MRSI Systems Integrates In Situ Light Measurement for AOC into Die Bonder
BILLERICA, MA — April 22, 2015 — MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, has integrated in situ light measurement for Active Optical Cable (AOC) into the MRSI-M3 Ultra Precision Assembly Work Cell.
The overall process begins with the placement of the die on an AOC board. For a board which contains an optical transmitter and receiver this would normally consist of a laser diode array, photo detector array, TIA and a driver chip. The MRSI-M3 Ultra Precision Assembly Work Cell dispensers conductive epoxy, perform vision alignment and then places the devices with 3 micron or better placement accuracy.
Following thermal curing and wire bonding the MRSI-M3 dispenses UV and thermal cure epoxy, performs vision alignment and then places the lens. While holding the lens in place the system measures the light output from the pre-characterized device. This measurement process can be done post UV and thermal cure to characterize any shift due to epoxy curing.
About MRSI Systems
MRSI was founded in Massachusetts in 1984 with the goal of providing automated solutions for dispense and assembly of microelectronic devices. The company is primarily focused on servicing the hybrid microelectronics industry through the design and manufacturing of precision die bonding and dispensing equipment including fully automated, ultra-high precision die attach and epoxy dispensing tools used for the fabrication of complex micro-assemblies in a variety of end markets, such as Telecom/Datacom, Aerospace & Defense, Health and Life Sciences and Industrial. Headquartered in Billerica, Mass., MRSI maintains a global network of direct service and support professionals located in the Netherlands, China, Singapore, Korea, the Philippines and the United States.
Dan Crowley
Vice President of Sales
MRSI Systems
Visit www.mrsisystems.com