iMAPS New England 44th Symposium and Expo: “The Jetsons 2017”

25 4月 2017, 21:00

NEWS

DIE BONDING SOLUTIONS

The International Microelectronics Assembly and Packaging Society New England Chapter’s Symposium will be held in Boxborough, MA on May 2nd, 2017. The keynote address – “From Interconnect to Innovation in the DoD” will be presented by Dr. Livia Racz from MIT Lincoln Laboratory.

MRSI Systems is a GOLD sponsor of the iMAPS NE Symposium. Dr. Yi Qian, VP of Product Management, MRSI Systems is chairing a technical session “Nanoelectronics and Optoelectronics.” Presenting papers are tenured professors from MIT and UMass, and Peter Cronin, Director of Applications and Service, MRSI Systems.

Other technical sessions include: MEMS, RF & Microwave Innovations, Emerging Technologies, Medical Device Packaging, Thermal Management, and Printed Electronics. For more information: iMAPS New England

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