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MRSI Mycronic is proud to sponsor the 7th Annual Automotive LIDAR Conference, taking place online from November 20-21, 2024.

MRSI’s die bonding systems are designed to address the challenges of chip packaging with a focus on efficiency, precision, and productivity. These systems feature an advanced, patented

Last year, MRSI Systems launched the MRSI-705HF high force die bonder, a new version of the trusted MRSI-705 that is perfect for sintering and thermocompression bonding applications.

die-bonding MRSI-705 with wafer, conveyor Versatile package handling capabilities: dewar and beyond In today's fast-paced production environments, efficiency and versatility are key. The MRSI-705

March will be a busy month for device packaging exhibitions. Please join MRSI Mycronic at these upcoming events. We hope to see you there to discuss our latest new product innovations. Learn more

Advanced heterogeneous integration for 3-D IC packaging, e.g., chiplet, and optoelectronics packaging requires high-precision die bonders that can perform many different processes, such as

At the exhibition, MRSI will provide live product demos of the recently launched MRSI-H-HPLD+, a new variant of the successful MRSI-H-HPLD that is tailored for high-power laser die attachment

In the world of chip packaging and advanced die bonding, the pursuit of efficiency, accuracy, and productivity is a continuous endeavor. MRSI’s die bonding systems offer a cutting-edge patented

If you are looking to pick from tape and do not have a tape and real feature on your machine, then we have a solution for you. The two inch metal tape holder can accommodate four two-inch strips

The MRSI-H1 family of 1-micron flip-chip die bonders stands out as an advanced ultra-precision solution.

Find and download archives of the MRSI Newsletter. Find great stories, articles and more or catch up on previous articles.

Quantum Technologies The Future of Quantum: Powered by Photonic Integration Quantum technologies are poised to revolutionize fields like computing, communication, and sensing. However, this

AI & Machine Learning Enabling the AI/ML Revolution with Advanced Photonic Packaging The rapid advancements in Artificial Intelligence (AI) and Machine Learning (ML) are driving demand for

die-bonding MRSI Systems推出用于新应用的MRSI-HVM3P新产品 MRSI Systems（Mycronic集团）8月20日在美国马萨诸塞州扩展其业界领先的MRSI－HVM3高速贴片机机平台，推出MRSI－HVM3P新款机型，为有源光缆（AOC）、管盒（Gold－box）封装 以及 基板芯片（CoC）之外 的其他应用提供优化配置。

MRSI系统公司（Mycronic集团）推出MRSI－H3LD新型3微米高速贴片机，专用于大功率半导体激光器中的芯片贴片，广泛应用于工业激光器、光纤放大、光源和传感器等先进光电子应用。

MRSI Systems（Mycronic集团）宣布在其位于深圳龙华的姐妹公司，深圳市轴心自控技术有限公司工厂建立一项新的演示能力。我们将根据客户的样品材料，安排并提供我们市场领先的MRSI－HVM3产品的本地演示以及芯片贴装应用。

BILLERICA, Massachusetts, Aug. 29, 2018 — MRSI Systems (Mycronic Group), is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer

MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior Director of Strategic Marketing to expand MRSI’s market presence in China. He will

MRSI Systems and CYCAD Century Science and Technology will partner together at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86.

STOCKHOLM, Aug 29, 2018 — MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3 micrometer high speed die bonder which will be the first of its kind to address the multi-die and

ICCSZ讯 近期，全自动，高精度，高速贴贴片与点胶系统的领先制造商MRSI Systems（Mycronic Group）被授予2019年Laser Focus World 创新者奖的光电子器件制造设备类银奖。

STOCKHOLM, Nov 9, 2018 — MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district,

MRSI Systems (Mycronic Group) will be exhibiting with Mycronic at Productronica. Product demos will be offered at the Mycronic Booth #341 in Hall A3 (SMT Cluster). The exhibition will be held at

Going deeper with AI How Mycronic’s new collaborative deep learning center can help unlock the value of AI Going deeper with AI Together with NuFlare Technology and D2S, with support from NVIDIA,

Big data means big potential - AI Big data means big potential Mycronic’s new collaborative Center for Deep Learning in Electronics Manufacturing (CDLe) in San Jose, California is focused on deep

Mycronic France Mycronic France Mycronic S.A.S 1 rue de Traversière 94513 Rungis Cedex 1 France +33 1 41 80 15 80 +33 1 46 86 77 89 Mycronic, 1 Rue Traversière, 94150 Rungis, France Yes,

Mycronic Yokohama Mycronic Yokohama Mycronic Assembly Solutions Co., Ltd. 1st floor Yokohama Nishiguchi KN Bldg. 2-8-4 Kitasaiwai Nishi-ku, 220-0004 Yokohama-City Kanagawa Prefecture Japan +81 45

Mycronic Saint-Egrève Mycronic France, Saint-Egrève Rue Albert Einstein BATIMENT 8 38120 Saint-Egrève France +33 4 7675 8565 Mycronic, Rue Albert Einstein BATIMENT 8, Saint-Egrève,

Mycronic Germany Mycronic, Germany, Munich Mycronic GmbH Inselkammerstraße 10 D-82008 Unterhaching bei München +49 89 45 24 24 8 - 0 +49 89 45 24 24 8 - 80 Mycronic, Biberger Straße

Mexico Mycronic in Plaza Epicentra, San Juan de Ocotan, Mexico Carretera Guadalajara-Tepic No. 7355 – 308 Plaza Epicentra Z.C. 45019 San Juan de Ocotan Zapopan, Jalisco Mexico Carr. Guadalajara -