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In the fast-paced world of photonics manufacturing, having the right tools can make all the difference. The MRSI-H1 is designed to meet the demands of high-volume production with its

die-bonding Epoxy Dispenser The Next Generation MRSI-175Ag Epoxy Dispenser is now available In the fast-paced world of advanced packaging and semiconductor manufacturing, precision and efficiency

MRSI Mycronic is proud to sponsor the 7th Annual Automotive LIDAR Conference, taking place online from November 20-21, 2024.

The International Microwave Symposium (IMS) is an annual conference for professionals in the microwave and RF industry.

The rapid adoption of artificial intelligence is driving advancements in optical interconnect technology, resulting in notable improvements in speed, power efficiency, and cost reduction. This

The MRSI-A-L machine is a versatile optical active alignment platform suitable for a wide range of applications, including lens, fiber and other optical components active alignment.

Last year, MRSI Systems launched the MRSI-705HF high force die bonder, a new version of the trusted MRSI-705 that is perfect for sintering and thermocompression bonding applications.

die-bonding MRSI-705 with wafer, conveyor Versatile package handling capabilities: dewar and beyond In today's fast-paced production environments, efficiency and versatility are key. The MRSI-705

March will be a busy month for device packaging exhibitions. Please join MRSI Mycronic at these upcoming events. We hope to see you there to discuss our latest new product innovations. Learn more

The 2025 Optical Fiber Communications Conference and Exhibition (OFC) is back to solidify its status as the premier global event for optical networking and communications. 

The optical components industry demands highly precise and customized equipment for complex optical assembly processes. We have answered this need with our new active aligner - a high-performance

In the November/December 2023 issue of Chip Scale Review, MRSI delves into the fascinating world of automotive light detection and ranging (LiDAR) technology. This article explores the parallels

In the bustling world of technology, May was a month marked by significant events, and MRSI was at the forefront. With appearances at IMAPS New England in Boxborough, MA, and the 2024

Designing and manufacturing electronic components destined for defense applications entails navigating a landscape of exacting standards. These standards demand unparalleled reliability, minimal

If you are looking to pick from tape and do not have a tape and real feature on your machine, then we have a solution for you. The two inch metal tape holder can accommodate four two-inch strips

The MRSI-H1 family of 1-micron flip-chip die bonders stands out as an advanced ultra-precision solution.

MRSI’s die bonding systems are designed to address the challenges of chip packaging with a focus on efficiency, precision, and productivity. These systems feature an advanced, patented

The shareholders in Mycronic AB (publ), corp. reg. no. 556351-2374, are hereby given notice of the Annual General Meeting to be held on Wednesday, May 7, 2025, at 5:00 p.m. at the company’s

Mycronic’s Global Technologies division has acquired Surfx Technologies, a company headquartered in the US, providing atmospheric plasma solutions for surface treatment, including cleaning and

The annual general meeting of Mycronic AB (publ) held on May 7, 2025, resolved to increase the number of shares by a share split, whereby one (1) existing share will be split into two (2) shares.

Mycronic AB (publ) has received an order for a Prexision 8 Entry Evo from an existing customer in Asia. The order value is in the range of USD 10-12 million. Delivery of the system is planned for

Mycronic’s Global Technologies division has acquired RoBAT, a company headquartered in the United Kingdom, which has developed a technology for fast and reliable tests of signal quality on PCBs.

Analysts, investors and media are invited to the presentation of Mycronic’s Q4 2024. The presentation will be held on February 6, 2025, at 10:00 a.m. CET. The report is published on February 6,

Mycronic’s High Flex division will from today operate under the name PCB Assembly Solutions. The new name reflects the division’s growing product offering of advanced production equipment and

Executive management team About executive management Contact Investor Relations Mycronic executive management team consists of seven persons including the CEO. Executive management team Anders

Learn about share performance, dividends, share capital, largest shareholders, share distribution and insiders. See the latest price, change, volume and historical data for Mycronic’s share.

Through innovation, we can accelerate the transition of the electronics industry towards a more sustainable future. For Mycronic, sustainable innovation is about developing products that help our

Mycronic is a leading provider of production solutions for the electronics industries. Learn about our growth and profitability, our goals for net sales, EBIT and Co2, and how we invest in

Certificates At Mycronic we are committed to working in a systematic, consistent, and efficient way to achieve our goals and create value for our customers and stakeholders. We are constantly

Consensus estimates The consensus estimates are provided by Modular Finance and are based on forecasts from analysts following Mycronic. The analysts’ opinions, forecasts, and estimates regarding