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pcb-assembly Our most recent news articles.

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Smaller, smarter, faster

Just outside of Nürnberg, Germany, one forward-thinking manufacturer is rapidly modernizing its production to meet fast-growing demands for advanced industrial IoT electronics. Thanks to the

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Thinking outside the line

Mr. Liu Haifeng has never been one to stick with the status quo. As General Manager of Wuxi Good Electronics Co., Ltd., he is always on the hunt for the latest production technologies, new

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Autonomous inspection

21st century industries demand 21st century manufacturing solutions. With the help of the latest 3D automated optical inspection systems, MSL Circuits – an ALL Circuits company, is helping

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For a rugged world

pcb-assembly MYC60 industrial dispenser Automated industrial dispensing For a rugged world The world is witnessing a massive rollout of heavy-duty boards. Whether for broadband infrastructure,

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Surprising insights

For Allelektronik in southern Sweden, the new MYCenter Analysis dashboard came as a real eye-opener. Having spent more than a decade optimizing production for a single customer, Production

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Open new doors to automated material handling

pcb-assembly Introducing the new dual-terminal MYTower Open new doors to automated material handling If you’re like most manufacturers, repetitive material handling tasks can consume entirely too

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Reducing e-waste through innovation

pcb-assembly Reducing e-waste through innovation Global consumption of electrical and electronic equipment is on the rise. When these products enter an end-of-life state, a large amount of the

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Components on demand

How do you quantify the benefits of automation? Twenty percent higher production volume with the original base of operators is a good start.

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MRSI Systems, Mycronic Group announces a new collaboration to provide LiDAR solutions for the Automotive Industry

MRSI Systems is delighted to announce a new collaboration with Lumentum Operations LLC ("Lumentum", NASDAQ: LITE), a leading global photonic chip and module supplier for the automotive LiDAR

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MRSI receives Laser Focus World Innovators Award for H-TO die bonder

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the

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MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging

At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5 micrometer die bonder for silicon photonics, co-packaging.

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MRSI Systems欢迎资深光电子专家周利民博士出任战略营销高级总监

2019年2月13日–全球领先的半导体系统设备制造商Mycronic集团的子公司,MRSI Systems今日荣幸宣布,光电子资深专家周利民博士将加入公司团队并担任战略营销高级总监,负责拓展MRSI Systems在中国的市场影响力。周博士在光电子行业拥有的丰富专业知识,以及他在中国市场的知名度将有助于推动MRSISystems市场战略布局,制定清晰的产品路线图,以及增强MRSI

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MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the

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MRSI Systems 宣布“DIE PLACEMENT HEAD WITH TURRET” (集成水平转塔之芯片贴装头)已获得中国专利授权

MRSI Systems宣布“DIE PLACEMENT HEAD WITH TURRET”(集成水平转塔之芯片贴装头)已获得中国专利授权。迈康尼全球技术部的业务部门-MRSI Systems宣布,中华人民共和国国家知识产权局(CNIPA)已于2021年7月30日授权MRSI Systems 申请的“DIE PLACEMENT HEAD WITH

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MRSI Systems Welcomes Dr. Limin Zhou as Senior Director of Strategic Marketing

MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior Director of Strategic Marketing to expand MRSI’s market presence in China. He will

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MRSI Systems Announces Chinese Patent Issued Covering Die Placement Head with Turret

Mycronic Global Technologies Business Unit, MRSI Systems announces the recent issuance of utility patent titled “DIE PLACEMENT HEAD WITH TURRET” and numbered ZL 201680048482.5 (PCT/US2016/047135)

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MRSI launches new Die Bonder with improved throughput for high power laser manufacturers

MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful

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MRSI to present at Automotive LIDAR 2021

MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23rd, 2021, a leading event in the

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Meet the MRSI-705: Your Essential Tool for Precision and Reliability in Critical Applications

The MRSI-705 has established itself as a reliable tool in the aerospace, defense, and medical industries, playing a crucial role in mission-critical tasks due to its performance, adaptability,

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The High-Performance and Flexible MRSI A-L for Optical Assembly

The optical components industry demands highly precise and customized equipment for complex optical assembly processes. We have answered this need with our new active aligner - a high-performance

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Exploring Automotive LiDAR Packaging Trends

In the November/December 2023 issue of Chip Scale Review, MRSI delves into the fascinating world of automotive light detection and ranging (LiDAR) technology. This article explores the parallels

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MRSI shines at May events: showcased and featured

In the bustling world of technology, May was a month marked by significant events, and MRSI was at the forefront. With appearances at IMAPS New England in Boxborough, MA, and the 2024

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Precision and Reliability in Defense Electronics: Exploring MRSI’s Industry-Leading Solutions

Designing and manufacturing electronic components destined for defense applications entails navigating a landscape of exacting standards. These standards demand unparalleled reliability, minimal

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MRSI New Solution: Tape Holder

If you are looking to pick from tape and do not have a tape and real feature on your machine, then we have a solution for you. The two inch metal tape holder can accommodate four two-inch strips

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The MRSI-H1 Family: Unleashing Precision and Agility

The MRSI-H1 family of 1-micron flip-chip die bonders stands out as an advanced ultra-precision solution.

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MRSI Mycronic to Present at the 7th Annual Automotive LIDAR Conference

MRSI Mycronic is proud to sponsor the 7th Annual Automotive LIDAR Conference, taking place online from November 20-21, 2024.

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Advanced Patented Tool Change Turret from MRSI: Revolutionizing Precision Technology

MRSI’s die bonding systems are designed to address the challenges of chip packaging with a focus on efficiency, precision, and productivity. These systems feature an advanced, patented

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Innovation Continues on MRSI-705HF

Last year, MRSI Systems launched the MRSI-705HF high force die bonder, a new version of the trusted MRSI-705 that is perfect for sintering and thermocompression bonding applications.

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Join us at OFC!

The 2025 Optical Fiber Communications Conference and Exhibition (OFC) is back to solidify its status as the premier global event for optical networking and communications.