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MRSI North America
MRSI is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems.
Comparison of Speed and Throughput
In the realm of Contract Manufacturing (CM), selecting the right equipment is a nuanced decision shaped by a myriad of variables. These factors are essential for enabling CMs to bid competitively
MRSI to Showcase Innovation at the Asia Photonics Expo 2026
MRSI, a global leader in precision assembly solutions for the photonics industry, is excited to announce its participation in the upcoming Asia Photonics Expo (APE), scheduled to take place in
MRSI at CIOE 2025: Showcasing the MRSI-LEAP Die Bonder
MRSI is pleased to announce the presentation of its latest innovation, the MRSI-LEAP Die Bonder, at the China International Optoelectronic Expo (CIOE) in Shenzhen, taking place from September 10th
Join us at the Optical Fiber Communications Conference and Exhibition (OFC) in Los Angeles!
die-bonding OFC 2026 MRSI to exhibit Join us at the Optical Fiber Communications Conference and Exhibition (OFC) in Los Angeles! The exhibition features more than 700 industry-leading companies
Join MRSI at the International Microwave Symposium in San Francisco
The International Microwave Symposium (IMS) is an annual conference for professionals in the microwave and RF industry.
Dr. Limin Zhou to present at the Semiconductor Advanced Technology Innovation Development and Opportunities Conference
The rapid adoption of artificial intelligence is driving advancements in optical interconnect technology, resulting in notable improvements in speed, power efficiency, and cost reduction. This
Learn more about our active alignment solutions
The MRSI-A-L machine is a versatile optical active alignment platform suitable for a wide range of applications, including lens, fiber and other optical components active alignment.
Join us in Phoenix!
We are thrilled to announce our presence at SEMICON West in its dynamic new location—Phoenix, AZ. Experience firsthand the future of die bonding, active alignment, fluid and epoxy dispensing as
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Join us at OFC!
The 2025 Optical Fiber Communications Conference and Exhibition (OFC) is back to solidify its status as the premier global event for optical networking and communications.
Join us at the upcoming events!
MRSI Mycronic will be participating in several optical and device packaging exhibitions. We invite you to attend these upcoming events. We look forward to discussing our latest product
Meet the MRSI-705: Your Essential Tool for Precision and Reliability in Critical Applications
The MRSI-705 has established itself as a reliable tool in the aerospace, defense, and medical industries, playing a crucial role in mission-critical tasks due to its performance, adaptability,
MRSI-H1: Comprehensive High-Precision Die Bonding Solutions
In the fast-paced world of photonics manufacturing, having the right tools can make all the difference. The MRSI-H1 is designed to meet the demands of high-volume production with its
The Next Generation MRSI-175Ag Epoxy Dispenser is now available
die-bonding Epoxy Dispenser The Next Generation MRSI-175Ag Epoxy Dispenser is now available In the fast-paced world of advanced packaging and semiconductor manufacturing, precision and efficiency
MRSI Mycronic to Present at the 7th Annual Automotive LIDAR Conference
MRSI Mycronic is proud to sponsor the 7th Annual Automotive LIDAR Conference, taking place online from November 20-21, 2024.
Advanced Patented Tool Change Turret from MRSI: Revolutionizing Precision Technology
MRSI’s die bonding systems are designed to address the challenges of chip packaging with a focus on efficiency, precision, and productivity. These systems feature an advanced, patented
Innovation Continues on MRSI-705HF
Last year, MRSI Systems launched the MRSI-705HF high force die bonder, a new version of the trusted MRSI-705 that is perfect for sintering and thermocompression bonding applications.
Versatile package handling capabilities: dewar and beyond
die-bonding MRSI-705 with wafer, conveyor Versatile package handling capabilities: dewar and beyond In today's fast-paced production environments, efficiency and versatility are key. The MRSI-705
专访MRSI SYSTEMS周利民:MRSI-HVM-p系列贴片机助力光通讯产业高速发展
摘要:9月16-18日,CIOE 2021期间,MRSI SYSTEMS携携最新的MRSI-HVM带轨道双机头固晶机精彩亮相。在4B79展台,讯石以现场视频直播方式走进MRSI SYSTEMS展台参观了正在进行演示的产品,MRSI SYSTEMS战略营销高级总监周利民博士向观众介绍本次参展的新产品。
Interview with MRSI Systems Dr. Limin Zhou: MRSI Die Bonders support the fast growth of the optical communication market
During 2021 CIOE in Shenzhen, China, Infostone, interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Systems (Mycronic Group) to discuss MRSI’s latest product developments and
MRSI presented at the 12th China International Nanotechnology Industry Expo
The 12th China International Nanotechnology Industry Expo was held in Suzhou, Jiangsu Province from October 27th to 29th, 2021. Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI
Invitation to MRSI Webinar: MRSI is presenting at the 2022 ATC Webinar on Vehicle LIDAR Manufacturing
Abstract: on March 17th, 2022, Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., is invited to
Learn more about how MRSI solves RF PA device manufacturing challenges
MRSI’s fully automated die bonding solutions help RF power amplifier device manufacturers to address manufacturing requirements and challenges. To learn more about how MRSI’s solutions support
MRSI to exhibit at LASER World of PHOTONICS Munich
die-bonding MRSI Mycronic exhibiting at Laser World of Photonics Munich MRSI to exhibit at LASER World of PHOTONICS Munich MRSI will be exhibiting at LASER World of PHOTONICS, held at Messe
Visit MRSI at SEMICON West in San Francisco
MRSI is exhibiting at SEMICON West from December 7-9, 2021 at the Moscone Center, San Francisco, CA (Booth #1556). SEMICON West features hundreds of exhibitors, and thousands of attendees,
Bruno Afonso joins MRSI – Sales
Bruno Afonso has joined MRSI as the Sales Director, EMEA. He is located in Switzerland and earned his BA in Industrial Engineering and his Master Degree in Electrical Engineering from Universidade
Magnetic Test
Enabling the next generation of spintronic devices Magnetic Automated Test Equipment for Memory and Sensors Hprobe, part of Mycronic’s Global Technologies division, delivers advanced Magnetic
Quantum Technologies
Quantum Technologies The Future of Quantum: Powered by Photonic Integration Quantum technologies are poised to revolutionize fields like computing, communication, and sensing. However, this
Space & Defense
Space & Defense Photonic Integration Solutions for Space and Defense The evolution of Space and Defense technologies relies on advanced optical solutions for remote sensing, advanced