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Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors

Electronic components and packages continue the trend of miniaturization which drives demand for cost-effective assembly solutions for smaller components and packages. This is happening in end markets in Telecom/Datacom, Aerospace & Defense, Medical Devices, Computers and Peripherals, and Industrial.

4 6月 2019
21:00
NEWS
DIE BONDING SOLUTIONS
Tape Feeders

Moore’s Law is the observation made by Intel co-founder Gordon Moore that the number of transistors on a chip doubles every 18 months. As with transistors, the volumetric efficiency of multilayer chip capacitors (MLCC) continues to make dramatic improvements. Volumetric efficiency of capacitors is a measure of the performance of electronic function per unit volume. For capacitors, the volumetric efficiency is denoted by the “CV product.” CV is the product of the capacitance (C) and maximum voltage rating (V) and divided by the volume. As shown in the following graph, volumetric efficiencies have improved dramatically for MLCC. The result is increased use of ultraminiature capacitors.

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