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MRSI to offer die bonding demonstrations at Productronica

MRSI Systems (Mycronic Group) will be exhibiting with Mycronic at Productronica. Product demos will be offered at the Mycronic Booth #341 in Hall A3 (SMT Cluster). The exhibition will be held at

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High Volume Manufacturing of Photonic Devices: Assembly Starts with Design

The explosive growth of internet traffic demands higher bandwidth in data communications. High volume manufacturing of photonic devices is crucial.

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International Microwave Symposium 2018

MRSI Systems is exhibiting at IMS (Booth #448)—the world’s largest Microwave and RF industry event in Philadelphia, PA at the Pennsylvania Convention Center June 10-15, 2018.

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Fully Automated Die Bonding Systems — The Importance of Proper Lighting

Lighting is an important component of any vision recognition system. When it comes to lighting, it is not a case of “one size fits all.”

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SEMICON West 2018 – MRSI Systems’ Advanced Packaging Solutions

All major optical communication component manufacturers, data center transceiver suppliers, optical network technology groups and, in general, the world of photonics packaging have been facing an

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MRSI Systems Participates in Local Photonics & Advanced Manufacturing Symposiums

MRSI exhibited at the Inaugural WPI/QCC Integrated Photonics Symposium, at WPI October 3, 2018, and Dr. Yi Qian, VP of Marketing, MRSI Systems participated in an industry panel including

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Featured Article Laser Focus World: Challenges for photonics manufacturing in the new data center era

MRSI’s latest article in Laser Focus World’s August Issue Challenges for photonics manufacturing in the new data center era, discusses the high volume and high mix nature of photonics

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China International Optoelectronic Expo – September 2017

die-bonding MRSI CYCAD CIOE Booth 2017 China International Optoelectronic Expo – September 2017 MRSI Systems is exhibiting at CIOE with our Chinese Representative CYCAD Century Science and

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MRSI Systems Supports “Advancing Innovation in Photonics”

die-bonding MRSI Systems Supports “Advancing Innovation in Photonics” Background MRSI Systems is a community member of AIM (American Institute of Manufacturing) Photonics and the local Photonics

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Join MRSI Systems at OFC!

MRSI is exhibiting at the Optical Fiber Communication Conference and Exhibition (OFC) March 21-23, at the Los Angeles Convention Center (Booth 1728). We invite you to explore MRSI’s product

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Technology Students Experience Local Advanced Technology Manufacturer Up Close

Middlesex Community College technology students recently visited our factory in Billerica, MA.

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Visit MRSI Systems at the European Conference on Optical Communications (ECOC) 2017 — New Die Bonder for High Volume Manufacturing

Over three decades, MRSI Systems has developed a family of high precision eutectic die bonders for high volume manufacturing of optoelectronics.

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MRSI Systems Automated Microwave Hybrid Manufacturing at TESAT-Spacecom (TESAT)

TESAT’s challenge was to develop an “Automated Microwave Factory” to manufacture complex highly integrated LTCC microwave modules within the frequency range 2 to 77GHz, 24 hours per day including

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Case Study – Leading Photonic Component Manufacturer Selects MRSI Systems to Produce Photonic Components Faster

The demand for data and bandwidth continues to expand, resulting in the requirement for high volume manufacturing of photonics devices at unprecedented levels.

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Advanced Vision Systems

Increasing demand for data and bandwidth requires high-volume manufacturing of photonics and RF electronics at a level we have never seen before.

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Automated Die Bonding for High Volume Optoelectronics Packaging

As the Optoelectronics market is strong and growing, the technical requirements increase the challenges for manufacturers.

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The Resurgence of Optical Communication: MRSI Mycronic's Award-Winning Innovation

The rapid advancement of artificial intelligence has brought renewed attention to the optical communication industry. This sector, now favored by both capital market and commercial customers, is

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Cases

Automated processes help clients grow

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Join MRSI Mycronic at SPIE Photonics West 2026!

We invite you to visit our booth (#5145) at SPIE Photonics West, held from January 20–22, 2026, at the Moscone Center in San Francisco. This premier exhibition for optics and photonics provides a

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International Microwave Symposium 2017

MRSI Systems is exhibiting at IMS (Booth #1847)—the world’s largest Microwave and RF industry trade show in Honolulu, Hawaii June 4-9, 2017.

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MRSI receives Laser Focus World Innovators Award for H-TO die bonder

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the

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MRSI Mycronic announces advanced high-speed 1µm die bonder MRSI-LEAP for ultra-high-volume manufacturing of AI optical module applications

MRSI Mycronic is proud to announce the launch of the MRSI-LEAP high-speed 1µm die bonder. This innovative equipment is designed for ultra-high-volume manufacturing of optical modules,

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MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the

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MRSI Mycronic to showcase high-speed assembly solutions at CIOE 2025

die-bonding MRSI Mycronic CIOE Booth 2025 MRSI Mycronic to showcase high-speed assembly solutions at CIOE 2025 MRSI Mycronic, part of the Mycronic Group, will present advanced assembly solutions

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MRSI introduces innovative MRSI-A-L Active Aligner for optical packaging solutions

MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, proudly introduces the MRSI-A-L

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MRSI launches new Die Bonder with improved throughput for high power laser manufacturers

MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful

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MRSI to present at Automotive LIDAR 2021

MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23rd, 2021, a leading event in the

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MRSI introduces 705HF High Force Die Bonder for power devices and advanced chip packaging

MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high

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MRSI Mycronic to showcase and present innovative die bonder solutions at CIOE 2023

die-bonding CIOE 2023 MRSI Booth MRSI Mycronic to showcase and present innovative die bonder solutions at CIOE 2023 MRSI, a part of Mycronic Group, will exhibit our family of die bonders and

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MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Expo

die-bonding MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Expo We are proud to announce that MRSI, Mycronic Group will be exhibiting at the 24th