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Upcoming Events Past Events
11月20日 - 11月21日
Online

Automotive LIDAR 2024

7th Annual Conference and Exhibition. MRSI Mycronic will be presenting.
Die bonding
United States of America
English
1月21日, 2025 - 1月23日, 2025
Santa Clara, CA USA

Chiplet Summit 2025

MRSI Mycronic is sponsoring the Chiplet Summit at the Santa Clara Convention Center. Booth #314
Die bonding
United States of America
English
1月28日, 2025 - 1月30日, 2025
San Francisco, CA USA

SPIE Photonics West 2025

Photonics West is the world’s premier event for lasers, biomedical optics, biophotonics, quantum, and optoelectronics. Booth: #5407
Die bonding
United States of America
English
2月26日, 2025 - 2月28日, 2025
Marina Bay Sands Singapore

Asia Photonics Expo 2025

MRSI Mycronic will exhibit at the Asia Photonics Expo 2025.
Die bonding
Singapore
English
3月3日, 2025 - 3月6日, 2025
Phoeniz, AZ, USA

IMAPS Device Packaging Conference 2025

The 21st Annual Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6, 2025.
Die bonding
United States of America
English
3月11日, 2025 - 3月13日, 2025
Shanghai New International Expo Centre (SNIEC)

LASER World of PHOTONICS CHINA 2025

Asia’s largest trade fair for the photonics industry in Shanghai New International Expo Centre (SNIEC). Booth #N1.1202.
Die bonding
China
Chinese
4月1日, 2025 - 4月3日, 2025
San Francisco, CA USA

OFC 2025

OFC is the world's largest event for optical networking and communications. MRSI Mycronic Booth: #3218
Die bonding
United States of America
English
5月6日, 2025
Boxborough, MA, USA

IMAPS New England 2025

International Microelectronics Assembly and Packaging Society (IMAPS) New England 51st Symposium & Expo.
Die bonding
United States of America
English
6月17日, 2025 - 6月19日, 2025
San Francisco, CA

IMS - International Microwave Symposium 2025

IMS is focused on the microwave industry. MRSI Booth: #1629
Die bonding
United States of America
English
6月18日, 2025 - 6月21日, 2025
Bangkok, Thailand

Nepcon Thailand 2025

MRSI Mycronic will exhibit at Nepcon Thailand 2025.
Die bonding
Singapore
English
9月10日, 2025 - 9月12日, 2025
Shenzhen, China

CIOE – China International Optoelectronic Expo 2025

CIOE is the world’s largest optoelectronics event. Location: Shenzhen World Convention & Exhibition Center Shenzhen, China.
Die bonding
China
English
9月29日, 2025 - 10月1日, 2025
Copenhagen, Denmark

ECOC 2025

The ECOC Exhibition is the key meeting place for everyone in the fibre optic communication technology industry. Booth: #C4315
Die bonding
Denmark
English
10月7日, 2025 - 10月9日, 2025
Phoeniz, AZ USA

SEMICON West 2025

SEMICON West includes the extended microelectronics industry supply chain. Booth: #6268
Die bonding
United States of America
English