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High Volume Manufacturing of Photonic Devices: Assembly Starts with Design

The explosive growth of internet traffic demands higher bandwidth in data communications. High volume manufacturing of photonic devices is crucial.

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Fully Automated Die Bonding Systems — The Importance of Proper Lighting

Lighting is an important component of any vision recognition system. When it comes to lighting, it is not a case of “one size fits all.”

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Case Study – Leading Photonic Component Manufacturer Selects MRSI Systems to Produce Photonic Components Faster

The demand for data and bandwidth continues to expand, resulting in the requirement for high volume manufacturing of photonics devices at unprecedented levels.

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Advanced Vision Systems

Increasing demand for data and bandwidth requires high-volume manufacturing of photonics and RF electronics at a level we have never seen before.

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Automated Die Bonding for High Volume Optoelectronics Packaging

As the Optoelectronics market is strong and growing, the technical requirements increase the challenges for manufacturers.

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China International Optoelectronic Expo – September 2017

die-bonding MRSI CYCAD CIOE Booth 2017 China International Optoelectronic Expo – September 2017 MRSI Systems is exhibiting at CIOE with our Chinese Representative CYCAD Century Science and

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Join MRSI Systems at OFC!

MRSI is exhibiting at the Optical Fiber Communication Conference and Exhibition (OFC) March 21-23, at the Los Angeles Convention Center (Booth 1728). We invite you to explore MRSI’s product

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Technology Students Experience Local Advanced Technology Manufacturer Up Close

Middlesex Community College technology students recently visited our factory in Billerica, MA.

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International Microwave Symposium 2017

MRSI Systems is exhibiting at IMS (Booth #1847)—the world’s largest Microwave and RF industry trade show in Honolulu, Hawaii June 4-9, 2017.

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Career

Career Available jobs About us Apprenticeship program See your future opportunities here See your future opportunities here. What we offer. Education for future industrial clerks, technical

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Flying probe for substrate test

Flying probe for substrate test S3 S3-8 S3-8 The S3 is able to test 10 µm structures while achieving 100 measurements per second. The shuttle of the S3-8 can clamp and tension double sided

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Apprenticeship program

Apprenticeship program Are you interested in an apprenticeship in an international company? At atg Mycronic in Wertheim, we offer apprenticeship programs for future industrial clerks and

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Job advertisements

Stellenanzeigen Here you will find the right job!

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Best Technology Award Founder

bare-board-testning atg Luther & Maelzer GmbH won the "Best Technology Award" of Founder PCB in 2024 On January 10, 2025, the 2024 Founder PCB Supplier Conference was held in Zhuhai.

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Solutions

Solutions Flying ahead in Michigan with Calumet A9a Mycronic is providing its latest Flying Probe electrical testing system. atg Mycronic Solutions

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Best Support Award from Bomin

bare-board-testning "Shaping the Future, Igniting New Journeys" atg Luther & Mealzer GmbH Awarded Bomin’s 2025 "Best Support Award" On May 24, 2025, the grand opening ceremony

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Excellent Partner Award from SCC

bare-board-testning Excellent Partner Award from SCC atg Luther & Maelzer's Chinese unit, Test Solutions (Suzhou) Co (TSL), was invited to the supplier meeting in Guangzhou by its customer

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Exhibit at IPC Apex 2024

bare-board-testning atg Luther & Maelzer exhibit at IPC Apex 2024 atg Luther Maelzer (a Mycronic company) will showcase their latest technology, the A9 with Automation (A9aL), at the upcoming

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Exhibit at IPC Apex 2023

bare-board-testning atg Luther & Maelzer exhibit at IPC Apex 2023 This years IPC Apex show was held for the last time in sunny San Diego. The overall attendance over three days was approximately

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Exhibit at CPCA 2024

bare-board-testning atg Luther & Maelzer exhibit at CPCA 2024 This year's CPCA trade fair took place from 13 to 15 May 2024 at the National Exhibition Center in Shanghai. More than 700

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MyCare Barebord testing

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Testimonials

See what real MRSI Systems customers are saying about our Die Bonding and Epoxy Dispensing systems and how they have helped them succeed.

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1 Micron Die Bonders

Learn more about MRSI's 1 micron die bonders.

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1.5 Micron Die Bonders

Learn more about MRSI's 1.5 micron die bonders.

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High Precision Flip-chip Die Bonders

Learn more about MRSI's high precision flip chip die bonders.

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MRSI Mycronic announces advanced high-speed 1µm die bonder MRSI-LEAP for ultra-high-volume manufacturing of AI optical module applications

MRSI Mycronic is proud to announce the launch of the MRSI-LEAP high-speed 1µm die bonder. This innovative equipment is designed for ultra-high-volume manufacturing of optical modules,

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MRSI Mycronic to showcase high-speed assembly solutions at CIOE 2025

die-bonding MRSI Mycronic CIOE Booth 2025 MRSI Mycronic to showcase high-speed assembly solutions at CIOE 2025 MRSI Mycronic, part of the Mycronic Group, will present advanced assembly solutions

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MRSI introduces innovative MRSI-A-L Active Aligner for optical packaging solutions

MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, proudly introduces the MRSI-A-L

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Webinars

die-bonding

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ATC Auto Lidar

“Solutions for Mass Production of Vehicle LiDAR.” LiDAR has become a critical sensor for autonomous driving.