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BILLERICA, Mass., August 14, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new High Speed

MRSI系统公司（Mycronic集团）推出MRSI－H3TO新型3微米高速贴片机，这是业界第一款可以真正满足多晶片和多流程的要求，可实现行业领先的贴片速度、卓越的灵活性以及为未来产品准备的3微米贴片精度。 MRSI－H3TO专为WDM与EML－TO或其他多晶片多流程TO－can光电器件量身打造，以支持即将普及的5G无线网络。

die-bonding MRSI Systems推出用于新应用的MRSI-HVM3P新产品 MRSI Systems（Mycronic集团）8月20日在美国马萨诸塞州扩展其业界领先的MRSI－HVM3高速贴片机机平台，推出MRSI－HVM3P新款机型，为有源光缆（AOC）、管盒（Gold－box）封装 以及 基板芯片（CoC）之外 的其他应用提供优化配置。

MRSI系统公司（Mycronic集团）推出MRSI－H3LD新型3微米高速贴片机，专用于大功率半导体激光器中的芯片贴片，广泛应用于工业激光器、光纤放大、光源和传感器等先进光电子应用。

MRSI Systems（Mycronic集团）宣布在其位于深圳龙华的姐妹公司，深圳市轴心自控技术有限公司工厂建立一项新的演示能力。我们将根据客户的样品材料，安排并提供我们市场领先的MRSI－HVM3产品的本地演示以及芯片贴装应用。

BILLERICA, Massachusetts, Aug. 29, 2018 — MRSI Systems (Mycronic Group), is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer

STOCKHOLM, Aug 29, 2018 — MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3 micrometer high speed die bonder which will be the first of its kind to address the multi-die and

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Enabling the next generation of spintronic devices Magnetic Automated Test Equipment for Memory and Sensors Hprobe, part of Mycronic’s Global Technologies division, delivers advanced Magnetic

Choosing a die bonder is important, and we advise considering all options before making a purchase. With MRSI Systems, you can find exactly what you need.

Contact MRSI Systems in Massachusetts for product information, technical support and more. Contact MRSI Systems today for more information!

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MRSI is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems.

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Automation is key for electronics manufacturers to save time, increase quality, and reduce costs in a competitive, dynamic market. Every manufacturing step that can be automated will be.

Cybercrime will cost companies worldwide $10.5 trillion annually by 2025. Read about how Mycronic contributes to cyber security and data protection in the electronics industry.

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Going deeper with AI How Mycronic’s new collaborative deep learning center can help unlock the value of AI Going deeper with AI Together with NuFlare Technology and D2S, with support from NVIDIA,

Big data means big potential - AI Big data means big potential Mycronic’s new collaborative Center for Deep Learning in Electronics Manufacturing (CDLe) in San Jose, California is focused on deep

BRIGHTER BRIGHTER project near completing printing device for human skin BRIGHTER is an EU-financed research project that aims to develop a novel bioprinting technology that will be used to

Discover how Mycronic inspires children and high school students to pursue a career in engineering and solve real-world problems with technology.

First-ever Mycronic Inventor Award goes to Pattern Generators Core Research Team Protecting ideas that matter Lasers make Nur Ismail eyes light up with excitement. Mention “acusto-optic

The Speed of Light and the Future of Photonic Wire Bonding Light, traveling at an astonishing speed of nearly 300,000 kilometers per second in a vacuum, can circumnavigate the Earth about seven and

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Did you know Mycronic die bonders aid in creating medical sensors as part of the treatment for sleep apnea? Mycronic die bonders are utilized in the production of medical sensors for treating

Did you know that Mycronic can assemble electronic components as tiny as a grain of sand? Our MYPro A40 pick-and-place is at the heart of this incredible precision. These advanced machines are

Kristina Svanteson and Sara Mårtenson in a meeting about sustainbility Innovating with solid-state lasers: Mycronic's commitment to climate change Mycronic is committed to do its part to

We transform customer needs into leading market products. Video: Half a century of navigating a fast-changing electronics industry For more than 50 years, Mycronic has brought life-changing

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