MRSI Systems Announces “One Stop Shop” Die Bonding Solutions & Participation at CIOE and ECOC

CIOE is known as the world’s most influential optoelectronic exhibition. Over 1,650 exhibitions and 60,000 visitors from 65 countries are expected including the world leading optoelectronic manufacturers to display their latest products and technologies. The CIOE Conference is a great opportunity to learn about the latest technology innovations. Featured optoelectronics industry topics including data centers, optical communications, optical manufacturing, optical fiber sensing, AR/VR, infrared applications, laser technologies, etc. The conference will include over 270 presentations and 21 technical seminars.

This demand for systems that can handle the full spectrum of solutions required was illustrated in our recent article featured by Laser Focus World August 2018 issue, “The biggest challenge now facing photonics manufacturing is how to handle the high volume and high mix production. The high mix of products typically originates from new product introduction (NPI), or from changeovers between the different products, which makes it difficult to achieve high volume in production, because you cannot ramp up production as the configurations keep changing. To solve this problem requires flexible high speed automation. Historically, it has been challenging to put flexibility and high speed together for automatic equipment.”

MRSI Systems is pleased to announce our “One Stop Shop” die bonding solutions in response to this challenge. Our MRSI-705 (5μm ) and MRSI-M3 (3μm) die bonders are historically regarded the leaders in flexibility. Last year, MRSI Systems introduced the first high speed product –MRSI-HVM3 (3μm) for CoC packaging This year we expanded this product family with the launch of the additional configuration, MRSI-HVM3P for AOC/PCB and Gold-box packaging. In addition, we introduced the MRSI-H3 (3μm) family with specialized configurations MRSI-H3TO for WDM & EML-TO packaging and MRSI-H3LD for high power diode laser packaging. These high speed products deliver the industry-leading speed without sacrificing flexibility, precision or reliability.

“Our ‘One Stop Shop’ solutions will help our customers to enable just-in-time supply and fast-pace innovations of critical photonic component for high growth market segments such as hyper-scale data centers, photonic sensors, and 5G wireless,” stated Dr. Yi Qian, Vice President Product Management of MRSI Systems. “MRSI Systems has been serving optoelectronic and microelectronic customers for the past thirty-four years and understands their requirement to scale efficiently in today’s fast paced marketplace. MRSI is pleased to meet these needs with the expansion of our high speed die bonder families for high volume manufacturing of photonics packaging,” said Mr. Michael Chalsen, President of MRSI Systems.

With our “One Stop Shop” solutions, we can deliver the spectrum of applications and volume solutions required by our customers. The ultra-flexible MRSI-705 and MRSI-M3 can be used for research and development prototyping to low/medium volume. The ultra-fast MRSI-HVM3 and MRSI-H3 can meet high volume requirements for all key die bonding applications in photonics manufacturing with superior flexibility for multi-dies, multi-process, and multi-products through one machine.  Based upon the same hardware and software platforms, there will be no tool changeover risk for NPI by eliminating the changes of controls or processes already qualified during the development phase. Finally, our ultra-fast product families deliver <3μm placement accuracy for next generation products while improving process yields for manufacturing of current products by tightening assembly tolerance as early as possible in assembly.

Pick up a copy of the Visitor Guide at CIOE and stop by our partner CYCAD’s Booth #1C66 to see a live demo of our ultra-fast die bonder, discuss your requirements and learn more about our “One Stop Shop” solutions that are designed for you.

MRSI Systems will also be exhibiting at ECOC (Booth #577) in Rome, Italy September 24-26, 2018. For more information visit our website or contact us to schedule a meeting at CIOE and ECOC.