MRSI-705HF High Force Die Bonder for power devices and advanced chip packaging

MRSI has recently launched the 705HF die bonder, which is designed to cater to the requirements of power devices and advanced chip packaging. The machine is equipped with a heated bond head that can apply up to 500N of force during the bonding process. It is an ideal solution for advanced applications such as sintering for power semiconductors and thermocompression bonding for IC packaging. Sintering is a heat-treatment process that gives greater strength, integrity, and conductivity to the bond and is considered the most reliable technology for connecting components in power electronics. Thermocompression bonding is a technique that uses high temperature and pressure to create strong and reliable interconnections between dies and substrates.

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If you are interested in learning more about this new solution, you can contact us to schedule a demonstration.