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29 4月 2020, 21:00
NEWS
DIE BONDING SOLUTIONS

MRSI will exhibit at LASER World of PHOTONICS CHINA 2020 from July 3-5, 2020 in Hall 8, Booth #8.1E416 of the National Exhibition and Convention Center (NECC), in Shanghai, China. There will be over 1,000 exhibitors representing the leading companies active in laser, optics, and photonics industries. The exhibition encompasses the world’s top laser and photonics technologies, as well as state-of-the-art products.

LASER World of PHOTONICS CHINA 2020 was postponed from March to July due to COVID-19. Messe München Shanghai is following the directives of the Government of Shanghai Municipality. (Source LASER World of PHOTONICS CHINA). MRSI will be adhering to strict health and safety guidelines while attending the show including relevant protocols at our booth.

Contact MRSI to receive a visitor badge and schedule a meeting at the show to learn about our assembly solutions for advanced photonics.

Advanced Photonics Applications – MRSI-H-LD

MRSI will be demonstrating the MRSI-H-LD 1.5 micron die bonder at LASER World of PHOTONICS CHINA 2020. This machine is designed for high-volume manufacturing of advanced photonics devices, delivers industry-leading speed without sacrificing ultra-high precision and superior flexibility. These compelling value propositions ensure the Return on Investment is the best in the industry.

The system is capable of building of Chip-on-Carrier (CoC), Chip-on-Submount (CoS), Chip-on-Baseplate (CoB), passive lens attachment, and box packaging for customer’s products such as high-power laser diodes (HPLDs), AOC and other optical communication components, photonics sensors and silicon photonics components,  as well as RF power amplifiers and Microwave devices.

MRSI-H-LD can be configured to achieve eutectic, epoxy and UV application within one machine. The pick-and-place head is configured with a built-in heated head enables high-accuracy for advanced high-density product packaging applications is an additional configuration. Other configurable options include wafer input, conveyor, and load/unload units for higher volume production to increase throughput. The machine in-line function can achieve fully automatic production for our customers.

Contact MRSI to schedule a demonstration or learn more about our assembly solutions for advanced photonics applications.