MRSI to Sponsor and Exhibit at the International Microelectronics Assembly and Packaging Society (IMAPS) Symposium
MRSI (Mycronic Group) is exhibiting at the 54th International Symposium on Microelectronics from October 11-14, 2021, in San Diego, California at the Town and Country Resort.
There will be over 75 booths on the exhibition floor from October 12-13, 2021, with companies from all segments of the microelectronics industry including Aerospace, Automotive, Computing, Industrial, Military, and Telecom/Datacom. Stop by the MRSI Systems’ Booth (#319) to learn about our latest product innovations.
MRSI Systems Sponsors IMAPS
MRSI Systems has been a member and proud supporter of IMAPS for more than 35 years and is pleased to be the Tech-Internet Sponsor of the 2021 IMAPS Symposium. Learn more about IMAPS San Diego.
2021 IMAPS Symposium Keynote Presentations
The highlights of this year’s IMAPS Symposium are presentations on the following topics-
- Packaging Technologies for Integrated Photonics
- Advanced Packaging is the Future of the Semiconductor Industry
- Next Generation Advanced Packaging and Thermo-Mechanical Considerations to Maximize Si Performance
See the IMAPS 2021 Technical Program for more details.
Our Credentials in Microwave & RF
Many of MRSI’s long-standing customers are Microwave & RF leading component manufacturers. From Transmitter and Receiver Modules to Power Amplifiers, MRSI has been the platform of choice for these manufacturers. MRSI Systems leadership in eutectic bonding solutions for the Microwave & RF industries and in particular devices such as high-power amplifiers is based on several key outcomes required from customers.
Firstly, manufacturers require a very reliable means of attachment for these devices, secondly a high degree of precision is essential, thirdly they require any system to handle a wide variety of pickup tools, collets, and parts and finally to achieve the necessary volumes, these die bonding systems need to be fully automated.
Automation: To automate this process, the package or substrate must be presented on or moved to a surface that can be thermally controlled. The die bonder moves the solder preform and die to the substrate and ramps the temperature to achieve reflow. Ideally, temperature ramp is performed quickly for throughput and quality issues. The process must occur in an inert environment to avoid oxidation. Good coverage is obtained (no voiding) when the system can be programmed to scrub the die into the molten solder.
Reliability and Precision: Leading manufacturers of high-frequency radio modules require fully automated, ultra-precision die bonding systems with in-situ capabilities such as epoxy dispensing and eutectic die bonding. Advanced imaging techniques using pattern recognition are needed to orient components. The ability to monitor and control force during die placement for consistent bond line thickness is a critical parameter for RF/ Microwave device assembly. MRSI products are unsurpassed in this important process parameter.
A requirement may exist to align a die to a feature in one axis, such as a die edge to a substrate edge, while also aligning to another feature in another axis, such as a die bond pad to a substrate bond pad. This is known as ‘split alignments’ and is required for some microwave and photonic applications.
In advanced packaging applications die need to be placed with a high degree of precision. Frequently for performance purposes, the die must be placed with a particular accuracy relative to other devices, fiducials, or features. MRSI’s die bonders are designed to handle a wide range of processes. Epoxy dispensing pumps, epoxy stamping and eutectic bonding with scrub and temperature control, are all configuration options that make MRSI’s die bonders the leading solution for MEMS device assembly.
We look forward to discussing your assembly challenges and how MRSI continues to develop innovative die bonding and dispensing solutions to meet our customer’s needs. MRSI Systems has been serving optoelectronic and microelectronic customers for over 35 years and understands their requirement to scale efficiently in today’s fast-paced marketplace. Contact sales.mrsi@mycronic.com to schedule a meeting during the show.
Contact MRSI Systems to learn about our die bonding and epoxy die attach solutions.