Mycronic technology essential in 5G development

5G is the next generation wireless communication standard. It’s the latest iteration of cellular technology, engineered to enable dramatically improved levels of connectivity, significantly higher transfer rates and ultra-reliable low latency communication. The new technology is expected to fuel a groundbreaking digital transition, affecting not only people but also industries, such as manufacturing, transportation, public services and healthcare.

Ultra-low latency – why is it so important?

5G evangelists claim at peak performance, 5G connections could kick up current speeds by nearly 200 times. This is fast enough to download a feature-length movie in a few seconds, compared with nearly an hour via 4G. 5G is also designed to significantly reduce latency - that annoying gap in voice and data communication when you’re on a live call.

This should not only lead to smoother video conferencing, but also enable massive machine-type communications and remote control of critical infrastructure and machinery. The use of technology in medical devices, security systems in cars and other “mission-critical” applications requires no delay and absolute reliability. Why is a shift to a decentralized infrastructure needed to ensure this ultra-low latency?

Edge computing – the new 5G infrastructure

The current infrastructure is a device on a network connected to the cloud - a setup that has unexpected latency. To fully realize 5G’s potential, the industry is shifting to a decentralized model called edge computing. Edge computing reduces latency because the processing happens closer to the user in smaller data centers called edge data centers. This requires high-performance optical devices embedded in datacenters to allow data to flow in and out at maximum speeds. An example of a crucial optical device is a transceiver - a device that combines a transmitter of data and a receiver of data.

5G - smart city and communication network concept.

Mycronic’s die bonding systems essential in edge computing

The change in infrastructure with edge data centers requires advanced optoelectronics and microelectronics. This is where Mycronic technology comes in to play.

Mycronic’s subsidiary MRSI provides the flexible, ultra-precise die-bonding systems needed to produce the category of components that convert electrical signals into optical signals. To build these tiny components MRSI is bonding together tiny parts, working at 1/100 the width of a human hair. The need to miniaturize these components with higher and higher density of parts is relentless and that is why MRSI systems are so essential. This is particularly important for the telecommunications industry and is an essential part of the supply chain supporting the critical infrastructure required. 

Helping our customers overcoming 5G challenges

MRSI’s customers, who manufacture these optical devices, continue to face significant challenges to deliver increasingly smaller packaging housing, with smaller dies (chips) with higher density. The demand for smaller products with higher speed and bandwidth requires a die-bonder capable of supporting customers across a complete spectrum of manufacturing challenges. MRSI’s solution is a high-volume, highly flexible system that meets the accuracy requirements of our customers. We deliver high-volume solutions that are flexible enough to accommodate a customer’s quick product innovations and changing technology needs.

MRSI’s customers are supplying a fast-moving market, requiring constant changes to their product mix, and continuous innovations at breakneck speed. Our ability to build flexible systems quickly and allow our customers to hit their window of opportunity is essential. We have developed innovative hardware and software design solutions that help our customers to overcome crucial challenges.

By staying at the forefront of innovation, producing more precise and faster machines, Mycronic has the potential to bring 5G to life across the globe and become the partner of choice for tomorrow’s innovators.

Die bonding solutions MRSI systems