IMAPS 2020 Virtual Exhibition

MRSI is Sponsoring the International Microelectronics Assembly and Packaging Society (IMAPS)

MRSI Systems has been a member and proud supporter of IMAPS for more than 30 years and is pleased to sponsor two sessions at the 2020 IMAPS Symposium.

Defense and Harsh Environment

• Detecting a Security Breach and Pinpointing its Source
  David Huntley, PDF Solutions
• Enhancement of Board Level Reliability on Automotive DRAM Package by Optimized Thermal & Mechanical Properties
  Jong Gi Lee, Samsung Electronics (Jin Soo Bae, Yeo-Hoon Yoon, Jun-Ho Lee, Kang-Young Cho)
• Vibration fatigue of High Reliability Solder Alloys subjected to Isothermal Aging in Ball Grid Array Packages
  Arvind Karthikeyan, Auburn University
• Atomic Layer Deposition (ALD) conformal coating for robust and reliable protection of electronics and components in harsh environments
  Rakesh Kumar, Specialty Coating Systems (Sawada Shuichi)

Optical

• Optimizing Package Yield and Reliability with X-ray Inspection
  Sudhakar Raman, SVXR, Inc. (Michael Kwan, Rhiannon Brooks, Andrew Reid, Fred Duewer)
• Optical Link Module for Optical Data Transmission in Smart Catheters
  Jian Li, Delft University of Technology (Vincent Henneken, Marcus Louwerse, Ronald Dekker)
• Control of Advanced Packaging by Improved Optical Profiler Metrology           
  Samuel Lesko, Bruker
• Optics in Mil-Aero Applications
  Lezly Murphy, Lockheed Martin Corp.

The 2020 IMAPS Symposium theme is Enabling a Connected World: Always On!  Read the IMAPS 2020 Technical Program for more details.

We look forward to discussing your assembly challenges and how MRSI continues to develop innovative die bonding and dispensing solutions to meet our customer’s needs. Contact sales.mrsi@mycronic.com to schedule a meeting during the show.

Visit our Virtual Booth for a major announcement!