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Interim Report January–June 2024 Second quarter Order intake amounted to SEK 2,125 (1,748) million, an increase of 22 percent Net sales increased 23 percent to SEK 1,527 (1,245) million. Also

As a result of the preparations ahead of a possible listing of Axxon on a stock exchange in China, effective March 19, 2024, Ivan Li leaves Mycronic’s executive management but remains as Head of

Mycronic AB (publ) has received an order for a Prexision 8 Entry Evo from an existing customer in Asia. The order value is in the range of USD 10-12 million. Delivery of the system is planned for

Mycronic AB (publ) has received a replacement order for a Prexision 80 Evo from an existing customer in Asia. The order value is in the range of USD 27-30 million. Delivery of the system is

Analysts, investors and media are invited to the presentation of Mycronic’s Q4 2024. The presentation will be held on February 6, 2025, at 10:00 a.m. CET. The report is published on February 6,

Mycronic AB (publ) today publishes its Annual and Sustainability Report 2023, which can be downloaded as a PDF from the report archive on the company’s website.

The MRSI-705 has established itself as a reliable tool in the aerospace, defense, and medical industries, playing a crucial role in mission-critical tasks due to its performance, adaptability,

The optical components industry demands highly precise and customized equipment for complex optical assembly processes. We have answered this need with our new active aligner - a high-performance

In the November/December 2023 issue of Chip Scale Review, MRSI delves into the fascinating world of automotive light detection and ranging (LiDAR) technology. This article explores the parallels

In the bustling world of technology, May was a month marked by significant events, and MRSI was at the forefront. With appearances at IMAPS New England in Boxborough, MA, and the 2024

die-bonding Epoxy Dispenser The Next Generation MRSI-175Ag Epoxy Dispenser is now available In the fast-paced world of advanced packaging and semiconductor manufacturing, precision and efficiency

Designing and manufacturing electronic components destined for defense applications entails navigating a landscape of exacting standards. These standards demand unparalleled reliability, minimal

The MRSI-H1 family of 1-micron flip-chip die bonders stands out as an advanced ultra-precision solution.

MRSI Mycronic is proud to sponsor the 7th Annual Automotive LIDAR Conference, taking place online from November 20-21, 2024.

MRSI’s die bonding systems are designed to address the challenges of chip packaging with a focus on efficiency, precision, and productivity. These systems feature an advanced, patented

Last year, MRSI Systems launched the MRSI-705HF high force die bonder, a new version of the trusted MRSI-705 that is perfect for sintering and thermocompression bonding applications.

Learn more about AOC from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

News & events Events News Press releases Cases Technical articles archive Webinars Newsletters archive MRSI events Newsletters archive Our future events & webinars. Our most recent news

Learn more about TO-TOSA/ROSA from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

MRSI is now offering an extensive library of software training videos for your MRSI die bonding and epoxy dispensing systems. Contact MRSI to learn more.

MRSI offers a comprehensive set of training programs covering our family of products. Contact MRSI Systems to learn more about On-Site Training.

We provide prototyping and small batch die bonding services for our customers to shorten your time to market.

Check out the MRSI Systems gallery for images and videos of MRSI die bonding and epoxy dispensing systems available from MRSI Systems in MA.

This increased demand for photonics components is driven by the growth in optical networks. Learn more about Photonics Packaging by reading more from MRSI Systems!

die-bonding Mycronic technology essential in 5G development Die bonding systems are required for the groundbreaking digital transition Mycronic technology essential in 5G development 5G is

MRSI Systems thinks from the customer’s perspective and upholds strict protocols to ensure your desired configuration, has been built to proper specification. MRSI’s core value of acting like an

We are pleased to be exhibiting again this year at the 50th ECOC in Frankfurt am Main, Germany.

die-bonding Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Mycronic and General Manager

Having a proven ultra-accurate die bonding system platform that is mechanically and thermally stable, with no cantilevered parts, are essential elements to achieve accurate device placement.

The MRSI-175Ag Conductive Epoxy Dispenser handles the most demanding dispensing applications such as semiconductor packaging, Microwave & RF modules, multichip modules, optical modules,