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Under the MRSI brand, we offer industry-leading die bonders, with superior flexibility, ultra-high-accuracy, and multiple process options. Our product’s' value is further illustrated by our 40+ years of experience in the industry in tandem with our 24/7 reliable field operations.
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History
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Why do customer's choose MRSI?
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High precision flip-chip die bonders
Submicron Die Bonders
1 micron die bonders
1.5 micron die bonders
3 Micron Die Bonders
5 micron die bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners
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Prototyping
MRSI Systems Training Services
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MRSI values our customers, and our top priority is meeting our customers needs down to the finest detail. We are proud that all of our products are industry-leading, with superior flexibility, ultra-high-accuracy, and multiple process options.
Visit page Products
High precision flip-chip die bonders
Submicron Die Bonders
1 micron die bonders
1.5 micron die bonders
3 Micron Die Bonders
5 micron die bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners
Prototyping and training services
Prototyping
MRSI Systems Training Services
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Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
TO-TOSA/ROSA
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Wafer Level Packaging
Applications
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Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
TO-TOSA/ROSA
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Wafer Level Packaging
Processes
Die bonding
Eutectic die bonding
Epoxy die bonding
Processes
Visit page Processes
Die bonding
Eutectic die bonding
Epoxy die bonding
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MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
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Visit our contact page for contact details for our sales and support departments.
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MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Mycronic Global
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News & events
Events
Upcoming Events
Past Events
1月21日, 2025 - 1月23日, 2025
Santa Clara, CA USA
Chiplet Summit 2025
MRSI Mycronic is sponsoring the Chiplet Summit at the Santa Clara Convention Center. Booth #314
Die bonding
United States of America
English
1月28日, 2025 - 1月30日, 2025
San Francisco, CA USA
SPIE Photonics West 2025
Photonics West is the world’s premier event for lasers, biomedical optics, biophotonics, quantum, and optoelectronics. Booth: #5407
Die bonding
United States of America
English
2月26日, 2025 - 2月28日, 2025
Marina Bay Sands Singapore
Asia Photonics Expo 2025
MRSI Mycronic will exhibit at the Asia Photonics Expo 2025. Stand No.: B111
Die bonding
Singapore
English
3月3日, 2025 - 3月6日, 2025
Phoeniz, AZ, USA
IMAPS Device Packaging Conference 2025
The 21st Annual Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6, 2025.
Die bonding
United States of America
English
3月11日, 2025 - 3月13日, 2025
Shanghai New International Expo Centre (SNIEC)
LASER World of PHOTONICS CHINA 2025
Asia’s largest trade fair for the photonics industry in Shanghai New International Expo Centre (SNIEC). Booth #N1.1202.
Die bonding
China
Chinese
3月18日, 2025 - 3月19日, 2025
Pasadena, CA, USA
GOMACTech 2025
Annual Government Microcircuit Applications & Critical Technology Conference (GOMACTech)
Die bonding
United States of America
English
3月31日, 2025
San Francisco, CA USA
Optica Executive Forum at OFC 2025
MRSI Mycronic is sponsoring the Optica Executive Forum at OFC 2025.
Die bonding
United States of America
English
4月1日, 2025 - 4月3日, 2025
San Francisco, CA USA
OFC 2025
OFC is the world's largest event for optical networking and communications. MRSI Mycronic Booth: #3218
Die bonding
United States of America
English
5月6日, 2025
Boxborough, MA, USA
IMAPS New England 2025
International Microelectronics Assembly and Packaging Society (IMAPS) New England 51st Symposium & Expo.
Die bonding
United States of America
English
6月17日, 2025 - 6月19日, 2025
San Francisco, CA
IMS - International Microwave Symposium 2025
IMS is focused on the microwave industry. MRSI Booth: #1629
Die bonding
United States of America
English
6月18日, 2025 - 6月21日, 2025
Bangkok, Thailand
Nepcon Thailand 2025
MRSI Mycronic will exhibit at Nepcon Thailand 2025.
Die bonding
Singapore
English
9月10日, 2025 - 9月12日, 2025
Shenzhen, China
CIOE – China International Optoelectronic Expo 2025
CIOE is the world’s largest optoelectronics event. Location: Shenzhen World Convention & Exhibition Center Shenzhen, China.
Die bonding
China
English
9月29日, 2025 - 10月1日, 2025
Copenhagen, Denmark
ECOC 2025
The ECOC Exhibition is the key meeting place for everyone in the fibre optic communication technology industry. Booth: #C4315
Die bonding
Denmark
English
10月7日, 2025 - 10月9日, 2025
Phoeniz, AZ USA
SEMICON West 2025
SEMICON West includes the extended microelectronics industry supply chain. Booth: #6268
Die bonding
United States of America
English
2024/12/21 16:33:37