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Over three decades, MRSI Systems has developed a family of high precision eutectic die bonders for high volume manufacturing of optoelectronics.

die-bonding MRSI CYCAD CIOE Booth 2017 China International Optoelectronic Expo – September 2017 MRSI Systems is exhibiting at CIOE with our Chinese Representative CYCAD Century Science and

Middlesex Community College technology students recently visited our factory in Billerica, MA.

MRSI Systems is exhibiting at IMS (Booth #1847)—the world’s largest Microwave and RF industry trade show in Honolulu, Hawaii June 4-9, 2017.

As the Optoelectronics market is strong and growing, the technical requirements increase the challenges for manufacturers.

The demand for data and bandwidth continues to expand, resulting in the requirement for high volume manufacturing of photonics devices at unprecedented levels.

Increasing demand for data and bandwidth requires high-volume manufacturing of photonics and RF electronics at a level we have never seen before.

Automated processes help clients grow

TESAT’s challenge was to develop an “Automated Microwave Factory” to manufacture complex highly integrated LTCC microwave modules within the frequency range 2 to 77GHz, 24 hours per day including

Find and download archives of the MRSI Newsletter. Find great stories, articles and more or catch up on previous articles.

Contact MRSI Systems in Massachusetts for product information, technical support and more. Contact MRSI Systems today for more information!

MRSI is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems.

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Choosing a die bonder is important, and we advise considering all options before making a purchase. With MRSI Systems, you can find exactly what you need.

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