Sök

Redeye - Still masked potential in Mycronic In the Q2 report released 14th of July, Mycronic showed an unexpectedly strong profitability in Assembly Solutions and the delivery of 3 advanced

Mer om Mycronic Mycronic is a global high-tech company whose innovative solutions have been advancing electronics technology for over 40 years. Om oss Mycronic är en global ledare som

Delårsrapport januari-september 2014 Tredje kvartalet juli-september 2014 Orderingången uppgick till 842 (232) MSEK Nettoomsättningen uppgick till 338 (220) MSEK Rörelseresultatet

Bokslutskommuniké och helåret 2013 Fjärde kvartalet 2013 Nettoomsättningen uppgick till 325 (481) MSEK Rörelseresultatet uppgick till 42 (119) MSEK Resultatet per aktie uppgick

Datum för Mycronics extra utdelning fastställt Vid årsstämman i Mycronic AB (publ) den 6 maj 2014 beslutades om utdelning till aktieägarna om 2,50 kronor per aktie, under

I N B J U D A N - Press- och analytikerträff Mycronic presenterar resultatet för tredje kvartalet och delårsperioden januari-september 2014 Datum: Tisdagen den 28 okt 2014 Tid: 09.00

Redeye - Tidig leverans utav Mycronics Detta är en kort uppdatering med anledning av Mycronics pressmeddelande om ändrad helårsprognos på grund av tidigare leverans av den

MYPro A40SX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience.

MYPro A40LX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience.

MYPro S20 - stencil printer Intelligent vision and 2D inspection Brochure Contact MYPro S series brochure MYPro S series specifications High accuracy meets high flexibility In the MYPro S series,

MYPro S30 - stencil printer Intelligent vision and 2D inspection Brochure Contact MYPro S series brochure MYPro S series specifications Repeatable precision for higher throughput   Robust,

For detailed Data Sheets please contact Sales. The MRSI-HVM product family has proved to be the best-in-class die bonder with leading speed, zero-time tool change between dies, and <1.5 micron

For detailed Data Sheets please contact Sales. The MRSI-705 5-Micron Flip-Chip Die Bonder sets the mark for high-precision, high-speed component assembly within a flexible, configurable platform.

For detailed Data Sheets please contact Sales. The MRSI-S-HVM submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging

For detailed Data Sheets please contact Sales. The MRSI-H family provides proven superior flexibility for true multi-die, multi-process, multi-product high volume high mix production.

For detailed Data Sheets please contact Sales.

For detailed Data Sheets please contact Sales. The MRSI-H1 family provides proven superior flexibility for true multi-die, multi-process, multi-product high volume high mix production.

For detailed Data Sheets please contact Sales. The MRSI-705HF is equipped with a heated bond head that can apply up to 500N of force during the bonding process, while providing heating up to

For detailed Data Sheets please contact Sales. For detailed Data Sheets please contact Sales. The MRSI-M3 3-Micron flip-chip Die Bonder sets the industry standard for ultra-precision,

For detailed Data Sheets please contact Sales. The MRSI-HVM1 product has proved to be the best-in-class die bonder with leading speed, zero-time tool change between dies, and 1 micron accuracy.

One versatile platform. Twice the possibilities. MYPro series MY700TM Jet Printer and Dispenser MYPro series MY700TM  Jet Printer and Dispenser Specifications March 2022 Millions of

Millions of high-precision dots. The MY700 Jet Printer makes it possible to handle the most challenging boards and components with micrometer accuracy, maximum speed and perfect quality solder

The all-in-one solder paste and assembly fluid solution. MY700JX allows you to combine operator-independent solder paste jet printing with high-speed jet dispensing of adhesives, UV materials,

MY300HX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience. It

The MYCenter Analysis dashboard software provides actionable data to increase utilization, reduce reject rates and improve line balancing in real time.

MYD50 in-line dispenser Brochure Contact us Brochure MYD Linear motor drive in-line dispensers For higher-precision applications such as complex chip packaging, the powerful MYD50 platform

The new Prexision series setting the global standards for displays. 

A5 Neo Flying Probe Test System For Rigid and Flexible Boards. 

All the power of the MYPro I series 3D AOI in dual lane configuration.

PI Pico - 3D SPI Brochures Contact PI series 3D SPI brochure and specifications High accuracy and repeatability 3D SPI with auto-programming Clear and simple inspection control Clarity and