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12 DEC. 2023, 16:00
NYHET
DIE BONDING SOLUTIONS

MRSI’s latest article in the November/December 2023 issue of Chip Scale Review discusses the similarities and differences between automotive light detection and ranging (LiDAR) and optical transceivers are compared. The photonics device assembly requirements and trends in automotive LiDAR are introduced. From the analysis, an assembly solution for automotive LiDAR is explained. Finally, a demonstration of the solution with actual assembly experiments for typical edge-emitting lasers (EELs) and vertical cavity surface emitting lasers (VCSELs) chips for automotive LiDAR are presented.

Read the full Chip Scale Review article.

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