News

The High-Performance and Flexible MRSI A-L for Optical Assembly

The optical components industry demands highly precise and customized equipment for complex optical assembly processes. We have answered this need with our new active aligner – a high-performance and flexible solution for manufacturing transceivers, AWGs, LiDAR, silicon photonics, integrated optics, and more.

MRSI shines at May events: showcased and featured

In the bustling world of technology, May was a month marked by significant events, and MRSI was at the forefront. With appearances at IMAPS New England in Boxborough, MA, and the 2024 Semiconductor Advanced Technology Innovation Development and Opportunities Conference in Suzhou, China, we showcased our advanced technology.

Precision and Reliability in Defense Electronics: Exploring MRSI’s Industry-Leading Solutions

Designing and manufacturing electronic components destined for defense applications entails navigating a landscape of exacting standards. These standards demand unparalleled reliability, minimal defect rates, and compact form factors to meet the rigorous demands of the field. MRSI rises to this challenge, offering specialized die bonding solutions finely tuned for aerospace and defense requirements.

Optimizing Die Bonding with Planarity Control: Ensuring Precision in Device Attachment Across Industries

Achieving precise and reliable die bonding is crucial in numerous industries, especially when demanding a high degree of parallelism between bonding surfaces. Planarity control emerges as a vital tool in ensuring such accuracy.

Exploring Automotive LiDAR Packaging Trends

In the November/December 2023 issue of Chip Scale Review, MRSI delves into the fascinating world of automotive light detection and ranging (LiDAR) technology. This article explores the parallels and distinctions between LiDAR and optical transceivers.

Explore the Future of Photonics Industry with MRSI at CSC 2024 Conference

Join MRSI at the upcoming Compound Semiconductor Advanced Technology and Application Conference (CSC) taking place on May 22-23, 2024, in Suzhou, China. Dr. Limin Zhou, the General Manager of MRSI Automation (Shenzhen) Co., Ltd., and Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group), will be presenting a groundbreaking session titled “A New Engine for the Development of Photonics Industry – Generative AI.”

Advancing Microelectronics: MRSI Mycronic’s Presence at IMAPS New England

In the ever-evolving landscape of microelectronics, innovation is paramount. Positioned at the forefront of this technological revolution is MRSI and we are bringing tomorrow’s electronics to life through our assembly solutions. We will be presenting and exhibiting at the IMAPS (International Microelectronics Assembly and Packaging Society) New England Symposium on May 7th, in Boxborough, MA (Booth #406). MRSI is proud to be a Platinum Sponsor again this year.

The MRSI-H1 Family: Unleashing Precision and Agility

The MRSI-H1 family of 1-micron flip-chip die bonders stands out as an advanced ultra-precision solution.

March will be a busy month for device packaging exhibitions. Please join MRSI Mycronic at these upcoming events. We hope to see you there to discuss our latest new product innovations. Learn more about how MRSI is bringing tomorrow’s electronics to life.

MRSI-705HF 5 micron high force die bonder won the award for “Infostone 2023 Optical Communication Most Competitive Equipment”

On December 28, 2023, MRSI (Mycronic Group) received the “Infostone 2023 Optical Communication Most Competitive Equipment” award for the MRSI-705HF 5 micron high force die bonder at the First Suzhou Optoelectronic Technology Industry Forum. There were six awards presented: “The Most Competitive Product of Optical Communication,” “The Most Competitive Equipment of Optical Communication,” “Excellent Technology Award,” “Excellent Quality Award,” “Innovation Breakthrough Award” and “Excellent Equipment Award.”

MRSI New Solution: Tape Holder

Automotive LiDAR: Photonics assembly requirements and trends

MRSI-705HF High Force Die Bonder for power devices and advanced chip packaging

Advanced Packaging for Heterogeneous Integration

Advanced heterogeneous integration for 3-D IC packaging, e.g., chiplet, and optoelectronics packaging requires high-precision die bonders that can perform many different processes, such as thermal compression bonding, DAF bonding, BGA/copper pillar bonding, eutectic bonding, hybrid bonding and more. While these techniques are very different from a process point of view, they share many key requirements for bonding equipment, namely:

Advancing automation: unleashing the power of the automatic tool changing turret

MRSI Mycronic to present at Automotive LIDAR 2023

Join us at the 6th annual Automotive LIDAR conference and exhibition from October 3-5, 2023. This conference is the only event in the world exclusively focused on automotive LIDAR technologies and applications.

Join us at IMAPS in San Diego!

MRSI Systems, Mycronic Group will be exhibiting at the 56th International Symposium on Microelectronics from October 3-4th, 2023 in San Diego, CA. This year’s Symposium will feature 5 technical tracks, plus an Interactive Poster Session.

Join MRSI at ECOC 2023 – The European Conference on Optical Communication

MRSI is excited to announce we will be exhibiting at the 49th exhibition of ECOC in Glasgow, Scotland from October 2-4th, 2023. ECOC is the largest optical communication exhibition in Europe and the key meeting place for everyone in the fibre optic communication technology industry, attracting over 6,500 decision-makers. The event attracts scientists and researchers from major corporations to leading edge universities from all over the world. It’s a perfect opportunity for industry players to demonstrate and present their products to an insightful global audience. ECOC provides an attractive opportunity to see the latest products, discuss the latest trends, exchange ideas, and build stronger relationships with customers and suppliers throughout the entire supply chain.

MRSI to present at the 21st Infostone Optical Communication Market and Technology Conference

MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September 4-5, 2023.

Join MRSI at the China International Optoelectronic Conference (CIOE)

MRSI will be exhibiting at this year’s 24th China International Optoelectronic Exposition. This event will be held from September 6-8th at the Shenzhen World Exhibition and Convention center. Visit MRSI at booth #10B79.

Join MRSI at the China International Optoelectronic Conference (CIOE)

MRSI will be exhibiting at this year’s 24th China International Optoelectronic Exposition. This event will be held from September 6-8th at the Shenzhen World Exhibition and Convention center. Visit MRSI at booth #10B79.

MRSI Air-Knife Needle Cleaning System

Learn why the MRSI-705 is an industry leader in flexibility and reliability

Learn why the MRSI-705 is an industry leader in flexibility and reliability

Learn more about MRSI’s Training Programs

MRSI is currently offering training programs at our Tewksbury, MA facility. These courses are taught by dedicated trainers who are MRSI Applications Engineers with many years of experience with MRSI die bonding and epoxy dispensing solutions. Tailored to meet the unique needs of each customer, the programs encompass vital concepts such as robot orientation, teaching alignments, the die bonding process, and production setup.

Visit MRSI at SEMICON West in San Francisco

SEMICON West, the premier event for the semiconductor industry, is set to take place on July 11-13th, 2023 in San Francisco, CA. The conference and exhibition bring together leaders in the industry to discuss the latest innovations, trends, and developments in the field of semiconductors.

MRSI to exhibit at LASER World of PHOTONICS CHINA 2023 with live demos

MRSI will exhibit at LASER World of PHOTONICS CHINA from July 11-13, 2023 in Hall 7, Booth #7.1B141 of the National Exhibition and Convention Center (Shanghai), in Shanghai, China. At China’s leading photonics exhibition there will be over 1,000 exhibitors representing companies across the entire range of photonics. LASER World of PHOTONICS CHINA presents the full spectrum of the photonics industry – including components and manufacturing equipment.

MRSI has released a comprehensive set of software training videos that are designed to help users get the most out of their MRSI Machines. These videos cover a wide range of topics and are suitable for both beginners and advanced users.

MRSI to present and attend Auto Lidar Tech 2023

MRSI will attend the 5th Auto Lidar Tech Forum from Jun 5-7th in Suzhou, China. This event will focus on the market trends, technological breakthroughs, and practical applications of LIDAR technology.

Join MRSI at IMS in San Diego

The International Microwave Symposium (IMS) is an annual conference that brings together the brightest minds in the microwave and RF industry. This year’s event will take place in San Diego, CA, from June 11-16th, 2023. It’s expected to be an exciting week, with a variety of technical sessions, keynote speakers, and networking events.