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Under the MRSI brand, we offer industry-leading die bonders, with superior flexibility, ultra-high-accuracy, and multiple process options. Our product’s' value is further illustrated by our 40+ years of experience in the industry in tandem with our 24/7 reliable field operations.
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History
Why do customer's choose MRSI?
Partners
Testimonials
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High precision flip-chip die bonders
Submicron Die Bonders
1 micron die bonders
1.5 micron die bonders
3 Micron Die Bonders
5 micron die bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners
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Prototyping
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MRSI values our customers, and our top priority is meeting our customers needs down to the finest detail. We are proud that all of our products are industry-leading, with superior flexibility, ultra-high-accuracy, and multiple process options.
Visit page Products
High precision flip-chip die bonders
Submicron Die Bonders
1 micron die bonders
1.5 micron die bonders
3 Micron Die Bonders
5 micron die bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners
Prototyping and training services
Prototyping
MRSI Systems Training Services
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Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
Silicon Photonics
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
Applications
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Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
Silicon Photonics
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics
Sensors
LIDAR, AR/VR/MR
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Die bonding
Eutectic die bonding
Epoxy die bonding
Processes
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Die bonding
Eutectic die bonding
Epoxy die bonding
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MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
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Visit our contact page for contact details for our sales and support departments.
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MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Mycronic Global
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News & events
Events
1月21日, 2025 - 1月23日, 2025
Santa Clara, CA USA
United States of America
English
Chiplet Summit 2025
MRSI Mycronic is sponsoring the Chiplet Summit at the Santa Clara Convention Center.
Learn more
2024/10/28 10:20:46
