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MYPro A40DX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience.

MYPro A40LX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience.

MYPro A40SX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience.

All the power of the MYPro I series 3D AOI for heavyweight board inspection.

All the power of the MYPro I series 3D AOI in dual lane configuration.

High-performance 3D AOI for high-productivity production.

High-performance 3D AOI for high-productivity production.

All the power of the MYPro I series 3D AOI for heavyweight board inspection.

Mycronic SLX series.  Gear up to meet today’s fast-paced semiconductor industry. 

To ensure high end display photomask quality up to generation 11.

Millions of high-precision dots. The MY700 Jet Printer makes it possible to handle the most challenging boards and components with micrometer accuracy, maximum speed and perfect quality solder

The all-in-one solder paste and assembly fluid solution. MY700JX allows you to combine operator-independent solder paste jet printing with high-speed jet dispensing of adhesives, UV materials,

Mycronic’s largest component storage system capable of storing 2,468 reels in less than 2 m². The same height as the MYTower 6 and MYTower 6+, but is equipped with a new storage technology

MYPro Link Multi-machine programming with MYPro Create  Results at a glance with MYPro Review Real-time yield management with MYPro Live Powerful yield improvement with MYPro Analyze

For detailed Data Sheets please contact Sales. The MRSI-705 5-Micron Flip-Chip Die Bonder sets the mark for high-precision, high-speed component assembly within a flexible, configurable platform.

For detailed Data Sheets please contact Sales. The MRSI-S-HVM submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging

For detailed Data Sheets please contact Sales. The MRSI-LEAP high-speed die bonder boasts a range of innovative features that make it an essential tool for high-volume manufacturing.

For detailed Data Sheets please contact Sales. The MRSI-H1 family provides proven superior flexibility for true multi-die, multi-process, multi-product high volume high mix production.

A9a A9a Description Specification Brochures Services Contact The fully automated A9a, 8-head, double-sided, high-speed, high-accuracy granite based flying probe test system features

A9 plus A9 plus Description Specification Brochures Services Contact The A9 Plus is utilizing the same technology as the A9 and is in addition equipped with 4 high-resolution cameras (3µm/pixel)

S3-8 S3-8 Description Brochures Specification Services Contact S3-8 is the double-sided model of the single-sided S3 System. The S3-8 has 8 test heads and 2 high-resolution cameras, one on the

S3 S3 Description Specification Brochures Services The S3 is able to test 10 µm structures while achieving 100 measurements per second. The machine, therefore, provides the customer with an

A9a plus A9a plus Description Specification Brochures Services Contact The A9a plus is utilizing the same technology as the A9a and is in addition equipped with a temperature control unit and 4

A7a Pro A7a Pro Description Specification Brochures Services Contact The automated A7a Flying Probe Test System provides highest flexibility. It is designed for the fully automated test of

Your business is built to produce. MYCare keeps you ahead of the curve. Mycronic MYCare services offers multiple levels of technical support, preventive maintenance, and service to suit your

The MYTower 6+ is the same height as the MYTower 6, with the key difference being the ability to store 15′′ reels in all magazines within the storage system.

GenI - Generative AOI programming With Gen I™ your team gains: The industry’s fastest programming — eliminate specialized AOI programming for every new product. Faster NPIs — accelerate

MYPro Create Multi-machine programming for electronics manufacturers A single interface and workflow MYPro Create makes multi-machine programming a lot smoother and paves the way for future

In-line dispensing valves Our dispensing valves are ideal for dispensing a wide variety of fluids and materials, ranging from adhesives and sealants to inks and solder paste. The valves feature

The MYC50 gives you powerful, software driven process flows that ensure years of productivity for even the most complex printed circuit boards.