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High Precision Flip-chip Die Bonders

Learn more about MRSI's high precision flip chip die bonders.

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About us

Under the MRSI brand, we leverage over 40 years of industry expertise in high-accuracy die bonders, active aligners, and fluid dispensers to deliver unparalleled reliability and precision for

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History

Learn about MRSI Systems, a MA die bonding and epoxy dispensing system manufacturer in MA.

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Why do customer's choose MRSI?

Learn about MRSI Systems capabilities and what helps MRSI stand apart from the competition in die bonder and epoxy dispensing system manufacturing.

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Thank you for contacting us regarding die bonding

Thank you for contacting us regarding die bonding

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Mycronic Sweden HQ

Mycronic Sweden HQ Mycronic headquarter in the winter Mycronic AB Nytorpsvägen 9 Box 3141 183 03 Täby Sweden +46 8 638 52 00 +46 8 638 52 90 Mycronic Täby Yes, please contact me

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Test Solution (Suzhou) Co. Ltd.

Test Solution (Suzhou) Co. Ltd. Mycronic atg Luther & Maelzer China, Suzhou Industrial Park Test Solution (Suzhou) Co. Ltd. Block 5 # 301, No.5 Xinghan Street Suzhou Industrial Park China +86

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Partners

See MRSI Systems strategic partner companies from all over the world that help MRSI Systems provide unsurpassed products for our customers.

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5 Micron Die Bonders

Learn more about MRSI's 5 micron die bonders.

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On-site training

MRSI offers a comprehensive set of training programs covering our family of products. Contact MRSI Systems to learn more about On-Site Training.

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Prototyping and Training Services

We provide prototyping and small batch die bonding services for our customers to shorten your time to market.

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Smaller, smarter, faster

Just outside of Nürnberg, Germany, one forward-thinking manufacturer is rapidly modernizing its production to meet fast-growing demands for advanced industrial IoT electronics. Thanks to the

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Thinking outside the line

Mr. Liu Haifeng has never been one to stick with the status quo. As General Manager of Wuxi Good Electronics Co., Ltd., he is always on the hunt for the latest production technologies, new

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About us

About us Mycronic's mask writers hold a unique position as the world's sole production solution for advanced photomasks that are essential for manufacturing complex displays. Over several

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Smartphone displays

- make every pixel count Ultra-sharp smartphone displays Challenge Displays seem to be everywhere these days. They're manufactured in the billions. Nevertheless, there's a growing demand

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LCD displays

Take your photomask quality to the highest levels Large area LCD displays Challenge On average, the size of LCD displays has been growing one inch every year. Resolution has been increasing, and

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Join us in March!

March will be a busy month for device packaging exhibitions. Please join MRSI Mycronic at these upcoming events. We hope to see you there to discuss our latest new product innovations. Learn more

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MRSI Systems Launches MRSI-HVM3P for New Applications Extending the MRSI-HVM3 Die Bonder Family

BILLERICA, Massachusetts, Aug. 29, 2018 — MRSI Systems (Mycronic Group), is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer

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Advanced Packaging for Heterogeneous Integration

Advanced heterogeneous integration for 3-D IC packaging, e.g., chiplet, and optoelectronics packaging requires high-precision die bonders that can perform many different processes, such as

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Exploring Automotive LiDAR Packaging Trends

In the November/December 2023 issue of Chip Scale Review, MRSI delves into the fascinating world of automotive light detection and ranging (LiDAR) technology. This article explores the parallels

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MRSI shines at May events: showcased and featured

In the bustling world of technology, May was a month marked by significant events, and MRSI was at the forefront. With appearances at IMAPS New England in Boxborough, MA, and the 2024

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Precision and Reliability in Defense Electronics: Exploring MRSI’s Industry-Leading Solutions

Designing and manufacturing electronic components destined for defense applications entails navigating a landscape of exacting standards. These standards demand unparalleled reliability, minimal

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Advancing automation: unleashing the power of the automatic tool changing turret

In the world of chip packaging and advanced die bonding, the pursuit of efficiency, accuracy, and productivity is a continuous endeavor. MRSI’s die bonding systems offer a cutting-edge patented

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MRSI New Solution: Tape Holder

If you are looking to pick from tape and do not have a tape and real feature on your machine, then we have a solution for you. The two inch metal tape holder can accommodate four two-inch strips

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The MRSI-H1 Family: Unleashing Precision and Agility

The MRSI-H1 family of 1-micron flip-chip die bonders stands out as an advanced ultra-precision solution.

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Join us at IMAPS in San Diego!

MRSI Systems, Mycronic Group will be exhibiting at the 56th International Symposium on Microelectronics from October 3-4th, 2023 in San Diego, CA. This year's Symposium will feature 5

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Join us at OFC!

The 2025 Optical Fiber Communications Conference and Exhibition (OFC) is back to solidify its status as the premier global event for optical networking and communications. 

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Join us at the upcoming events!

MRSI Mycronic will be participating in several optical and device packaging exhibitions. We invite you to attend these upcoming events. We look forward to discussing our latest product

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Meet the MRSI-705: Your Essential Tool for Precision and Reliability in Critical Applications

The MRSI-705 has established itself as a reliable tool in the aerospace, defense, and medical industries, playing a crucial role in mission-critical tasks due to its performance, adaptability,

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The High-Performance and Flexible MRSI A-L for Optical Assembly

The optical components industry demands highly precise and customized equipment for complex optical assembly processes. We have answered this need with our new active aligner - a high-performance