MRSI Mycronic to Showcase Advanced Assembly Solutions for High Volume Photonics Manufacturing at CIOE 2024
MRSI Mycronic, a part of the Mycronic Group, will be exhibiting and presenting innovative advanced assembly solutions at the 24th China International Optoelectronic Exposition (CIOE) from September 11-13, 2024, at the Shenzhen World Exhibition and Convention Center. As an industry leader for over 40 years, MRSI Mycronic will showcase our family of die bonders and active aligners designed for precision, speed, and reliability that meet the evolving needs of key markets. For example, the rapid deployment of AI clusters demands higher speed optical interconnects that must be packaged using higher accuracy techniques for both single-mode and multi-mode transceivers in high volume manufacturing. MRSI’s new active aligners (MRSI-A-L) and 1-micron die bonders (MRSI-H1/HVM1) meet this challenge perfectly, for all the processes a customer might employ. Please visit our booth to learn about our latest products and applications. MRSI’s technical experts will be on site to discuss your application requirements in-depth.
On September 11th, Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Mycronic and General Manager of MRSI Automation (Shenzhen) Co., Ltd will present “AI-Driven Innovation in Optoelectrical Packaging” at the EPIC (European Photonics Industry Consortium) TechWatch at CIOE. He will introduce the most advanced solutions from MRSI, and how these solutions achieve impressive results to support the growing AI application markets.
During the Optoelectronic Integrated Chip Design and Manufacturing, Packaging Technology Forum on September 12, 2024, Dr. Zhou will present "The evolution of optoelectronic integrated packaging in the AI era." Dr. Zhou will provide insights into the challenges and opportunities of optoelectronic integrated chip assembly within the context of artificial intelligence.
"We are delighted to participate in CIOE 2024 and showcase our latest innovations. With our long-standing commitment to delivering innovative die bonding, active alignment, and dispensing solutions, we look forward to engaging with both existing and potential customers." said Dr. Zhou.
For more information, visit us at booth #10B79 at CIOE or contact us directly to schedule a discussion about our innovative technologies and capabilities.
For additional information, please contact:
Dr. Limin Zhou
General Manager, MRSI Automation (Shenzhen) Co., Ltd., Senior Director of Strategic Marketing, MRSI Mycronic
Tel: +86 135 0289 9401
E-mail: limin.zhou@mycronic.com
About MRSI Systems
MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, silicon photonics, co-packaging optics, 3-D hybrid packaging, and optical imaging products. With 40+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com
About Mycronic
Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Mexico, the Netherlands, Singapore, South Korea, United Kingdom, the United States and Vietnam. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com