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Image gallery

Check out the MRSI Systems gallery for images and videos of MRSI die bonding and epoxy dispensing systems available from MRSI Systems in MA.

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Join us in March!

March will be a busy month for device packaging exhibitions. Please join MRSI Mycronic at these upcoming events. We hope to see you there to discuss our latest new product innovations. Learn more

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Advanced Packaging for Heterogeneous Integration

Advanced heterogeneous integration for 3-D IC packaging, e.g., chiplet, and optoelectronics packaging requires high-precision die bonders that can perform many different processes, such as

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Exploring Automotive LiDAR Packaging Trends

In the November/December 2023 issue of Chip Scale Review, MRSI delves into the fascinating world of automotive light detection and ranging (LiDAR) technology. This article explores the parallels

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Precision and Reliability in Defense Electronics: Exploring MRSI’s Industry-Leading Solutions

Designing and manufacturing electronic components destined for defense applications entails navigating a landscape of exacting standards. These standards demand unparalleled reliability, minimal

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Advancing automation: unleashing the power of the automatic tool changing turret

In the world of chip packaging and advanced die bonding, the pursuit of efficiency, accuracy, and productivity is a continuous endeavor. MRSI’s die bonding systems offer a cutting-edge patented

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MRSI New Solution: Tape Holder

If you are looking to pick from tape and do not have a tape and real feature on your machine, then we have a solution for you. The two inch metal tape holder can accommodate four two-inch strips

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The MRSI-H1 Family: Unleashing Precision and Agility

The MRSI-H1 family of 1-micron flip-chip die bonders stands out as an advanced ultra-precision solution.

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MRSI to present at Automotive LIDAR 2021

MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23rd, 2021. MRSI is presenting on Wednesday,

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MRSI to present at IFOC and Exhibit at CIOE in September in Shenzhen including live product demos

MRSI Systems will present at the 19th Infostone Optical Communications Conference(IFOC), organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from September

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MRSI-705 innovative high-volume configuration for lower cost manufacturing

5G infrastructure will require ultra-high bandwidth, latency up to 1 ms, and highly reliable connectivity. In addition, RF architectures need to be scalable, efficient, and extremely compact.

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MRSI Systems受邀出席光收发器和硅基光电子论坛

摘要:MRSI Systems战略市场高级总监,周利民博士受邀参加光收发器和硅基光电子论坛并将带来主题为“光收发器和硅基光电子量产的挑战及解决方案”的演讲。

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IMAPS 2020 Virtual Exhibition

MRSI is exhibiting at the 53rd International Symposium on Microelectronics from October 6-8th, 2020. Visit the MRSI Virtual Booth to chat with our team of technical experts to review our exciting

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MRSI’s August 2020 Laser Focus World Featured Article: Assembly solution addresses TO-can photonic device manufacturing challenges

In this week’s blog post we highlight our recent Laser Focus World published article on the challenges of new TO-can photonic device manufacturing.

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Irving Wang joins MRSI – Product Marketing

Irving Wang joined MRSI this year as the Director of Product Marketing. He is based in the US to spearhead MRSI’s push into the sub-micron market and to support our newly launched MRSI-S-HVM

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Join MRSI at the International Microwave Symposium

The world’s largest Microwave and RF industry event is being held virtually this year. 

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SEMICON West 2020 Virtual Event

MRSI Systems invites you to SEMICON West 2020 Virtual Event from July 20-23, 2020.

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Board of directors

Board members About board of directors Contact Investor Relations Interior view from Mycronic HQ Board of directors Patrik TIgerschiöld, Chairman of the Mycronic board Arun Bansal, independent

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Capital markets day

During Mycronic’s Capital Markets Day you can learn more about our group strategy, financial and sustainability targets, product areas and global technologies.

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Financial & sustainability targets

We will double net sales, double profit, reduce CO2 emissions by half. Follow our aims to transite toward a more sustainable electronics industry.

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Analysts and consensus estimates

Analysts and consensus estimates The consensus estimates are provided by Modular Finance and are based on forecasts from analysts following Mycronic. The analysts’ opinions, forecasts, and

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Shareholders

Who are the largest shareholders at Mycronic? How does the ownership structure and geographic distribution looks like?

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Framework for corporate governance

Framework for corporate governance Corporate governance is based on external governing instruments such as the Swedish Companies Act, the Annual Accounts Act, Nasdaq Nordic’s Main Market Rule

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Financial calendar

Find out all about our financial events and subscribe to our investor events.

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Presentation Q3 report 2022

Presentation Q3 report 2022 Presentation of Mycronic's Q3 report January-September 2022 Interim report January-September 2022 Presentation Q3 report

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Mycronic share

Learn about share performance, dividends, share capital, largest shareholders, share distribution and insiders. See the latest price, change, volume and historical data for Mycronic’s share.

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Key area: Innovation for sustainability

Through innovation, we can accelerate the transition of the electronics industry towards a more sustainable future. For Mycronic, sustainable innovation is about developing products that help our

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Our sustainability impact

As a global supplier of production equipment to the electronics industry, Mycronic strives to act responsibly throughout its value chain. Our sustainability impact As a global supplier of

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Mycronic as an investment

Mycronic is a leading provider of production solutions for the electronics industries. Learn about our growth and profitability, our goals for net sales, EBIT and Co2, and how we invest in

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Certificates

Certificates At Mycronic we are committed to working in a systematic, consistent, and efficient way to achieve our goals and create value for our customers and stakeholders. We are constantly