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About us
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Why do customer's choose MRSI?
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About us
Under the MRSI brand, we offer industry-leading die bonders, with superior flexibility, ultra-high-accuracy, and multiple process options. Our product’s' value is further illustrated by our 40+ years of experience in the industry in tandem with our 24/7 reliable field operations.
About us
History
Why do customer's choose MRSI?
Partners
Testimonials
Products
High precision flip-chip die bonders
Submicron Die Bonders
1 Micron Die Bonders
1.5 Micron Die Bonders
3 Micron Die Bonders
5 micron die bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners - MRSI-A-L
Prototyping and training services
Prototyping
MRSI Systems Training Services
Products
MRSI values our customers, and our top priority is meeting our customers needs down to the finest detail. We are proud that all of our products are industry-leading, with superior flexibility, ultra-high-accuracy, and multiple process options.
Products
High precision flip-chip die bonders
Submicron Die Bonders
1 Micron Die Bonders
1.5 Micron Die Bonders
3 Micron Die Bonders
5 micron die bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners - MRSI-A-L
Prototyping and training services
Prototyping
MRSI Systems Training Services
Service & support
Cases
MRSI Systems Automated Microwave Hybrid Manufacturing at TESAT-Spacecom (TESAT)
VPT Components and MRSI Systems jointly address manufacturing challenges
Cases
Cases
MRSI Systems Automated Microwave Hybrid Manufacturing at TESAT-Spacecom (TESAT)
VPT Components and MRSI Systems jointly address manufacturing challenges
Career
Applications
Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
Silicon Photonics
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Applications
Applications
Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
Silicon Photonics
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Processes
Die bonding
Eutectic die bonding
Epoxy die bonding
Processes
Processes
Die bonding
Eutectic die bonding
Epoxy die bonding
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News & events
News & events
Gallery
Webinars
Events
Press releases
Video gallery
News
Newsletters archive
Contact us
MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Contact us
Visit our contact page for contact details for our sales and support departments.
Contact us
MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Mycronic globalt
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News & events
Press releases
Press releases
30 SEP. 2024, 19:00
MRSI Mycronic introduces next generation high precision epoxy dispenser for advanced packaging
4 SEP. 2024, 15:00
MRSI Mycronic to Showcase Advanced Assembly Solutions for High Volume Photonics Manufacturing at CIOE 2024
19 MARS 2024, 20:00
新机发布|MRSI(Mycronic集团)发布创新MRSI-A-L耦合设备,引领精密光学组件封装新纪元
12 MARS 2024, 15:00
MRSI introduces innovative MRSI-A-L Active Aligner for optical packaging solutions
5 SEP. 2023, 15:15
MRSI introduces 705HF High Force Die Bonder for power devices and advanced chip packaging
21 AUG. 2023, 21:15
MRSI Mycronic to showcase and present innovative die bonder solutions at CIOE 2023
9 AUG. 2023, 15:00
MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023
10 JULI 2023, 15:00
MRSI to exhibit with live demonstrations and present at LASER World of PHOTONICS CHINA
13 SEP. 2022, 11:46
MRSI launches new die bonders with improved accuracy
22 AUG. 2022, 19:00
MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder
18 AUG. 2022, 16:30
MRSI at the China International Optoelectronic Expo
18 AUG. 2022, 08:21
MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Expo
25 JULI 2022, 15:00
MRSI Systems,迈康尼集团宣布与Lumentum达成新合作,将为汽车行业提供创新的激光雷达解决方案
20 JULI 2022, 07:19
MRSI Systems, Mycronic Group announces a new collaboration to provide LiDAR solutions for the Automotive Industry
7 JULI 2022, 07:16
MRSI launches new Die Bonder with improved throughput for high power laser manufacturers
20 OKT. 2021, 15:00
MRSI receives Laser Focus World Innovators Award for H-TO die bonder
20 OKT. 2021, 07:41
MRSI Systems 荣获“2021 Laser Focus World创新大奖”
20 SEP. 2021, 15:00
MRSI to present at Automotive LIDAR 2021
13 SEP. 2021, 15:00
MRSI Systems Announces Chinese Patent Issued Covering Die Placement Head with Turret
13 SEP. 2021, 15:00
MRSI Systems 宣布“DIE PLACEMENT HEAD WITH TURRET” (集成水平转塔之芯片贴装头)已获得中国专利授权
14 AUG. 2021, 21:42
MRSI中国新产品演示中心开业,将出席讯石研讨会,参加CIOE展会并提供现场演示
10 AUG. 2021, 21:42
MRSI opens a new Product Demo Center in China, will present at the Infostone Conference and attend CIOE with live demos
8 JULI 2021, 21:53
MRSI,Mycronic中国深圳新的产品演示中心正式成立
8 JULI 2021, 16:59
MRSI,Mycronic中国深圳新的产品演示中心正式成立
8 JULI 2021, 15:00
MRSI Mycronic Opens New Demo Center in Shenzhen, China
16 MARS 2021, 14:00
MRSI to Offer Live Die Bonding Demos at Laser World of Photonics, March 17-19, 2021
9 FEB. 2021, 15:00
MRSI-S-HVM Submicron Die Bonder won the award for “Infostone 2020 The Most Competitive Optical Communications Product”
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