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TO-TOSA/ROSA

For TO header products, the laser chip and other die are attached onto a TO base or the vertical post after flipping 90°. To support upcoming 5G wireless deployment, wavelength-division multiplexing (WDM) lasers and electro-absorption modulated lasers (EMLs) are packaged with low-cost TO-headers. These WDM/EML-TOs require the attach of many die and are far more complicated than traditional TO headers that have only 1–2 die. These new TO based devices demand a new class of high-speed die bonder that is capable of multi-die and multi-process production in one machine to achieve the best throughput.

Die Attach

  • Available configurations

    • Eutectic and epoxy stamping in one machine

    • Eutectic or epoxy stamping only

  • 1.5μm placement accuracy

  • Complex TO, such as EML/WDM-TO

  • Multi-die multi-processing TO-can photonic devices

  • All TO forms

TO TOSA ROSA

MRSI-H-TO 1.5μm