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Learn more about how MRSI solves RF PA device manufacturing challenges

MRSI’s fully automated die bonding solutions help RF power amplifier device manufacturers to address manufacturing requirements and challenges. To learn more about how MRSI’s solutions support

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Join MRSI at the 50th European Conference on Optical Communication

We are pleased to be exhibiting again this year at the 50th ECOC in Frankfurt am Main, Germany.

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MRSI is presenting and sponsoring the iMAPS New England 48th Symposium and Expo

The iMAPS New England Symposium and Expo will be held in Boxborough, MA on May 3rd, 2022 at the Boxboro Regency Hotel. Technical sessions include Advanced Packaging, RF& Microwave – 5G

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Join MRSI at SPIE Photonics West in San Francisco

die-bonding Join MRSI at SPIE Photonics West in San Francisco Join MRSI at SPIE Photonics West in San Francisco Meet with MRSI Systems, Mycronic Group in San Francisco Booth #5405 MRSI will be

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Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation

die-bonding Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Mycronic and General Manager

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Visit MRSI at the Compound Semiconductor Advanced Technology & Application Conference

Visit us at the CSC Conference in Suzhou, China from August 3-4th to discuss the current and future states of compound semiconductor device technology with us and other industry experts.]

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Join MRSI at SEMICON West 2022

We are excited to announce that MRSI Systems will be exhibiting at SEMICON West from July 12-14th at the Moscone Center in San Francisco! Visit us at booth #2355 to talk with us about topics such

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专访MRSI SYSTEMS周利民:MRSI-HVM-p系列贴片机助力光通讯产业高速发展

摘要:9月16-18日,CIOE 2021期间,MRSI SYSTEMS携携最新的MRSI-HVM带轨道双机头固晶机精彩亮相。在4B79展台,讯石以现场视频直播方式走进MRSI SYSTEMS展台参观了正在进行演示的产品,MRSI SYSTEMS战略营销高级总监周利民博士向观众介绍本次参展的新产品。

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Advanced Photonics Applications – MRSI-H-LD

Designed for high-volume manufacturing of advanced photonics and RF / Microwave devices the MRSI-H-LD 1.5 micron die bonder delivers industry-leading speed without sacrificing ultra-high

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MRSI to present at IFOC and Exhibit at CIOE in September in Shenzhen including live product demos

MRSI Systems will present at the 19th Infostone Optical Communications Conference(IFOC), organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from September

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MRSI-705 innovative high-volume configuration for lower cost manufacturing

5G infrastructure will require ultra-high bandwidth, latency up to 1 ms, and highly reliable connectivity. In addition, RF architectures need to be scalable, efficient, and extremely compact.

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IMAPS 2020 Virtual Exhibition

MRSI is exhibiting at the 53rd International Symposium on Microelectronics from October 6-8th, 2020. Visit the MRSI Virtual Booth to chat with our team of technical experts to review our exciting

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MRSI’s August 2020 Laser Focus World Featured Article: Assembly solution addresses TO-can photonic device manufacturing challenges

In this week’s blog post we highlight our recent Laser Focus World published article on the challenges of new TO-can photonic device manufacturing.

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Join MRSI at the International Microwave Symposium

The world’s largest Microwave and RF industry event is being held virtually this year. 

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SEMICON West 2020 Virtual Event

MRSI Systems invites you to SEMICON West 2020 Virtual Event from July 20-23, 2020.

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Join us at the upcoming events!

MRSI Mycronic will be participating in several optical and device packaging exhibitions. We invite you to attend these upcoming events. We look forward to discussing our latest product

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Meet the MRSI-705: Your Essential Tool for Precision and Reliability in Critical Applications

The MRSI-705 has established itself as a reliable tool in the aerospace, defense, and medical industries, playing a crucial role in mission-critical tasks due to its performance, adaptability,

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The High-Performance and Flexible MRSI A-L for Optical Assembly

The optical components industry demands highly precise and customized equipment for complex optical assembly processes. We have answered this need with our new active aligner - a high-performance

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MRSI-H1: Comprehensive High-Precision Die Bonding Solutions

In the fast-paced world of photonics manufacturing, having the right tools can make all the difference. The MRSI-H1 is designed to meet the demands of high-volume production with its

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MRSI shines at May events: showcased and featured

In the bustling world of technology, May was a month marked by significant events, and MRSI was at the forefront. With appearances at IMAPS New England in Boxborough, MA, and the 2024

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The Next Generation MRSI-175Ag Epoxy Dispenser is now available

die-bonding Epoxy Dispenser The Next Generation MRSI-175Ag Epoxy Dispenser is now available In the fast-paced world of advanced packaging and semiconductor manufacturing, precision and efficiency

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MRSI Mycronic to Present at the 7th Annual Automotive LIDAR Conference

MRSI Mycronic is proud to sponsor the 7th Annual Automotive LIDAR Conference, taking place online from November 20-21, 2024.

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Advanced Patented Tool Change Turret from MRSI: Revolutionizing Precision Technology

MRSI’s die bonding systems are designed to address the challenges of chip packaging with a focus on efficiency, precision, and productivity. These systems feature an advanced, patented

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Innovation Continues on MRSI-705HF

Last year, MRSI Systems launched the MRSI-705HF high force die bonder, a new version of the trusted MRSI-705 that is perfect for sintering and thermocompression bonding applications.

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Versatile package handling capabilities: dewar and beyond

die-bonding MRSI-705 with wafer, conveyor Versatile package handling capabilities: dewar and beyond In today's fast-paced production environments, efficiency and versatility are key. The MRSI-705

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MRSI at CIOE 2025: Showcasing the MRSI-LEAP Die Bonder

MRSI is pleased to announce the presentation of its latest innovation, the MRSI-LEAP Die Bonder, at the China International Optoelectronic Expo (CIOE) in Shenzhen, taking place from September 10th

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Join MRSI at the International Microwave Symposium in San Francisco

The International Microwave Symposium (IMS) is an annual conference for professionals in the microwave and RF industry.

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Dr. Limin Zhou to present at the Semiconductor Advanced Technology Innovation Development and Opportunities Conference

The rapid adoption of artificial intelligence is driving advancements in optical interconnect technology, resulting in notable improvements in speed, power efficiency, and cost reduction. This

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Learn more about our active alignment solutions

The MRSI-A-L machine is a versatile optical active alignment platform suitable for a wide range of applications, including lens, fiber and other optical components active alignment.

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Join us in Phoenix!

We are thrilled to announce our presence at SEMICON West in its dynamic new location—Phoenix, AZ. Experience firsthand the future of die bonding, active alignment, fluid and epoxy dispensing as