International Microwave Symposium 2018
MRSI Systems is exhibiting at IMS (Booth #448)—the world’s largest Microwave and RF industry event in Philadelphia, PA at the Pennsylvania Convention Center June 10-15, 2018.
The symposium includes technical and panel sessions about the latest insights such as High Performance Power Amplifiers, Advanced MEMS, 5G sub-systems, IoT, Integrated Microwave Photonics for Millimeter-wave and 5G Applications, and Wireless Communications. IMS has attendees from over 50 countries and 600 exhibiting companies comprising materials, devices, components, and testing and measurement equipment for RF and Microwave applications. This is a great event for industry professionals. For more details visit the IMS website.
Many of MRSI’s long-standing customers are RF and Microwave leading component manufacturers. From Transmitter and Receiver Modules to Power Amplifiers, MRSI has been the platform of choice for these manufacturers. Based on years serving the RF and Microwave Community MRSI has built into our systems many essential features including the ability to handle a wide variety of pickup tool and collets, up to 90 different part numbers in 2” x 2” waffle pack and an unrivaled eutectic capability.
MRSI is a leader in eutectic bonding solutions for the Microwave & RF industries. Eutectic die bonding is used for devices that require a very reliable means of attach such as high power amplifiers. To automate this process, the package or substrate must be presented on or moved to a surface that can be thermally controlled. The die bonding system moves the solder preform and die to the substrate and ramps the temperature to achieve reflow. Ideally, temperature ramp is performed quickly for throughput and quality issues. The process must occur in an inert environment to avoid oxidation. Good coverage is obtained (no voiding) when the system can be programmed to scrub the die into the molten solder.
Leading manufacturers of high-frequency radio modules require fully automated, ultra-precision die bonding systems with in-situ capabilities such as epoxy dispensing and eutectic die bonding. Advanced imaging techniques using pattern recognition are needed to orient components. Force control during the picking and placement operations is a must.
A requirement may exist to align a die to a feature in one axis, such as a die edge to a substrate edge, while also aligning to another feature in another axis, such as a die bond pad to a substrate bond pad. This is known as ‘split alignments’ and is required for some microwave and photonic applications.
In advanced packaging applications die need to be placed with a high degree of precision. Frequently for performance purposes, the die must be placed with a particular accuracy relative to other devices, fiducials, or features. Proper positioning is also necessary for the optimal attach in the epoxy or solder.
MRSI’s die bonders are designed to handle a wide range of processes. Epoxy dispensing pumps, epoxy stamping and eutectic bonding with scrub and temperature control, are all configuration options that make MRSI’s die bonders the leading solution for MEMS device assembly.
Visit MRSI at the IMS Exhibition June 12-14, 2018 to learn more about RF and Microwave applications.
MRSI Systems is a leading manufacturer of fully automated, high-precision, high-speed die bonding and epoxy dispensing systems. We enable customers to optimize the performance of their process including yield, throughput, and uptime by building systems that use our unique expertise. In summary, this includes our proprietary software, proven hardware, deep process knowledge, state-of-the-art manufacturing, and a world-class customer service team. MRSI’s systems are built on common platforms that can be configured to meet specific customer requirements. These platforms are designed to be scalable for R&D prototyping, pilot production and high volume manufacturing. Our solutions deliver the best financial returns in the industry while integrating seamlessly into our customer’s production. Markets include Telecom/Datacom (Data Center), Aerospace & Defense, Medical Devices, Computers and Peripherals, and Industrial. Since 1984, we have been recognized as the standard of the industry, delivering our solutions to leading optoelectronic and microelectronic customers worldwide. We are headquartered in Billerica, MA in the greater Boston area. Our sales are supported by a global network of direct service and support professionals, located in China, Taiwan, Singapore, Korea, Thailand, Malaysia, the Philippines, Israel, Europe, United Kingdom, and the United States.