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Designed for high-volume manufacturing of advanced photonics and RF / Microwave devices the MRSI-H-LD 1.5 micron die bonder delivers industry-leading speed without sacrificing ultra-high

MRSI Systems will present at the 19th Infostone Optical Communications Conference(IFOC), organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from September

MRSI will exhibit at LASER World of PHOTONICS CHINA 2020 from July 3-5, 2020 in Hall 8, Booth #8.1E416 of the National Exhibition and Convention Center (NECC), in Shanghai, China. There will be

5G infrastructure will require ultra-high bandwidth, latency up to 1 ms, and highly reliable connectivity. In addition, RF architectures need to be scalable, efficient, and extremely compact.

MRSI is exhibiting at the 53rd International Symposium on Microelectronics from October 6-8th, 2020. Visit the MRSI Virtual Booth to chat with our team of technical experts to review our exciting

In this week’s blog post we highlight our recent Laser Focus World published article on the challenges of new TO-can photonic device manufacturing.

The world’s largest Microwave and RF industry event is being held virtually this year. 

MRSI Systems invites you to SEMICON West 2020 Virtual Event from July 20-23, 2020.

MRSI Systems is delighted to announce a new collaboration with Lumentum Operations LLC ("Lumentum", NASDAQ: LITE), a leading global photonic chip and module supplier for the automotive LiDAR

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the

Quantum Technologies The Future of Quantum: Powered by Photonic Integration Quantum technologies are poised to revolutionize fields like computing, communication, and sensing. However, this

Space & Defense Photonic Integration Solutions for Space and Defense The evolution of Space and Defense technologies relies on advanced optical solutions for remote sensing, advanced

AI & Machine Learning Enabling the AI/ML Revolution with Advanced Photonic Packaging The rapid advancements in Artificial Intelligence (AI) and Machine Learning (ML) are driving demand for

Mycronic Global Technologies Business Unit, MRSI Systems announces the recent issuance of utility patent titled “DIE PLACEMENT HEAD WITH TURRET” and numbered ZL 201680048482.5 (PCT/US2016/047135)

ICC讯 在IMAPS 2020上，MRSI Systems推出了新型5微米贴片机产品，面向量产配置的MRSI-705。MRSI-705于2012年首次推出，在贴片机行业中处于领先地位，可在一台机器上为客户提供多种应用解决方案。MRSI-705新的配置提供了创新的水平转塔功能，可以在不牺牲灵活性，准确性和可靠性的前提下，显著提高机器的速度和生产率。

MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful

MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23rd, 2021, a leading event in the

MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high

At IMAPS 2020 MRSI Systems will introduce a new 5 micrometer die bonder product, MRSI-705 high-volume configuration. The MRSI-705 was first introduced in 2012 and has enjoyed a dominant position

die-bonding CIOE 2023 MRSI Booth MRSI Mycronic to showcase and present innovative die bonder solutions at CIOE 2023 MRSI, a part of Mycronic Group, will exhibit our family of die bonders and

die-bonding MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Expo We are proud to announce that MRSI, Mycronic Group will be exhibiting at the 24th

MRSI Systems (Mycronic Group) will offer live product demonstrations at Laser World of Photonics held at the Shanghai New International Expo Center (Booth #W2.2587) in Shanghai, China March

Boston, MA – December 10, 2020 – MRSI Systems, LLC and Palomar Technologies, Inc. jointly announce they have reached a confidential agreement that settles all litigation currently pending between

ID: 80400 | Version: 3 | Published: April 15, 2024 Mycronic group health and safety policy Mycronic is committed to providing a safe, healthy environment for employees, consultants and all those

Choosing a die bonder is important, and we advise considering all options before making a purchase. With MRSI Systems, you can find exactly what you need.

MRSI Systems (Mycronic Group), submicron die bonder MRSI-S-HVM won the award for "The Most Competitive Optical Communications Product in 2020." The MRSI-S-HVM submicron die bonder was recognized

BILLERICA, Mass., August 14, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new High Speed

MRSI系统公司（Mycronic集团）推出MRSI－H3TO新型3微米高速贴片机，这是业界第一款可以真正满足多晶片和多流程的要求，可实现行业领先的贴片速度、卓越的灵活性以及为未来产品准备的3微米贴片精度。 MRSI－H3TO专为WDM与EML－TO或其他多晶片多流程TO－can光电器件量身打造，以支持即将普及的5G无线网络。

BILLERICA, MA — January 31, 2014 — MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, announced today it has completed a leveraged buyout of assets from

Contact MRSI Systems in Massachusetts for product information, technical support and more. Contact MRSI Systems today for more information!