Our Family of Products

MRSI values our customers, and our top priority is meeting our customers needs down to the finest detail. We are proud that all of our products are industry-leading, with superior flexibility, ultra-high-accuracy, and multiple process options. Our product’s value is further illustrated by our 40+ years of experience in the industry in tandem with our 24/7 reliable field operations.

Sub-micron Flip-chip Die Bonders

The MRSI-S-HVM submicron die bonder is designed for integrated photonics volume manufacturing applications, semiconductor wafer level packaging, multi-chips, and multi-process production in one machine.

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MRSI-HVM Gantry mounted pick and place head with integrated tool changer

1-Micron Flip-Chip Die Bonders

Advanced ultra precision solution for flexibility and volume production – 1 Micron Accuracy.

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1.5 Micron Flip-chip Die Bonders

Advanced high accuracy solutions for flexibility and volume production.

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3 Micron Flip-chip Die Bonders

The ultra flexible MRSI-M3 die bonders can be used for research and development prototyping to low/medium volume.

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5 Micron Flip-chip Die Bonders

The ultra flexible MRSI-705 and MRSI-705HF die bonders can be used for research and development prototyping to low/medium volume.

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MRSI-175Ag is a servo-controlled X, Y, and Z dispensing platform

High Precision Epoxy Dispensers

The MRSI-175Ag epoxy dispenser handles the most demanding dispensing applications such as microwave modules, optical modules, hybrid circuits, multichip modules, and semiconductor packaging.

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Active alignment solutions

MRSI-A-L is a modular–design machine, with integrated pick and place, dispense, vision, alignment functions, as well as intelligent software that offers users flexible processes.

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