MRSI Systems is Exhibiting and Sponsoring SPIE Photonics West 2019

MRSI is proud to sponsor SPIE Photonics West this year because it is the premier conference and exhibition for the industries MRSI serves including Photonics, Advanced Photonics, Telecom/Datacom, Aerospace & Defense, Medical Devices, Computers and Peripherals, and Industrial. Meet with MRSI Systems in San Francisco Booth #4320. Technical presentations will cover the latest trends and technology including:

• AR, VR, and MR 2019 Industry
• Market Update: Size of the Optics and Photonics Market along with Enabled Markets
• Silicon Photonics and Photonic Integrated Circuits: an Industry Perspective

SPIE Photonics West offers you the chance to meet with our representatives, learn about our products, and get answers to all of your questions.

SPIE Photonics West 2019 Exhibition Hours
Moscone Convention Center
San Francisco, California, USA

Tuesday 5 February               10:00 am to 5:00 pm
Wednesday 6 February           10:00 am to 5:00 pm
Thursday 7 February              10:00 am to 4:00 pm

Register to attend this free exhibition

Read more about SPIE Photonics West 2019

Contact MRSI Systems

Please contact MRSI to discuss your application requirements. We hope to see you at the SPIE Photonics exhibition in San Francisco, CA. If you are unable to attend the exhibition please contact us to schedule a meeting at the MRSI Systems’ factory in Billerica, MA. Learn about the upcoming events MRSI Systems will be attending.

MRSI Systems – “One Stop Shop” Die Bonding Solutions

MRSI’s “One Stop Shop” solutions will help our customers to enable just-in-time supply and fast-pace innovations of critical photonic components for high growth market segments, such as hyper-scale data centers, photonic sensors, and 5G wireless. Our die bonders are historically regarded the leaders in flexibility and we have expanded our solutions with additional configurations. These products provide superior flexibility for true multi-die, multi-process, multi-product high volume high mix production. These high speed products deliver the industry-leading speed without sacrificing flexibility, precision or reliability. The ultra-fast MRSI-HVM3 and MRSI-H3 can meet high volume requirements for all key die bonding applications in photonics manufacturing with superior flexibility for multi-die, multi-process, and multi-product through one machine.

The MRSI-H3LD which is optimized for bonding large dies for high power diode lasers, that are used in advanced photonics such as industrial lasers, optical fiber amplifications, lighting, and sensors. The MRSI-H3LD die bonder carries key technological building blocks from our field proven flexible high speed MRSI-HVM3 platform for industry leading throughput, superior flexibility, and future-proven 3 micron placement accuracy. It enables our high power diode laser and other photonics customers to scale up their business. Schedule a meeting with MRSI at Photonics West to learn more about our photonics packaging solutions.

We look forward to seeing you in San Francisco!