Automated Die Bonding for High Volume Optoelectronics Packaging

MRSI Systems exhibited at iMAPS NE in May. Dr. Yi Qian, our VP of Product Management organized and chaired a technical session on “Nanoelectronics and Optoelectronics.” The topics were quite broad from silicon photonics to sensors, high power diode lasers, PV, and sensors and automation. The 1st three talks were focused on technology and devices and the last three on packaging and manufacturing. The speakers were from academics (AIM Photonics, MIT, and UMass Lowell) and industry (Forward Photonics, Analog Devices and MRSI Systems).  Peter Cronin, our Director of Applications and Customer Services, presented his paper on Automated Die Bonding for High Volume Optoelectronics Manufacturing: Speed, Accuracy, and Flexibility in the session. The day was chaired by Jon Medernach, MRSI’s US East Regional Sales Manager and the President of iMAPS New England Chapter. Delegates feedback confirmed that it was a productive and insightful event.

Challenge

As the Optoelectronics market is strong and growing, the technical requirements increase the challenges for manufacturers. Flexibility and speed are key to keep up with fast product lifetimes and so equipment solutions must be accurate, fast, and flexible. These equipment solutions must be designed for optoelectronics and have the ability to handle multiple types of parts on a single machine. Typical applications include Chip on Submount (CoS), Gold packages, and TO’s.

Also, the ability to handle multiple process methods, such as eutectic bonding and epoxy dispensing is essential. Optoelectronics packaging manufacturers are looking for a multi-chip processing solution which can be supported by one machine, that can easily switch functions and serve multiple product lines during the same day. The flexibility required by these manufacturers needs to be delivered by an all-in-one machine.

Solution

MRSI can solve this problem.  MRSI Systems acts as a partner with a strong background in applications support for optoelectronics. Optoelectronics manufacturers can save money by utilizing MRSI die bonders, which are able to switch from one type of production to another easily and efficiently due to its high flexibility.

For example, multiple eutectic bonding stages help to solve this challenge with one eutectic stage for Chip on Submount and a second eutectic stage for Gold packages, which have different masses.  Another option is a separate tray for epoxy dispensing applications. Contact MRSI Systems to learn more about our solutions to optoelectronics packaging challenges.