MRSI Participated in the 2017 Electronic Components and Technology Conference(ECTC)

There were 106 exhibitors and 1,439 attendees from 22 countries at the conference. Sponsors included Amkor, Cadence, Deca Technologies, Dow Electronic Materials, Lintec, Nanium, Applied Materials, IBM, and Zeiss.

Babak Sabi, Corporate Vice President and Director of Assembly and Test Technology Development, Intel Corporation gave the Keynote presentation on “Advanced Packaging in the New World of Data.”  A key takeaway was – as the world is becoming more reliant on data there is a need for “heterogenous integrations” in advanced packaging.

The conference delivered around 40 technical sessions on various topics including Advanced Packaging, High-Speed Wireless & Components, Optoelectronics, and Emerging Technologies. The future of optoelectronics, as well as leading edge developments and emerging technical innovations were emphasized. One theme emphasized by speakers was the fact that as the optoelectronics packaging market expands, there is increased demand for higher accuracy.

“MRSI Systems was glad to exhibit at the Technology Corner, attend the technical conference, and meet customers at ECTC this year again. ECTC is a great venue for us to learn the latest progress in advanced packaging for the applications of optoelectronics / photonics, RF, medical, sensors and imaging. MRSI is a proven leader in the high performance automatic die bonding equipment market.  Our unmatched offering with superior accuracy, speed and flexibility for multi-die multi-process in one machine, delivers the best solution for advanced packaging of complex products under both R&D and high volume manufacturing environments,” said Dr. Yi Qian, Vice President of Product Management, who participated at ECTC.

Thank you to those who stopped by the MRSI booth. Learn more about our products and upcoming events.