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MRSI推出升级版MRSI-705贴片机 助力大批量制造
ICC讯 在IMAPS 2020上,MRSI Systems推出了新型5微米贴片机产品,面向量产配置的MRSI-705。MRSI-705于2012年首次推出,在贴片机行业中处于领先地位,可在一台机器上为客户提供多种应用解决方案。MRSI-705新的配置提供了创新的水平转塔功能,可以在不牺牲灵活性,准确性和可靠性的前提下,显著提高机器的速度和生产率。
MRSI to present at Automotive LIDAR 2021
MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23rd, 2021, a leading event in the
MRSI to Offer Live Die Bonding Demos at Laser World of Photonics, March 17-19, 2021
MRSI Systems (Mycronic Group) will offer live product demonstrations at Laser World of Photonics held at the Shanghai New International Expo Center (Booth #W2.2587) in Shanghai, China March
MRSI Systems and Palomar Technologies Reach Agreement in Intellectual Property Dispute
Boston, MA – December 10, 2020 – MRSI Systems, LLC and Palomar Technologies, Inc. jointly announce they have reached a confidential agreement that settles all litigation currently pending between
MRSI为5G无线网络光电器件推出新型MRSI-H3TO贴片机产品
MRSI系统公司(Mycronic集团)推出MRSI-H3TO新型3微米高速贴片机,这是业界第一款可以真正满足多晶片和多流程的要求,可实现行业领先的贴片速度、卓越的灵活性以及为未来产品准备的3微米贴片精度。 MRSI-H3TO专为WDM与EML-TO或其他多晶片多流程TO-can光电器件量身打造,以支持即将普及的5G无线网络。
MRSI Systems欢迎资深光电子专家周利民博士出任战略营销高级总监
2019年2月13日–全球领先的半导体系统设备制造商Mycronic集团的子公司,MRSI Systems今日荣幸宣布,光电子资深专家周利民博士将加入公司团队并担任战略营销高级总监,负责拓展MRSI Systems在中国的市场影响力。周博士在光电子行业拥有的丰富专业知识,以及他在中国市场的知名度将有助于推动MRSISystems市场战略布局,制定清晰的产品路线图,以及增强MRSI
MRSI Systems推出新型MRSI-H3LD高速贴片机
MRSI系统公司(Mycronic集团)推出MRSI-H3LD新型3微米高速贴片机,专用于大功率半导体激光器中的芯片贴片,广泛应用于工业激光器、光纤放大、光源和传感器等先进光电子应用。
MRSI宣布在中国深圳建立HVM3芯片贴装演示能力
MRSI Systems(Mycronic集团)宣布在其位于深圳龙华的姐妹公司,深圳市轴心自控技术有限公司工厂建立一项新的演示能力。我们将根据客户的样品材料,安排并提供我们市场领先的MRSI-HVM3产品的本地演示以及芯片贴装应用。
MRSI宣布MRSI-H / HVM系列贴片机精度提升至1.5微米
MRSI Systems(Mycronic Group)很高兴宣布公司MRSI-H / HVM系列产品线的最新进展。MRSI使用行业标准玻璃芯片参考样品测试放置精度,测试结果显示,产品精度从3Sigma的±3微米增强至±1.5微米。该产品从2019年10月1日发货开始,产品名称改为MRSI-H和MRSI-HVM(之前称为MRSI-H3和MRSI-HVM3)。
MRSI Systems Welcomes Dr. Limin Zhou as Senior Director of Strategic Marketing
MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior Director of Strategic Marketing to expand MRSI’s market presence in China. He will
MRSI to present at 18th ICCSZ OC Market and Technology Seminar and offer die bonder demonstrations at CIOE
MRSI Systems and CYCAD Century Science and Technology will partner together at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86.
MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China
STOCKHOLM, Nov 9, 2018 — MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district,
MRSI Systems Automated Microwave Hybrid Manufacturing at TESAT-Spacecom (TESAT)
TESAT’s challenge was to develop an “Automated Microwave Factory” to manufacture complex highly integrated LTCC microwave modules within the frequency range 2 to 77GHz, 24 hours per day including
MRSI Systems, Mycronic Group announces a new collaboration to provide LiDAR solutions for the Automotive Industry
MRSI Systems is delighted to announce a new collaboration with Lumentum Operations LLC ("Lumentum", NASDAQ: LITE), a leading global photonic chip and module supplier for the automotive LiDAR
MRSI Mycronic announces advanced high-speed 1µm die bonder MRSI-LEAP for ultra-high-volume manufacturing of AI optical module applications
MRSI Mycronic is proud to announce the launch of the MRSI-LEAP high-speed 1µm die bonder. This innovative equipment is designed for ultra-high-volume manufacturing of optical modules,
MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder
MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the
MRSI Mycronic to showcase high-speed assembly solutions at CIOE 2025
die-bonding MRSI Mycronic CIOE Booth 2025 MRSI Mycronic to showcase high-speed assembly solutions at CIOE 2025 MRSI Mycronic, part of the Mycronic Group, will present advanced assembly solutions
MRSI introduces innovative MRSI-A-L Active Aligner for optical packaging solutions
MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, proudly introduces the MRSI-A-L
MRSI launches new Die Bonder with improved throughput for high power laser manufacturers
MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful
MRSI introduces 705HF High Force Die Bonder for power devices and advanced chip packaging
MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high
MRSI Mycronic to showcase and present innovative die bonder solutions at CIOE 2023
die-bonding CIOE 2023 MRSI Booth MRSI Mycronic to showcase and present innovative die bonder solutions at CIOE 2023 MRSI, a part of Mycronic Group, will exhibit our family of die bonders and
MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Expo
die-bonding MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Expo We are proud to announce that MRSI, Mycronic Group will be exhibiting at the 24th
专访MRSI SYSTEMS周利民:MRSI-HVM-p系列贴片机助力光通讯产业高速发展
摘要:9月16-18日,CIOE 2021期间,MRSI SYSTEMS携携最新的MRSI-HVM带轨道双机头固晶机精彩亮相。在4B79展台,讯石以现场视频直播方式走进MRSI SYSTEMS展台参观了正在进行演示的产品,MRSI SYSTEMS战略营销高级总监周利民博士向观众介绍本次参展的新产品。
MRSI to present at Automotive LIDAR 2021
MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23rd, 2021. MRSI is presenting on Wednesday,
MRSI to present at IFOC and Exhibit at CIOE in September in Shenzhen including live product demos
MRSI Systems will present at the 19th Infostone Optical Communications Conference(IFOC), organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from September
MRSI-705 innovative high-volume configuration for lower cost manufacturing
5G infrastructure will require ultra-high bandwidth, latency up to 1 ms, and highly reliable connectivity. In addition, RF architectures need to be scalable, efficient, and extremely compact.
MRSI Systems受邀出席光收发器和硅基光电子论坛
摘要:MRSI Systems战略市场高级总监,周利民博士受邀参加光收发器和硅基光电子论坛并将带来主题为“光收发器和硅基光电子量产的挑战及解决方案”的演讲。
IMAPS 2020 Virtual Exhibition
MRSI is exhibiting at the 53rd International Symposium on Microelectronics from October 6-8th, 2020. Visit the MRSI Virtual Booth to chat with our team of technical experts to review our exciting
MRSI’s August 2020 Laser Focus World Featured Article: Assembly solution addresses TO-can photonic device manufacturing challenges
In this week’s blog post we highlight our recent Laser Focus World published article on the challenges of new TO-can photonic device manufacturing.
Irving Wang joins MRSI – Product Marketing
Irving Wang joined MRSI this year as the Director of Product Marketing. He is based in the US to spearhead MRSI’s push into the sub-micron market and to support our newly launched MRSI-S-HVM