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MRSI Systems, Mycronic Group announces a new collaboration to provide LiDAR solutions for the Automotive Industry

MRSI Systems is delighted to announce a new collaboration with Lumentum Operations LLC ("Lumentum", NASDAQ: LITE), a leading global photonic chip and module supplier for the automotive LiDAR

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MRSI receives Laser Focus World Innovators Award for H-TO die bonder

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the

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MRSI Systems欢迎资深光电子专家周利民博士出任战略营销高级总监

2019年2月13日–全球领先的半导体系统设备制造商Mycronic集团的子公司,MRSI Systems今日荣幸宣布,光电子资深专家周利民博士将加入公司团队并担任战略营销高级总监,负责拓展MRSI Systems在中国的市场影响力。周博士在光电子行业拥有的丰富专业知识,以及他在中国市场的知名度将有助于推动MRSISystems市场战略布局,制定清晰的产品路线图,以及增强MRSI

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MRSI Systems 宣布“DIE PLACEMENT HEAD WITH TURRET” (集成水平转塔之芯片贴装头)已获得中国专利授权

MRSI Systems宣布“DIE PLACEMENT HEAD WITH TURRET”(集成水平转塔之芯片贴装头)已获得中国专利授权。迈康尼全球技术部的业务部门-MRSI Systems宣布,中华人民共和国国家知识产权局(CNIPA)已于2021年7月30日授权MRSI Systems 申请的“DIE PLACEMENT HEAD WITH

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MRSI宣布MRSI-H / HVM系列贴片机精度提升至1.5微米

MRSI Systems(Mycronic Group)很高兴宣布公司MRSI-H / HVM系列产品线的最新进展。MRSI使用行业标准玻璃芯片参考样品测试放置精度,测试结果显示,产品精度从3Sigma的±3微米增强至±1.5微米。该产品从2019年10月1日发货开始,产品名称改为MRSI-H和MRSI-HVM(之前称为MRSI-H3和MRSI-HVM3)。

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MRSI Systems Welcomes Dr. Limin Zhou as Senior Director of Strategic Marketing

MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior Director of Strategic Marketing to expand MRSI’s market presence in China. He will

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MRSI launches new Die Bonder with improved throughput for high power laser manufacturers

MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful

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MRSI to present at Automotive LIDAR 2021

MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23rd, 2021, a leading event in the

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MRSI-S-HVM Submicron Die Bonder won the award for “Infostone 2020 The Most Competitive Optical Communications Product”

MRSI Systems (Mycronic Group), submicron die bonder MRSI-S-HVM won the award for "The Most Competitive Optical Communications Product in 2020." The MRSI-S-HVM submicron die bonder was recognized

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MRSI将出席第18届ICCSZ OC市场与技术研讨会,并在CIOE提供贴片演示

MRSI Systems(Mycronic Group)赞助由ICCSZ举办的第18届光纤通讯市场暨技术专题研讨会,研讨会将于9月2日至3日在中国深圳举行。同期,中国国际光电博览会(CIOE)于2019年9月4日至7日在中国深圳隆重召开。

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MRSI发布为硅光器件、协同封装和晶圆级封装提供亚微米级贴片解决方案

ICC讯 在CIOE 2020,MRSI SYSTEMS将推出一款新产品,高速、灵活的0.5微米 MRSI-S-HVM 贴片机,为硅光器件,协同封装的电子和光子芯片,以及晶圆级封装应用提供解决方案。

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MRSI to present at 18th ICCSZ OC Market and Technology Seminar and offer die bonder demonstrations at CIOE

MRSI Systems and CYCAD Century Science and Technology will partner together at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86.

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MRSI推出升级版MRSI-705贴片机 助力大批量制造

ICC讯 在IMAPS 2020上,MRSI Systems推出了新型5微米贴片机产品,面向量产配置的MRSI-705。MRSI-705于2012年首次推出,在贴片机行业中处于领先地位,可在一台机器上为客户提供多种应用解决方案。MRSI-705新的配置提供了创新的水平转塔功能,可以在不牺牲灵活性,准确性和可靠性的前提下,显著提高机器的速度和生产率。

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MRSI HVM系列贴片机荣获Laser Focus World创新者奖

ICCSZ讯 近期,全自动,高精度,高速贴贴片与点胶系统的领先制造商MRSI Systems(Mycronic Group)被授予2019年Laser Focus World 创新者奖的光电子器件制造设备类银奖。

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MRSI launches MRSI-705 high-volume configuration

At IMAPS 2020 MRSI Systems will introduce a new 5 micrometer die bonder product, MRSI-705 high-volume configuration. The MRSI-705 was first introduced in 2012 and has enjoyed a dominant position

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MRSI to offer die bonding demonstrations at Productronica

MRSI Systems (Mycronic Group) will be exhibiting with Mycronic at Productronica. Product demos will be offered at the Mycronic Booth #341 in Hall A3 (SMT Cluster). The exhibition will be held at

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MRSI Systems and Palomar Technologies Reach Agreement in Intellectual Property Dispute

Boston, MA – December 10, 2020 – MRSI Systems, LLC and Palomar Technologies, Inc. jointly announce they have reached a confidential agreement that settles all litigation currently pending between

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Join us in March!

March will be a busy month for device packaging exhibitions. Please join MRSI Mycronic at these upcoming events. We hope to see you there to discuss our latest new product innovations. Learn more

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Advanced Packaging for Heterogeneous Integration

Advanced heterogeneous integration for 3-D IC packaging, e.g., chiplet, and optoelectronics packaging requires high-precision die bonders that can perform many different processes, such as

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Join MRSI at the China International Optoelectronic Conference (CIOE)

At the exhibition, MRSI will provide live product demos of the recently launched MRSI-H-HPLD+, a new variant of the successful MRSI-H-HPLD that is tailored for high-power laser die attachment

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Visit MRSI at SEMICON West in San Francisco

SEMICON West, the premier event for the semiconductor industry, is set to take place on July 11-13th, 2023 in San Francisco, CA.

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Advancing automation: unleashing the power of the automatic tool changing turret

In the world of chip packaging and advanced die bonding, the pursuit of efficiency, accuracy, and productivity is a continuous endeavor. MRSI’s die bonding systems offer a cutting-edge patented

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MRSI New Solution: Tape Holder

If you are looking to pick from tape and do not have a tape and real feature on your machine, then we have a solution for you. The two inch metal tape holder can accommodate four two-inch strips

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Learn more about MRSI’s Training Programs

die-bonding Learn more about MRSI’s Training Programs MRSI is currently offering training programs at our Tewksbury, MA facility. These courses are taught by dedicated trainers who are MRSI

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MRSI to exhibit at LASER World of PHOTONICS CHINA 2023 with live demos

die-bonding LASER World of PHOTONICS CHINA 2023 MRSI Booth MRSI to exhibit at LASER World of PHOTONICS CHINA 2023 with live demos MRSI will exhibit at LASER World of PHOTONICS CHINA from July

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Join us at IMAPS in San Diego!

MRSI Systems, Mycronic Group will be exhibiting at the 56th International Symposium on Microelectronics from October 3-4th, 2023 in San Diego, CA. This year's Symposium will feature 5

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MRSI Air-Knife Needle Cleaning System

MRSI recently introduced the air-knife vacuum system for cleaning epoxy dispense needles and it is now a standard feature on all MRSI dispense systems.

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Challenges and Solutions in the Photonics Packaging Industry

This increased demand for photonics components is driven by the growth in optical networks. Learn more about Photonics Packaging by reading more from MRSI Systems!

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Die Bonding Solutions

Having a proven ultra-accurate die bonding system platform that is mechanically and thermally stable, with no cantilevered parts, are essential elements to achieve accurate device placement.

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Mycronic technology essential in 5G development

die-bonding Mycronic technology essential in 5G development Die bonding systems are required for the groundbreaking digital transition Mycronic technology essential in 5G development 5G is