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MRSI Systems will present at the 19th Infostone Optical Communications Conference(IFOC), organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from September

MRSI will exhibit at LASER World of PHOTONICS CHINA 2020 from July 3-5, 2020 in Hall 8, Booth #8.1E416 of the National Exhibition and Convention Center (NECC), in Shanghai, China. There will be

5G infrastructure will require ultra-high bandwidth, latency up to 1 ms, and highly reliable connectivity. In addition, RF architectures need to be scalable, efficient, and extremely compact.

MRSI is exhibiting at the 53rd International Symposium on Microelectronics from October 6-8th, 2020. Visit the MRSI Virtual Booth to chat with our team of technical experts to review our exciting

In this week’s blog post we highlight our recent Laser Focus World published article on the challenges of new TO-can photonic device manufacturing.

MRSI’s latest article in Laser Focus World’s February Issue “Die-bonder innovations target HPLD manufacturing challenges” discusses the die bonding challenges of High-power laser diodes (HPLDs)

The world’s largest Microwave and RF industry event is being held virtually this year. 

MRSI Systems invites you to SEMICON West 2020 Virtual Event from July 20-23, 2020.

TESAT’s challenge was to develop an “Automated Microwave Factory” to manufacture complex highly integrated LTCC microwave modules within the frequency range 2 to 77GHz, 24 hours per day including

MRSI Mycronic is proud to announce the launch of the MRSI-LEAP high-speed 1µm die bonder. This innovative equipment is designed for ultra-high-volume manufacturing of optical modules,

die-bonding MRSI Mycronic CIOE Booth 2025 MRSI Mycronic to showcase high-speed assembly solutions at CIOE 2025 MRSI Mycronic, part of the Mycronic Group, will present advanced assembly solutions

The demand for data and bandwidth continues to expand, resulting in the requirement for high volume manufacturing of photonics devices at unprecedented levels.

Increasing demand for data and bandwidth requires high-volume manufacturing of photonics and RF electronics at a level we have never seen before.

As the Optoelectronics market is strong and growing, the technical requirements increase the challenges for manufacturers.

The rapid advancement of artificial intelligence has brought renewed attention to the optical communication industry. This sector, now favored by both capital market and commercial customers, is

Automated processes help clients grow

We invite you to visit our booth (#5145) at SPIE Photonics West, held from January 20–22, 2026, at the Moscone Center in San Francisco. This premier exhibition for optics and photonics provides a

MRSI Systems, Mycronic Group will be exhibiting at the 55th International Symposium on Microelectronics from October 4-5th in Boston Massachusetts at the Hynes Convention Center.

Various die bonding approaches have been, and still are, developed to meet the ever-evolving product requirements.

MRSI Systems thinks from the customer’s perspective and upholds strict protocols to ensure your desired configuration, has been built to proper specification. MRSI’s core value of acting like an

The optical components industry demands highly precise and customized equipment for complex optical assembly processes. We have answered this need with our new active aligner - a high-performance

MRSI Systems wins 2022 Infostone award for outstanding technology for their world-renowned die bonder!

These videos help you to discover advanced features of our MRSI machines, which will ensure your production line is optimized.

At the exhibition, MRSI will provide live product demos of the recently launched MRSI-H-HPLD+, a new variant of the successful MRSI-H-HPLD that is tailored for high-power laser die attachment

We are pleased to be exhibiting again this year at the 50th ECOC in Frankfurt am Main, Germany.

die-bonding Join MRSI at SPIE Photonics West in San Francisco Join MRSI at SPIE Photonics West in San Francisco Meet with MRSI Systems, Mycronic Group in San Francisco Booth #5405 MRSI will be

die-bonding Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Mycronic and General Manager

MRSI Systems (Mycronic Group), submicron die bonder MRSI-S-HVM won the award for "The Most Competitive Optical Communications Product in 2020." The MRSI-S-HVM submicron die bonder was recognized

MRSI Systems (Mycronic Group) will exhibit at the 23rd China International Optoelectronic Exposition (CIOE) at the Shenzhen World Exhibition & Convention Center from September 16-18, 2021. MRSI

ICC讯 在CIOE 2020，MRSI SYSTEMS将推出一款新产品，高速、灵活的0.5微米 MRSI-S-HVM 贴片机，为硅光器件，协同封装的电子和光子芯片，以及晶圆级封装应用提供解决方案。