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Service & support
MYCare Services Superior service for superior performance Service & support Our MYCare service offering for our advanced Pattern Generators is a key part of our commitment to our customers.
Meet your new colleagues
Taking a proactive, customer-centric approach with your new colleages Taking a proactive, customer-centric approach Meet your new colleagues We always go to great lengths to ensure each customer
Student opportunities
Student and early careers opportunities Your ideas will grow with us Student and early careers opportunities There are different ways for us to cooperate if you are a student. Thesis work We are
Mycronic Sweden HQ
Mycronic Sweden HQ Mycronic headquarter in the winter Mycronic AB Nytorpsvägen 9 Box 3141 183 03 Täby Sweden +46 8 638 52 00 +46 8 638 52 90 https://goo.gl/maps/LgbBNF1avoHRiD4i6 Yes,
Who are we?
Mycronic is a global high-tech company whose innovative solutions have been advancing electronics technology for over 40 years. Who are we? Mycronic is a global high-tech company whose innovative
How Does MRSI Systems Manufacture to Customer’s Specification?
MRSI Systems thinks from the customer’s perspective and upholds strict protocols to ensure your desired configuration, has been built to proper specification. MRSI’s core value of acting like an
MRSI to present at the 21st Infostone Optical Communication Market and Technology Conference
MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September
MRSI-H-HPLD 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”
MRSI Systems wins 2022 Infostone award for outstanding technology for their world-renowned die bonder!
Software Video Training Programs for Die Bonding and Epoxy Dispense Systems
These videos help you to discover advanced features of our MRSI machines, which will ensure your production line is optimized.
Join MRSI at the 50th European Conference on Optical Communication
We are pleased to be exhibiting again this year at the 50th ECOC in Frankfurt am Main, Germany.
Die bonding solution for Chip-on-Submount (CoS) – Excerpt from our LFW article
Excerpt from MRSI’s recent article emphasizes the CoS die bonding process requirements including geometric placement accuracy & void free eutectic bonding.
Join MRSI at SPIE Photonics West in San Francisco
die-bonding Join MRSI at SPIE Photonics West in San Francisco Join MRSI at SPIE Photonics West in San Francisco Meet with MRSI Systems, Mycronic Group in San Francisco Booth #5405 MRSI will be
Experience MRSI’s latest innovations at the OFC Exhibition
MRSI will be a featured exhibitor at the OFC Exhibition. The OFC Exhibition is a unique and premium opportunity to immerse yourself into the photonics industry.
Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation
die-bonding Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Mycronic and General Manager
MRSI to present and attend Auto Lidar Tech 2023
MRSI will attend the 5th Auto Lidar Tech Forum from Jun 5-7th in Suzhou, China. This event will focus on the market trends, technological breakthroughs, and practical applications of LIDAR
Invitation to MRSI Webinar: MRSI is presenting at the 2022 ATC Webinar on Vehicle LIDAR Manufacturing
Abstract: on March 17th, 2022, Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., is invited to
MRSI will be attending and sponsoring IMAPS Boston 2022
MRSI Systems, Mycronic Group will be exhibiting at the 55th International Symposium on Microelectronics from October 4-5th in Boston Massachusetts at the Hynes Convention Center.
Die Bonding Process Pages – Highlights
Various die bonding approaches have been, and still are, developed to meet the ever-evolving product requirements.
Learn more about how MRSI solves RF PA device manufacturing challenges
MRSI’s fully automated die bonding solutions help RF power amplifier device manufacturers to address manufacturing requirements and challenges. To learn more about how MRSI’s solutions support
MRSI to exhibit at LASER World of PHOTONICS Munich
die-bonding MRSI Mycronic exhibiting at Laser World of Photonics Munich MRSI to exhibit at LASER World of PHOTONICS Munich MRSI will be exhibiting at LASER World of PHOTONICS, held at Messe
MRSI is presenting and sponsoring the iMAPS New England 48th Symposium and Expo
The iMAPS New England Symposium and Expo will be held in Boxborough, MA on May 3rd, 2022 at the Boxboro Regency Hotel. Technical sessions include Advanced Packaging, RF& Microwave – 5G
Visit MRSI at SEMICON West in San Francisco
MRSI is exhibiting at SEMICON West from December 7-9, 2021 at the Moscone Center, San Francisco, CA (Booth #1556). SEMICON West features hundreds of exhibitors, and thousands of attendees,
Visit MRSI at the Compound Semiconductor Advanced Technology & Application Conference
Visit us at the CSC Conference in Suzhou, China from August 3-4th to discuss the current and future states of compound semiconductor device technology with us and other industry experts.]
Bruno Afonso joins MRSI – Sales
Bruno Afonso has joined MRSI as the Sales Director, EMEA. He is located in Switzerland and earned his BA in Industrial Engineering and his Master Degree in Electrical Engineering from Universidade
Join MRSI at SEMICON West 2022
We are excited to announce that MRSI Systems will be exhibiting at SEMICON West from July 12-14th at the Moscone Center in San Francisco! Visit us at booth #2355 to talk with us about topics such
Newsletters archive
Find and download archives of the MRSI Newsletter. Find great stories, articles and more or catch up on previous articles.
Magnetic Test
Enabling the next generation of spintronic devices Magnetic Automated Test Equipment for Memory and Sensors Hprobe, part of Mycronic’s Global Technologies division, delivers advanced Magnetic
MRSI Systems Automated Microwave Hybrid Manufacturing at TESAT-Spacecom (TESAT)
TESAT’s challenge was to develop an “Automated Microwave Factory” to manufacture complex highly integrated LTCC microwave modules within the frequency range 2 to 77GHz, 24 hours per day including
Die Bonder
Choosing a die bonder is important, and we advise considering all options before making a purchase. With MRSI Systems, you can find exactly what you need.
Cases
Automated processes help clients grow