MRSI to present at IFOC and Exhibit at CIOE in September in Shenzhen including live product demos

MRSI Systems will exhibit at the 22nd China International Optoelectronic Exposition (CIOE). Live product demos will be offered at MRSI’s booth #8E55. The show will be held at the Shenzhen World Exhibition & Convention Center from September 9-11, 2020.

MRSI will demonstrate the industry-leading 1.5 micrometer die bonder, MRSI-H-LD for high-volume manufacturing of advanced photonics and RF/microwave devices. The system is optimized for applications that bond large die for high-power semiconductor lasers, RF power amplifiers, active optical cables (AOCs), lighting, and sensors. This versatile assembly solution enables our customers to scale their business by delivering high throughput, high reliability, and high flexibility.

CIOE is the world’s most influential optoelectronic exhibition and encompasses the full optoelectronic supply chain. Featured topics include data centers, optical communications, optical manufacturing, AR/VR, LiDAR, and automotive and laser technologies. Exhibitors will be attending from several industries, such as: optical communication, consumer electronics, advanced manufacturing, defense and security, semiconductor processing, sensing and measurement, lighting, and medical.

Targeted configurations for the MRSI-H product family include WDM & EML-TO and high-power laser diode packaging. The MRSI-HVM family has extended configurations which target AOC applications. These options include inline automatic conveyorized loading/unloading, epoxy dispensing, stamping, and UV curing capability. These are critical components for newer applications such as 400G transceivers and silicon photonics.

Find out more about MRSI’s assembly solutions for photonics applications. Witness a demo of our ultra-fast die bonder at CIOE, located at Booth #8E55. You can also visit our website or contact us to schedule a meeting.