Visit MRSI Systems at the European Conference on Optical Communications (ECOC) 2018 – Fully Automated Die Bonders

Visit MRSI Systems’ Booth (#577) to learn about our new die bonder product launches. Firstly, the company has expanded its successful HVM3 platform launched last year, with more configurations for AOC and Gold-box packaging. Secondly, it has launched a new product family, MRSI-H3 targeted to meet the manufacturing challenges driven by 5G wireless network roll out and the desire for ever increasing bandwidth. Two specialized configurations are launched – the MRSI-H3TO and MRSI-H3LD targeted at WDM/EML-TO and high power laser assembly applications. Request a meeting with MRSI during ECOC.

We’ve summarized below the headlines from the press releases concerning our product launches:

MRSI-HVM3 – High Volume Die Bonder Family Expansion

MRSI Systems is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer configurations for active optical cable (AOC), gold-box packaging, and other applications in addition to chip-on-carrier (CoC). This expansion is in response to our customer’s request to take advantage of the field-proven performance of the flexible high speed MRSI-HVM3 platform, for their other essential packaging applications in photonics manufacturing which are high volume and high mix by nature.

The new MRSI-HVM3P is the first major extension to the HVM3 family, equipped with inline conveyor for single fixture or multiple cassette inputs that can automatically transport large forms of carriers of the dies. This configuration is targeted at AOC or similar die-to-printed circuit board (PCB) applications, gold-box packaging, and CoC in fixture. The processes include eutectic, epoxy stamping, UV epoxy dispensing, and in-situ UV curing.

The biggest challenge facing photonics manufacturing is how to handle high volume and high mix production. To solve this problem requires flexible high speed automation.

MRSI-H3 – New Product Family Launched

MRSI Systems has launched a new product family, MRSI-H3 targeted to meet the manufacturing challenges driven by 5G wireless network roll out and the desire for ever increasing bandwidth. Initially, two specialized configurations are launched – the MRSI-H3TO and MRSI-H3LD targeted at WDM/EML-TO and high power laser assembly applications.

The MRSI-H3TO is tailored for WDM/EML-TO or other multi-die multi-processing TO-can photonic devices to support the upcoming 5G wireless network. It enables our photonics customers to meet their manufacturing challenges, by allowing them to stay competitive in this high volume and high mix production environment.

High power diode lasers are critical components for multiple markets and have seen a significant, continual rise in adoption with the explosion in new applications. The new MRSI-H3LD is equipped for speed with “on-the-fly” auto tool changer integrated on the bonding head, for zero time tool change-over with ultrafast-ramp eutectic station for reduced cycle time. Combining both of these features, MRSI-H3LD demonstrates the highest throughput in the industry for the high power diode laser die bonding.

Fully Automated Die Bonding Solutions – One Stop Shop

With the addition of these new products, MRSI is now offering solutions to the spectrum of volume and application challenges of our customers delivering, “One Stop Shop” die bonding solutions for the market. Our die bonders are historically regarded as the leaders in flexibility, and during the year we have expanded this product family with additional configurations. These products provide superior flexibility for true multi-die, multi-process, multi-product high volume high mix production. These high speed products deliver the industry-leading speed without sacrificing flexibility, precision or reliability.

With our “One Stop Shop” solutions, we can meet whatever volume our customers face:

• The ultra-flexible MRSI-705 and MRSI-M3 can be used for research and development prototyping to low/medium volume.
• The ultra-fast MRSI-HVM3 and MRSI-H3 can meet high volume requirements for all key die bonding applications in photonics manufacturing with superior flexibility for multi-dies, multi-process, and multi-products through one machine.
• Finally, our ultra-fast product families deliver <3 micron placement accuracy for next generation products.

 About MRSI Systems

MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products.  With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on- carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com.

Please contact MRSI to learn about our die bonders and epoxy dispensers. We hope to see you at the exhibition.