MRSI to Offer Live Die Bonding Demos at Laser World of Photonics, March 17-19, 2021

A representation of the MRSI Mycronic booth (Booth #W2.2587)

MRSI Systems (Mycronic Group) will offer live product demonstrations at Laser World of Photonics held at the Shanghai New International Expo Center (Booth #W2.2587) in Shanghai, China March 17-19, 2021.

MRSI is offering demonstrations of the MRSI-H-LD Die Bonder onsite LIVE in our booth, (Booth #W2.2587).  Our Chinese application engineers will be on-site to discuss your process engineering needs and how our die bonders provide assembly solutions for your specific applications. To schedule a live demonstration in the trade show booth and the new demo center contact sales@mrsisystems.com

For additional information, please contact:

Dr. Yi Qian
Vice President and General Manager, MRSI Systems
Tel: +1 (978) 667-9449, e-mail: yi.qian@mycronic.com

Time Zone: ET – Eastern Time
The information in this press release was published March 15, 2021 at 9:00 am ET.

About MRSI Systems

MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com