectronics Packaging

As the Optoelectronics market is strong and growing, the technical requirements increase the challenges for manufacturers.

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China International Optoelectronic Expo – September 2017

die-bonding MRSI CYCAD CIOE Booth 2017 China International Optoelectronic Expo – September 2017 MRSI Systems is exhibiting at CIOE with our Chinese Representative CYCAD Century Science and

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Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors

Electronic components and packages continue the trend of miniaturization which drives demand for cost-effective assembly solutions for smaller components and packages. This is happening in end

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Great Week at SPIE Photonics West 2019

Thank you to all of our existing customers and new customers who visited us at SPIE Photonics West. The turnout at the booth was filled with great discussions. The event was well attended with

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Join MRSI Systems at SEMICON West 2019

MRSI Systems is exhibiting at SEMICON West (Booth #6163) from July 9-11th in San Francisco, CA at the Moscone Center.

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International Microwave Symposium 2019

die-bonding International Microwave Symposium 2019 MRSI Systems is exhibiting at IMS (Booth #686). The world’s largest Microwave and RF industry event is being held in Boston, MA this year at the

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IMAPS Boston 2019 – Highlights

die-bonding IMAPS Boston 2019 – Highlights MRSI Systems has been a member and proud supporter of IMAPS for more than 30 years and was pleased to sponsor the exhibition at the 2019 IMAPS

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Visit MRSI Systems at the European Conference on Optical Communications (ECOC) 2017 — New Die Bonder for High Volume Manufacturing

Over three decades, MRSI Systems has developed a family of high precision eutectic die bonders for high volume manufacturing of optoelectronics.

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Communiqué from the Annual General Meeting and statutory meeting of the Board of Directors of Mycronic AB (publ)

The Annual General Meeting of Mycronic AB (publ) was held on May 8, 2024. The Annual General Meeting was carried out with the physical presence of shareholders and representatives. The

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For a rugged world

pcb-assembly MYC60 industrial dispenser Automated industrial dispensing For a rugged world The world is witnessing a massive rollout of heavy-duty boards. Whether for broadband infrastructure,

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Going deeper with AI

Going deeper with AI How Mycronic’s new collaborative deep learning center can help unlock the value of AI Going deeper with AI Together with NuFlare Technology and D2S, with support from NVIDIA,

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Big data means big potential

Big data means big potential - AI Big data means big potential Mycronic’s new collaborative Center for Deep Learning in Electronics Manufacturing (CDLe) in San Jose, California is focused on deep

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Testimonials

See what real MRSI Systems customers are saying about our Die Bonding and Epoxy Dispensing systems and how they have helped them succeed.

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Automated optical inspection

Mycronic AOI products provide Automated Optical Inspection ensures quality and reliability in your production processes.

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1 Micron Die Bonders

Learn more about MRSI's 1 micron die bonders.

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1.5 Micron Die Bonders

Learn more about MRSI's 1.5 micron die bonders.

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Jet printing

Mycronic jet printing technology makes it possible to dispense solder paste for the most challenging circuit boards and components. Learn more!

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High Precision Flip-chip Die Bonders

Learn more about MRSI's high precision flip chip die bonders.

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Notice to the Annual General Meeting in Mycronic AB (publ)

The shareholders in Mycronic AB (publ), corp. reg. no. 556351-2374, are hereby given notice of the Annual General Meeting to be held on Wednesday, May 7, 2025, at 5:00 p.m. at the company’s

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