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About us
History
Why do customer's choose MRSI?
Partners
Testimonials
About us
Under the MRSI brand, we offer industry-leading die bonders, with superior flexibility, ultra-high-accuracy, and multiple process options. Our product’s' value is further illustrated by our 40+ years of experience in the industry in tandem with our 24/7 reliable field operations.
About us
History
Why do customer's choose MRSI?
Partners
Testimonials
Products
High precision flip-chip die bonders
Submicron Die Bonders
1 Micron Die Bonders
1.5 Micron Die Bonders
3 Micron Die Bonders
5 micron die bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners - MRSI-A-L
Prototyping and training services
Prototyping
MRSI Systems Training Services
Products
MRSI values our customers, and our top priority is meeting our customers needs down to the finest detail. We are proud that all of our products are industry-leading, with superior flexibility, ultra-high-accuracy, and multiple process options.
Products
High precision flip-chip die bonders
Submicron Die Bonders
1 Micron Die Bonders
1.5 Micron Die Bonders
3 Micron Die Bonders
5 micron die bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners - MRSI-A-L
Prototyping and training services
Prototyping
MRSI Systems Training Services
Service & support
Cases
MRSI Systems Automated Microwave Hybrid Manufacturing at TESAT-Spacecom (TESAT)
VPT Components and MRSI Systems jointly address manufacturing challenges
Cases
Cases
MRSI Systems Automated Microwave Hybrid Manufacturing at TESAT-Spacecom (TESAT)
VPT Components and MRSI Systems jointly address manufacturing challenges
Career
Applications
Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
Silicon Photonics
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Applications
Applications
Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
Silicon Photonics
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Processes
Die bonding
Eutectic die bonding
Epoxy die bonding
Processes
Processes
Die bonding
Eutectic die bonding
Epoxy die bonding
News & events
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Events
Press releases
Video gallery
News
Newsletters archive
News & events
News & events
Gallery
Webinars
Events
Press releases
Video gallery
News
Newsletters archive
Contact us
MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Contact us
Visit our contact page for contact details for our sales and support departments.
Contact us
MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Mycronic globalt
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News & events
Events
21 januari, 2025 - 23 januari, 2025
Santa Clara, CA USA
United States of America
English
Chiplet Summit 2025
MRSI Mycronic is sponsoring the Chiplet Summit at the Santa Clara Convention Center.
Learn more
2024-10-31 06:43:40
