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Showcasing student career exploration: Mycronic hosted the Swedish Minister for Education and Tekniksprånget Yesterday, we welcomed Mats Persson, the Swedish Minister for Education, and

Mycronic is a member of Diversity Charter Sweden, a network that promotes diversity and inclusion in the workplace.

Mycronic is breaking ground for a new facility in Germany In need of a bigger and better optimized facility, the headquarters for Mycronic PCB Test business line in Wertheim will relocate from

Micronic Mydata launches new MY600 Jet Printer Täby, Sweden – 5 May, 2014 Micronic Mydata AB (publ), listed on NASDAQ OMX Stockholm, Small Cap: MICR, launches the new MY600 Jet Printer for

Welcome to our new website We are currently upgrading our website and have made some changes to the structure. On mycronic.com you will find investor information, career opportunities and a

Find all the news articles from Mycronic, a global high-tech company that advances electronics technology with innovative solutions. Read latest news and updates here.

MYPro A40SX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience.

MYPro A40LX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience.

MYPro S20 - stencil printer Intelligent vision and 2D inspection Brochure Contact MYPro S series brochure High accuracy meets high flexibility  In the MYPro S series, an advanced vision

MYPro S30 - stencil printer Intelligent vision and 2D inspection Brochure Contact MYPro S series brochure Repeatable precision for higher throughput   Robust, accurate and easy to operate, the

For detailed Data Sheets please contact Sales. The MRSI-HVM product family has proved to be the best-in-class die bonder with leading speed, zero-time tool change between dies, and <1.5 micron

For detailed Data Sheets please contact Sales. The MRSI-705 5-Micron Flip-Chip Die Bonder sets the mark for high-precision, high-speed component assembly within a flexible, configurable platform.

For detailed Data Sheets please contact Sales. The MRSI-S-HVM submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging

For detailed Data Sheets please contact Sales. The MRSI-H family provides proven superior flexibility for true multi-die, multi-process, multi-product high volume high mix production.

For detailed Data Sheets please contact Sales.

For detailed Data Sheets please contact Sales. The MRSI-H1 family provides proven superior flexibility for true multi-die, multi-process, multi-product high volume high mix production.

For detailed Data Sheets please contact Sales. The MRSI-HVM1 product has proved to be the best-in-class die bonder with leading speed, zero-time tool change between dies, and 1 micron accuracy.

For detailed Data Sheets please contact Sales. For detailed Data Sheets please contact Sales. The MRSI-M3 3-Micron flip-chip Die Bonder sets the industry standard for ultra-precision,

For detailed Data Sheets please contact Sales. The MRSI-705HF is equipped with a heated bond head that can apply up to 500N of force during the bonding process, while providing heating up to

One versatile platform. Twice the possibilities. MYPro series MY700TM Jet Printer and Dispenser MYPro series MY700TM  Jet Printer and Dispenser Specifications March 2022 Millions of

Millions of high-precision dots. The MY700 Jet Printer makes it possible to handle the most challenging boards and components with micrometer accuracy, maximum speed and perfect quality solder

MY300HX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience. It

The MYCenter Analysis dashboard software provides actionable data to increase utilization, reduce reject rates and improve line balancing in real time.

MYD50 in-line dispenser Brochure Contact us Brochure MYD Linear motor drive in-line dispensers For higher-precision applications such as complex chip packaging, the powerful MYD50 platform

The new Prexision series setting the global standards for displays. 

The all-in-one solder paste and assembly fluid solution. MY700JX allows you to combine operator-independent solder paste jet printing with high-speed jet dispensing of adhesives, UV materials,

A5 Neo Flying Probe Test System For Rigid and Flexible Boards. 

PI Pico - 3D SPI Brochures Contact PI series 3D SPI brochure and specifications High accuracy and repeatability 3D SPI with auto-programming Clear and simple inspection control Clarity and

PI Primo - 3D SPI Brochures Contact PI series 3D SPI brochure and specifications Clear and simple inspection control Clarity and simplicity are words rarely associated with the complex process of

All the power of the MYPro I series 3D AOI for heavyweight board inspection.