MRSI to exhibit at LASER World of PHOTONICS Munich

Learn more about the show.

Visit MRSI in Hall B5 Booth #438 to learn more about our die bonding solutions for photonics packaging. We offer high speed flexible automated systems covering all major markets and applications from R&D to high volume manufacturing. Let’s discuss your challenges getting products to market and how we have helped many customers scale their production.

Advanced optoelectronic components and modules are experiencing record demand driven by the rapid growth in cloud computing, data transfer and storage, and the adoption of the internet-of-things. The high power requirements, small component sizes, and elimination of materials which can outgas result in the need to attach many optoelectronic components with the eutectic die bonding process. Eutectic bonding is the process of using a solder alloy as a third material to form a continuous bond between two components. For over 35 years MRSI has developed a family of high precision eutectic die bonders for high volume manufacturing of photonics packaging.

Contact us to schedule a meeting at the show.

About MRSI Systems

MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com