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MRSI’s die bonding systems are designed to address the challenges of chip packaging with a focus on efficiency, precision, and productivity. These systems feature an advanced, patented

The 2025 Optical Fiber Communications Conference and Exhibition (OFC) is back to solidify its status as the premier global event for optical networking and communications. 

MRSI Mycronic will be participating in several optical and device packaging exhibitions. We invite you to attend these upcoming events. We look forward to discussing our latest product

In the fast-paced world of photonics manufacturing, having the right tools can make all the difference. The MRSI-H1 is designed to meet the demands of high-volume production with its

MRSI is pleased to announce the presentation of its latest innovation, the MRSI-LEAP Die Bonder, at the China International Optoelectronic Expo (CIOE) in Shenzhen, taking place from September 10th

die-bonding Epoxy Dispenser The Next Generation MRSI-175Ag Epoxy Dispenser is now available In the fast-paced world of advanced packaging and semiconductor manufacturing, precision and efficiency

The International Microwave Symposium (IMS) is an annual conference for professionals in the microwave and RF industry.

The rapid adoption of artificial intelligence is driving advancements in optical interconnect technology, resulting in notable improvements in speed, power efficiency, and cost reduction. This

The MRSI-A-L machine is a versatile optical active alignment platform suitable for a wide range of applications, including lens, fiber and other optical components active alignment.

Last year, MRSI Systems launched the MRSI-705HF high force die bonder, a new version of the trusted MRSI-705 that is perfect for sintering and thermocompression bonding applications.

die-bonding MRSI-705 with wafer, conveyor Versatile package handling capabilities: dewar and beyond In today's fast-paced production environments, efficiency and versatility are key. The MRSI-705

Advanced heterogeneous integration for 3-D IC packaging, e.g., chiplet, and optoelectronics packaging requires high-precision die bonders that can perform many different processes, such as

At the exhibition, MRSI will provide live product demos of the recently launched MRSI-H-HPLD+, a new variant of the successful MRSI-H-HPLD that is tailored for high-power laser die attachment

Find how Mycronic is bringing tomorrow´s electronics to life. We supply high precision production solutions to the electronics industry.

Discover Mycronic’s high‑precision SMT machines and complete PCB assembly solutions designed for flexible, efficient electronics manufacturing.

Product areas PCB assembly Photomask equipment Dispensing and coating Bare board testing Die bonding Photonic Interconnects Magnetic Test Applied Plasma PCB assembly by Mycronic Photomask

Mycronic jet printing technology makes it possible to dispense solder paste for the most challenging circuit boards and components. Learn more!

High-Speed Stencil Printing for PCB Assembly Lines. Learn more!

Automated, highly flexible and expandable component storage tower with a small footprint, designed for deployment near the production line.

The richest smt software suite in the industry. Provides fully integrated applications covering the entire chain Enhance your productivity of SMT assembly.

SMT Solutions PCB assembly solutions Case stories Mycronic offers advanced PCB assembly solutions to help streamline the manufacturing process. Our solutions are designed with precision and

Live events pcb-assembly

Mycronic offers advanced PCB assembly solutions to help streamline the manufacturing process. Our solutions are designed with precision and accuracy in mind, and are built to ensure maximum

Each component gets the right amount of solder paste with jet printing technology instead of stencil printing.

Introducing the all-new pick-and-place graphical user interface User-driven design An all-new pick-and-place graphical user interface (GUI) raises the visibility of vital process data while

Mycronic Japan Mycronic Tokyo Mycronic Assembly Solutions Co., Ltd. 1st floor Yokohama Nishiguchi KN Bldg. 2-8-4 Kitasaiwai Nishi-ku, 220-0004 Yokohama-City Kanagawa Prefecture Japan +81 45 320

Mycronic China Shanghai, China Mycronic Co., Ltd (Shanghai Office) Unit 1002, 10th floor, E Block Lane 168, Da Duhe Road Putuo District, 200062 Shanghai P.R. China +86 21 3252 3785/86 +86 21 3252

Mycronic Saint-Egrève Mycronic France, Saint-Egrève Rue Albert Einstein BATIMENT 8 38120 Saint-Egrève France +33 4 7675 8565 Mycronic, Saint-Egrève, France Yes, please contact

Mycronic Germany Mycronic, Germany, Munich Mycronic GmbH Inselkammerstraße 10 D-82008 Unterhaching bei München +49 89 45 24 24 8 - 0 +49 89 45 24 24 8 - 80 Mycronic, Unterhaching, Germany

Mycronic France Mycronic France Mycronic S.A.S 1 rue de Traversière 94513 Rungis Cedex 1 France +33 1 41 80 15 80 +33 1 46 86 77 89 Mycronic, Rungis , France Yes, please contact me