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pcb-assembly A strong 30-year partnership Two-in-one solution for precision and efficiency Zero downtime, 30% reduction in rework Ease of installation and programming  A technological marvel 

pcb-assembly ESCATEC in brief How ESCATEC accelerates new product cycles and boosts yields with the MY700 Design freedom at jet speed At the ESCATEC facility in Switzerland, new products are

pcb-assembly A generation of storage for factories of all shapes and sizes Meet the MYTower family Mycronic’s previous SMD Tower set the benchmark for intelligent component storage. After

pcb-assembly — a Q & A with Romain Roux and Nicolas Guillot on DeepReview and the power of AI-driven inspection The false call killer Some call it the “false call killer”: a new Automatic

pcb-assembly — empowering multi-machine programming with one dataset, one program and one workflow The power of one For years, Mycronic inspection customers have benefitted from a single

Press-fit component inspection with Mycronic 3D AOI

Mycronic’s jet printing, dispensing, coating and plasma technologies make it possible to solve any dispensing or conformal coating challenge.

Precision printing. High-speed jet printer and solder paste PCB printing, surface mount soldering dispenser for a wide range of assembly fluids.

Welcome to Mycronic Solder paste inspection Automated optical inspection PI series 3D SPI. Perfect solder joints made simple. Accurate solder paste inspection with unprecedented simplicity. I

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Protecting electronics assemblies are growing in complexity. Capability, versatility and precision are key.

Photomask equipment Photomask equipment Our photomask products Our solutions Production solutions for advanced photomasks Large area measurement meet the world's most accurate metrology system

Photomask equipment products Display mask writer Semiconductor mask writer Multi-purpose mask writer Display mask metrology system Semiconductor mask metrology system Digitalization of photomask

About us Axxon Automation Co., Ltd. Axxon, founded in 2008, is a Chinese manufacturer in the field of fluid automation, focusing on providing precision dispensing, coating, industrial dispensing

Axxon China Shenzhen, China Axxon Automation Co.,Ltd. A14, Silicon Valley Power Automotive Innovation Park 334 Guanlan Shenzhen China +86 755 8358 6066  

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Mycronic is a global high-tech company whose innovative solutions have been advancing electronics technology for over 40 years. Who are we? Mycronic is a global high-tech company whose innovative

Taking a proactive, customer-centric approach with your new colleages Taking a proactive, customer-centric approach Meet your new colleagues We always go to great lengths to ensure each customer

Student and early careers opportunities Your ideas will grow with us Student and early careers opportunities There are different ways for us to cooperate if you are a student. Thesis work We are

Mycronic Sweden HQ Mycronic headquarter in the winter Mycronic AB Nytorpsvägen 9 Box 3141 183 03 Täby Sweden +46 8 638 52 00 +46 8 638 52 90 https://goo.gl/maps/LgbBNF1avoHRiD4i6 Yes,

美国马萨诸塞州, August 14, 2017 – 全球领先的全自动、高精度、高速贴片和点胶系统制造商，MRSI Systems推出一款新型产品, MRSI-HVM3 高速贴片机，以支持光电子客户的大批量生产需求。目前，MRSI-HVM3 正在全面投产并发货至世界各地的客户。

BILLERICA, Mass., August 14, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new High Speed

MRSI系统公司（Mycronic集团）推出MRSI－H3TO新型3微米高速贴片机，这是业界第一款可以真正满足多晶片和多流程的要求，可实现行业领先的贴片速度、卓越的灵活性以及为未来产品准备的3微米贴片精度。 MRSI－H3TO专为WDM与EML－TO或其他多晶片多流程TO－can光电器件量身打造，以支持即将普及的5G无线网络。

die-bonding MRSI Systems推出用于新应用的MRSI-HVM3P新产品 MRSI Systems（Mycronic集团）8月20日在美国马萨诸塞州扩展其业界领先的MRSI－HVM3高速贴片机机平台，推出MRSI－HVM3P新款机型，为有源光缆（AOC）、管盒（Gold－box）封装 以及 基板芯片（CoC）之外 的其他应用提供优化配置。

MRSI系统公司（Mycronic集团）推出MRSI－H3LD新型3微米高速贴片机，专用于大功率半导体激光器中的芯片贴片，广泛应用于工业激光器、光纤放大、光源和传感器等先进光电子应用。

MRSI Systems（Mycronic集团）宣布在其位于深圳龙华的姐妹公司，深圳市轴心自控技术有限公司工厂建立一项新的演示能力。我们将根据客户的样品材料，安排并提供我们市场领先的MRSI－HVM3产品的本地演示以及芯片贴装应用。

BILLERICA, Massachusetts, Aug. 29, 2018 — MRSI Systems (Mycronic Group), is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer